- •Features
- •Pin Configurations
- •Disclaimer
- •Overview
- •Block Diagram
- •Pin Descriptions
- •Port A (PA7..PA0)
- •Port B (PB7..PB0)
- •Port C (PC7..PC0)
- •Port D (PD7..PD0)
- •RESET
- •XTAL1
- •XTAL2
- •AVCC
- •AREF
- •AVR CPU Core
- •Introduction
- •Architectural Overview
- •Status Register
- •Stack Pointer
- •Interrupt Response Time
- •SRAM Data Memory
- •Data Memory Access Times
- •EEPROM Data Memory
- •EEPROM Read/Write Access
- •I/O Memory
- •Clock Systems and their Distribution
- •CPU Clock – clkCPU
- •I/O Clock – clkI/O
- •Flash Clock – clkFLASH
- •ADC Clock – clkADC
- •Clock Sources
- •Default Clock Source
- •Crystal Oscillator
- •External RC Oscillator
- •External Clock
- •Timer/Counter Oscillator
- •Idle Mode
- •Power-down Mode
- •Power-save Mode
- •Standby Mode
- •Extended Standby Mode
- •Analog to Digital Converter
- •Analog Comparator
- •Brown-out Detector
- •Internal Voltage Reference
- •Watchdog Timer
- •Port Pins
- •Resetting the AVR
- •Reset Sources
- •Power-on Reset
- •External Reset
- •Brown-out Detection
- •Watchdog Reset
- •Watchdog Timer
- •Interrupts
- •I/O Ports
- •Introduction
- •Configuring the Pin
- •Reading the Pin Value
- •Unconnected pins
- •Alternate Port Functions
- •Alternate Functions of Port A
- •Alternate Functions of Port B
- •Alternate Functions of Port C
- •Alternate Functions of Port D
- •Port A Data Register – PORTA
- •Port B Data Register – PORTB
- •Port C Data Register – PORTC
- •Port D Data Register – PORTD
- •External Interrupts
- •8-bit Timer/Counter0 with PWM
- •Overview
- •Registers
- •Definitions
- •Counter Unit
- •Output Compare Unit
- •Force Output Compare
- •Modes of Operation
- •Normal Mode
- •Fast PWM Mode
- •Phase Correct PWM Mode
- •Internal Clock Source
- •Prescaler Reset
- •External Clock Source
- •16-bit Timer/Counter1
- •Overview
- •Registers
- •Definitions
- •Compatibility
- •Counter Unit
- •Input Capture Unit
- •Input Capture Trigger Source
- •Noise Canceler
- •Using the Input Capture Unit
- •Output Compare Units
- •Force Output Compare
- •Modes of Operation
- •Normal Mode
- •Fast PWM Mode
- •Phase Correct PWM Mode
- •8-bit Timer/Counter2 with PWM and Asynchronous Operation
- •Overview
- •Registers
- •Definitions
- •Counter Unit
- •Output Compare Unit
- •Force Output Compare
- •Modes of Operation
- •Normal Mode
- •Fast PWM Mode
- •Phase Correct PWM Mode
- •Timer/Counter Prescaler
- •SS Pin Functionality
- •Slave Mode
- •Master Mode
- •SPI Control Register – SPCR
- •SPI Status Register – SPSR
- •SPI Data Register – SPDR
- •Data Modes
- •USART
- •Overview
- •AVR USART vs. AVR UART – Compatibility
- •Clock Generation
- •External Clock
- •Synchronous Clock Operation
- •Frame Formats
- •Parity Bit Calculation
- •USART Initialization
- •Parity Generator
- •Disabling the Transmitter
- •Receiver Error Flags
- •Parity Checker
- •Disabling the Receiver
- •Flushing the Receive Buffer
- •Asynchronous Data Recovery
- •Using MPCM
- •Write Access
- •Read Access
- •Two-wire Serial Interface
- •Features
- •TWI Terminology
- •Electrical Interconnection
- •Transferring Bits
- •START and STOP Conditions
- •Address Packet Format
- •Data Packet Format
- •Overview of the TWI Module
- •SCL and SDA Pins
- •Bit Rate Generator Unit
- •Bus Interface Unit
- •Address Match Unit
- •Control Unit
- •TWI Register Description
- •TWI Bit Rate Register – TWBR
- •TWI Control Register – TWCR
- •TWI Status Register – TWSR
- •TWI Data Register – TWDR
- •Using the TWI
- •Transmission Modes
- •Master Transmitter Mode
- •Master Receiver Mode
- •Slave Receiver Mode
- •Slave Transmitter Mode
- •Miscellaneous States
- •Analog Comparator
- •Analog Comparator Multiplexed Input
- •Features
- •Operation
- •Starting a Conversion
- •Differential Gain Channels
- •Changing Channel or Reference Selection
- •ADC Input Channels
- •ADC Voltage Reference
- •ADC Noise Canceler
- •Analog Input Circuitry
- •ADC Accuracy Definitions
- •ADC Conversion Result
- •ADLAR = 0
- •ADLAR = 1
- •Features
- •Overview
- •Test Access Port – TAP
- •TAP Controller
- •PRIVATE0; $8
- •PRIVATE1; $9
- •PRIVATE2; $A
- •PRIVATE3; $B
- •Bibliography
- •Features
- •System Overview
- •Data Registers
- •Bypass Register
- •Device Identification Register
- •Reset Register
- •Boundary-scan Chain
- •EXTEST; $0
- •IDCODE; $1
- •SAMPLE_PRELOAD; $2
- •AVR_RESET; $C
- •BYPASS; $F
- •Scanning the Digital Port Pins
- •Scanning the RESET Pin
- •Scanning the Clock Pins
- •Scanning the ADC
- •Features
- •Application Section
- •BLS – Boot Loader Section
- •Read-While-Write and no Read-While-Write Flash Sections
- •Boot Loader Lock Bits
- •Performing a Page Write
- •Using the SPM Interrupt
- •Setting the Boot Loader Lock Bits by SPM
- •Reading the Fuse and Lock Bits from Software
- •Preventing Flash Corruption
- •Fuse Bits
- •Latching of Fuses
- •Signature Bytes
- •Calibration Byte
- •Signal Names
- •Parallel Programming
- •Enter Programming Mode
- •Chip Erase
- •Programming the Flash
- •Programming the EEPROM
- •Reading the Flash
- •Reading the EEPROM
- •Programming the Lock Bits
- •Reading the Signature Bytes
- •Reading the Calibration Byte
- •SPI Serial Downloading
- •Data Polling Flash
- •Data Polling EEPROM
- •AVR_RESET ($C)
- •PROG_ENABLE ($4)
- •PROG_COMMANDS ($5)
- •PROG_PAGELOAD ($6)
- •PROG_PAGEREAD ($7)
- •Data Registers
- •Reset Register
- •Programming Enable Register
- •Virtual Flash Page Read Register
- •Programming Algorithm
- •Entering Programming Mode
- •Leaving Programming Mode
- •Performing Chip Erase
- •Programming the Flash
- •Reading the Flash
- •Programming the EEPROM
- •Reading the EEPROM
- •Programming the Fuses
- •Programming the Lock Bits
- •Reading the Signature Bytes
