- •Release History
- •Contents
- •List of Figures
- •List of Tables
- •1 TMS320TCI6618 Features
- •1.1 KeyStone Architecture
- •1.2 Device Description
- •1.3 Functional Block Diagram
- •2 Device Overview
- •2.1 Device Characteristics
- •2.2 CPU (DSP Core) Description
- •2.3 Memory Map Summary
- •2.4 Boot Sequence
- •2.5 Boot Modes Supported and PLL Settings
- •2.5.1 Boot Device Field
- •2.5.2 Device Configuration Field
- •2.5.2.1 No Boot Device Configuration
- •2.5.2.2 Serial Rapid I/O Boot Device Configuration
- •2.5.2.3 Ethernet (SGMII) Boot Device Configuration
- •2.5.2.4 PCI Boot Device Configuration
- •2.5.2.5 I2C Boot Device Configuration
- •2.5.2.6 SPI Boot Device Configuration
- •2.5.2.7 HyperLink Boot Device Configuration
- •2.5.3 PLL Settings
- •2.6 Second-Level Bootloaders
- •2.7 Terminals
- •2.8 Terminal Functions
- •2.9 Development
- •2.9.1 Development Support
- •2.9.2 Device Support
- •Related Documentation from Texas Instruments
- •3 Device Configuration
- •3.1 Device Configuration at Device Reset
- •3.2 Peripheral Selection After Device Reset
- •3.3 Device State Control Registers
- •3.3.1 Device Status (DEVSTAT) Register
- •3.3.2 Device Configuration Register
- •3.3.3 JTAG ID (JTAGID) Register Description
- •3.3.4 Kicker Mechanism (KICK0 and KICK1) Register
- •3.3.5 LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
- •3.3.6 LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
- •3.3.7 Reset Status (RESET_STAT) Register
- •3.3.8 Reset Status Clear (RESET_STAT_CLR) Register
- •3.3.9 Boot Complete (BOOTCOMPLETE) Register
- •3.3.10 Power State Control (PWRSTATECTL) Register
- •3.3.11 NMI Even Generation to CorePac (NMIGRx) Register
- •3.3.12 IPC Generation (IPCGRx) Registers
- •3.3.13 IPC Acknowledgement (IPCARx) Registers
- •3.3.14 IPC Generation Host (IPCGRH) Register
- •3.3.15 IPC Acknowledgement Host (IPCARH) Register
- •3.3.16 Timer Input Selection Register (TINPSEL)
- •3.3.17 Timer Output Selection Register (TOUTPSEL)
- •3.3.18 Reset Mux (RSTMUXx) Register
- •3.4 Pullup/Pulldown Resistors
- •4 