- •Reading the Calibration Byte
- •Electrical Characteristics
- •Absolute Maximum Ratings*
- •DC Characteristics
- •External Clock Drive Waveforms
- •External Clock Drive
- •Two-wire Serial Interface Characteristics
- •ADC Characteristics
- •Register Summary
- •Instruction Set Summary
- •Ordering Information
- •Packaging Information
- •Errata
- •ATmega32 Rev. A
- •Datasheet Change Log for ATmega32
- •Changes from Rev. 2503E-09/03 to Rev. 2503F-12/03
- •Changes from Rev. 2503D-02/03 to Rev. 2503E-09/03
- •Changes from Rev. 2503C-10/02 to Rev. 2503D-02/03
- •Changes from Rev. 2503B-10/02 to Rev. 2503C-10/02
- •Changes from Rev. 2503A-03/02 to Rev. 2503B-10/02
- •Table of Contents
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ATmega32(L) |
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Electrical Characteristics |
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Absolute Maximum Ratings* |
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Operating Temperature.................................. |
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-55°C to +125°C |
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*NOTICE: Stresses beyond those listed under “Absolute |
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Maximum Ratings” may cause permanent dam- |
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Storage Temperature ..................................... |
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-65°C to +150°C |
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age to the device. This is a stress rating only and |
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functional operation of the device at these or |
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Voltage on any Pin except |
RESET |
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other conditions beyond those indicated in the |
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with respect to Ground ................................ |
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-0.5V to VCC+0.5V |
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operational sections of this specification is not |
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Voltage on |
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with respect to Ground |
-0.5V to +13.0V |
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implied. Exposure to absolute maximum rating |
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RESET |
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conditions for extended periods may affect |
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Maximum Operating Voltage |
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6.0V |
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device reliability. |
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DC Current per I/O Pin ............................................... |
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40.0 mA |
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DC Current VCC and GND Pins................................ |
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200.0 mA |
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DC Characteristics |
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TA = -40°C to 85°C, VCC = 2.7V to 5.5V (Unless Otherwise Noted) |
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Symbol |
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Parameter |
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Condition |
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Min |
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Typ |
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Max |
Units |
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VIL |
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Input Low Voltage |
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Except XTAL1 pin |
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-0.5 |
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(1) |
V |
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0.2 VCC |
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XTAL1 pin, External |
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(1) |
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VIL1 |
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Input Low Voltage |
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Clock Selected |
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-0.5 |
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0.1 VCC |
V |
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VIH |
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Input High Voltage |
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Except XTAL1 and |
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0.6 VCC |
(2) |
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VCC |
+ 0.5 |
V |
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RESET |
pins |
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VIH1 |
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Input High Voltage |
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XTAL1 pin, External |
0.7 VCC |
(2) |
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VCC |
+ 0.5 |
V |
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Clock Selected |
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(2) |
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VIH2 |
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Input High Voltage |
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RESET pin |
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0.9 VCC |
VCC |
+ 0.5 |
V |
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VOL |
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Output Low Voltage(3) |
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I |
OL |
= 20 mA, V |
CC |
= 5V |
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0.7 |
V |
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(Ports A,B,C,D) |
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IOL = 10 mA, VCC = 3V |
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0.5 |
V |
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VOH |
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Output High Voltage(4) |
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OH |
= -20 mA, V |
CC |
= 5V |
4.0 |
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V |
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(Ports A,B,C,D) |
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IOH = -10 mA, VCC = 3V |
2.2 |
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V |
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IIL |
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Input Leakage |
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VCC = 5.5V, pin low |
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1 |
µA |
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Current I/O Pin |
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(absolute value) |
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IIH |
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Input Leakage |
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VCC = 5.5V, pin high |
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1 |
µA |
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Current I/O Pin |
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(absolute value) |
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RRST |
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Reset Pull-up Resistor |
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30 |
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60 |
kΩ |
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Rpu |
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I/O Pin Pull-up Resistor |
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20 |
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50 |
kΩ |
285
2503F–AVR–12/03
TA = -40°C to 85°C, VCC = 2.7V to 5.5V (Unless Otherwise Noted)
Symbol |
Parameter |
Condition |
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Min |
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Typ |
Max |
Units |
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Active 1 MHz, VCC = 3V |
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1.1 |
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mA |
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(ATmega32L) |
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Active 4 MHz, VCC = 3V |
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3.8 |
5 |
mA |
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(ATmega32L) |
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Active 8 MHz, VCC = 5V |
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12 |
15 |
mA |
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(ATmega32) |
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Power Supply Current |
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ICC |
Idle 1 MHz, VCC |
= 3V |
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0.35 |
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mA |
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(ATmega32L) |
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Idle 4 MHz, VCC |
= 3V |
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1.2 |
2.5 |
mA |
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(ATmega32L) |
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Idle 8 MHz, VCC |
= 5V |
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5.5 |
8 |
mA |
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(ATmega32) |
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Power-down Mode(5) |
WDT enabled, VCC = 3V |
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< 25 |
20 |
µA |
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WDT disabled, VCC = 3V |
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< 1 |
10 |
µA |
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VACIO |
Analog Comparator |
VCC = 5V |
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40 |
mV |
Input Offset Voltage |
Vin = VCC/2 |
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IACLK |
Analog Comparator |
VCC = 5V |
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-50 |
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50 |
nA |
Input Leakage Current |
Vin = VCC/2 |
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tACID |
Analog Comparator |
VCC = 2.7V |
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750 |
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Propagation Delay |
VCC = 4.0V |
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500 |
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Notes: 1. |
“Max” means the highest value where the pin is guaranteed to be read as low |
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2.“Min” means the lowest value where the pin is guaranteed to be read as high
3.Although each I/O port can sink more than the test conditions (20 mA at Vcc = 5V, 10 mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed:
PDIP Package:
1] The sum of all IOL, for all ports, should not exceed 400 mA.
2] The sum of all IOL, for port A0 - A7, should not exceed 200 mA.
3] The sum of all IOL, for ports B0 - B7,C0 - C7, D0 - D7 and XTAL2, should not exceed 300 mA. TQFP and MLF Package:
1] The sum of all IOL, for all ports, should not exceed 400 mA.
2] The sum of all IOL, for ports A0 - A7, should not exceed 200 mA. 3] The sum of all IOL, for ports B0 - B4, should not exceed 200 mA.
4] The sum of all IOL, for ports B3 - B7, XTAL2, D0 - D2, should not exceed 200 mA. 5] The sum of all IOL, for ports D3 - D7, should not exceed 200 mA.
6] The sum of all IOL, for ports C0 - C7, should not exceed 200 mA.
If IOL exceeds the test condition, VOL may exceed the related specification. Pins are not guaranteed to sink current greater than the listed test condition.
4.Although each I/O port can source more than the test conditions (20 mA at Vcc = 5V, 10 mA at Vcc = 3V) under steady state conditions (non-transient), the following must be observed:
PDIP Package:
1] The sum of all IOH, for all ports, should not exceed 400 mA.
2] The sum of all IOH, for port A0 - A7, should not exceed 200 mA.
3] The sum of all IOH, for ports B0 - B7,C0 - C7, D0 - D7 and XTAL2, should not exceed 300 mA. TQFP and MLF Package:
1] The sum of all IOH, for all ports, should not exceed 400 mA.
2] The sum of all IOH, for ports A0 - A7, should not exceed 200 mA. 3] The sum of all IOH, for ports B0 - B4, should not exceed 200 mA.
4] The sum of all IOH, for ports B3 - B7, XTAL2, D0 - D2, should not exceed 200 mA. 5] The sum of all IOH, for ports D3 - D7, should not exceed 200 mA.
286 ATmega32(L)
2503F–AVR–12/03
ATmega32(L)
6] The sum of all IOH, for ports C0 - C7, should not exceed 200 mA.If IOH exceeds the test condition, VOH may exceed the related specification. Pins are not guaranteed to source current greater than the listed test condition.
5. Minimum VCC for Power-down is 2.5V.
External Clock Drive Figure 144. External Clock Drive Waveforms
Waveforms
VIH1
VIL1
External Clock Drive
Table 118. External Clock Drive
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VCC = 2.7V to 5.5V |
VCC = 4.5V to 5.5V |
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Symbol |
Parameter |
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Min |
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Min |
Max |
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1/tCLCL |
Oscillator Frequency |
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0 |
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8 |
0 |
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16 |
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tCLCL |
Clock Period |
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125 |
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62.5 |
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tCHCX |
High Time |
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50 |
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25 |
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tCLCX |
Low Time |
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50 |
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25 |
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tCLCH |
Rise Time |
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1.6 |
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0.5 |
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µs |
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tCHCL |
Fall Time |
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1.6 |
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0.5 |
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µs |
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Change in period from |
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∆ tCLCL |
one clock cycle to the |
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2 |
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2 |
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next |
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Table 119. External RC Oscillator, Typical Frequencies (VCC = 5V) |
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R [kΩ ](1) |
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C [pF] |
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f(2) |
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100 |
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47 |
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87 kHz |
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33 |
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22 |
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650 kHz |
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10 |
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22 |
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2.0 MHz |
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Notes: 1. |
R should be in the range 3 kΩ |
- 100 kΩ |
, and C should be at least 20 pF. The C values |
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given in the table includes pin capacitance. This will vary with package type. |
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2. The frequency will vary with package type and board layout. |
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287
2503F–AVR–12/03
Two-wire Serial Interface Characteristics
Table 120 describes the requirements for devices connected to the Two-wire Serial Bus. The ATmega32 Two-wire Serial Interface meets or exceeds these requirements under the noted conditions.
Timing symbols refer to Figure 145.
Table 120. Two-wire Serial Bus Requirements
Symbol |
Parameter |
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Condition |
Min |
Max |
Units |
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VIL |
Input Low-voltage |
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-0.5 |
0.3 VCC |
V |
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VIH |
Input High-voltage |
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0.7 VCC |
VCC + 0.5 |
V |
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(1) |
Hysteresis of Schmitt Trigger Inputs |
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(2) |
– |
V |
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Vhys |
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0.05 VCC |
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V |
(1) |
Output Low-voltage |
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3 mA sink current |
0 |
0.4 |
V |
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OL |
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tr(1) |
Rise Time for both SDA and SCL |
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20 + 0.1Cb(3)(2) |
300 |
ns |
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t |
of |
(1) |
Output Fall Time from V |
IHmin |
to V |
ILmax |
10 pF < C |
b |
< 400 pF(3) |
20 + 0.1C (3)(2) |
250 |
ns |
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b |
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tSP(1) |
Spikes Suppressed by Input Filter |
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0 |
50(2) |
ns |
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Ii |
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Input Current each I/O Pin |
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0.1VCC < Vi < 0.9VCC |
-10 |
10 |
µA |
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C |
(1) |
Capacitance for each I/O Pin |
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– |
10 |
pF |
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i |
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fSCL |
SCL Clock Frequency |
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fCK(4) > max(16fSCL, 250kHz)(5) |
0 |
400 |
kHz |
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fSCL ≤ |
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100 kHz |
VC C – 0,4V |
1000ns |
Ω |
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---------------------------- |
------------------ |
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Rp |
Value of Pull-up resistor |
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3mA |
Cb |
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fSCL > 100 kHz |
VC C – 0,4V |
300ns |
Ω |
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---------------------------- |
--------------- |
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3mA |
Cb |
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tHD;STA |
Hold Time (repeated) START Condition |
fSCL ≤ |
|
100 kHz |
4.0 |
– |
µs |
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fSCL > 100 kHz |
0.6 |
– |
µs |
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tLOW |
Low Period of the SCL Clock |
|
fSCL ≤ |
100 kHz(6) |
4.7 |
– |
µs |
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fSCL > 100 kHz(7) |
1.3 |
– |
µs |
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tHIGH |
High period of the SCL clock |
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fSCL ≤ |
|
100 kHz |
4.0 |
– |
µs |
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fSCL > 100 kHz |
0.6 |
– |
µs |
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tSU;STA |
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fSCL ≤ |
|
100 kHz |
4.7 |
– |
µs |
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Set-up time for a repeated START condition |
fSCL > 100 kHz |
0.6 |
– |
µs |
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tHD;DAT |
Data hold time |
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fSCL ≤ |
|
100 kHz |
0 |
3.45 |
µs |
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fSCL > 100 kHz |
0 |
0.9 |
µs |
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tSU;DAT |
Data setup time |
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fSCL ≤ |
|
100 kHz |
250 |
– |
ns |
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fSCL > 100 kHz |
100 |
– |
ns |
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tSU;STO |
Setup time for STOP condition |
|
fSCL ≤ |
|
100 kHz |
4.0 |
– |
µs |
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fSCL > 100 kHz |
0.6 |
– |
µs |
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tBUF |
Bus free time between a STOP and START |
fSCL ≤ |
|
100 kHz |
4.7 |
– |
µs |
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condition |
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fSCL > 100 kHz |
1.3 |
– |
µs |
Notes: 1. In ATmega32, this parameter is characterized and not 100% tested.
2.Required only for fSCL > 100 kHz.
3.Cb = capacitance of one bus line in pF.
4.fCK = CPU clock frequency
288 ATmega32(L)
2503F–AVR–12/03
ATmega32(L)
5.This requirement applies to all ATmega32 Two-wire Serial Interface operation. Other
devices connected to the Two-wire Serial Bus need only obey the general fSCL requirement.
6.The actual low period generated by the ATmega32 Two-wire Serial Interface is (1/fSCL - 2/fCK), thus fCK must be greater than 6 MHz for the low time requirement to be strictly
met at fSCL = 100 kHz.
7. The actual low period generated by the ATmega32 Two-wire Serial Interface is (1/fSCL
- 2/fCK), thus the low time requirement will not be strictly met for fSCL > 308 kHz when fCK = 8 MHz. Still, ATmega32 devices connected to the bus may communicate at full
speed (400 kHz) with other ATmega32 devices, as well as any other device with a proper tLOW acceptance margin.
Figure 145. Two-wire Serial Bus Timing
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tof |
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tHIGH |
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tr |
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SCL |
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tLOW |
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tLOW |
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tSU;STA |
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tHD;STA |
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tHD;DAT |
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t |
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SDA |
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SU;DAT |
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tSU;STO |
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tBUF |
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SPI Timing |
See Figure 146 and Figure 147 for details. |
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|||||||||||
Characteristics |
Table 121. SPI Timing Parameters |
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Description |
Mode |
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Min |
Typ |
Max |
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1 |
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SCK period |
Master |
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See Table 58 |
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2 |
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SCK high/low |
Master |
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50% duty cycle |
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3 |
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Rise/Fall time |
Master |
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3.6 |
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4 |
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Setup |
Master |
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10 |
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5 |
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Hold |
Master |
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10 |
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ns |
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6 |
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Out to SCK |
Master |
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0.5 • tSCK |
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7 |
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SCK to out |
Master |
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10 |
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8 |
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SCK to out high |
Master |
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10 |
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9 |
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low to out |
Slave |
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15 |
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SS |
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10 |
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SCK period |
Slave |
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4 • tck |
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11 |
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SCK high/low |
Slave |
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2 • tck |
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12 |
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Rise/Fall time |
Slave |
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1.6 |
µs |
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13 |
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Setup |
Slave |
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10 |
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14 |
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Hold |
Slave |
|
tck |
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15 |
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SCK to out |
Slave |
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15 |
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ns |
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16 |
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SCK to |
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high |
Slave |
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20 |
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SS |
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17 |
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high to tri-state |
Slave |
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10 |
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SS |
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18 |
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low to SCK |
Salve |
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2 • tck |
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SS |
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289
2503F–AVR–12/03
Figure 146. SPI Interface Timing Requirements (Master Mode)
SS
6 |
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1 |
SCK |
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(CPOL = 0) |
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2 |
2 |
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SCK |
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(CPOL = 1) |
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4 |
5 |
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3 |
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MISO |
MSB |
... |
LSB |
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(Data Input) |
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7 |
8 |
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MOSI |
MSB |
... |
LSB |
|
(Data Output) |
||||
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|
Figure 147. SPI Interface Timing Requirements (Slave Mode)
18 |
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SS |
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9 |
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10 |
16 |
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SCK |
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(CPOL = 0) |
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11 |
11 |
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SCK |
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(CPOL = 1) |
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13 |
14 |
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12 |
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MOSI |
MSB |
... |
LSB |
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(Data Input) |
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15 |
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17 |
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MISO |
MSB |
... |
LSB |
X |
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(Data Output) |
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|
290 ATmega32(L)
2503F–AVR–12/03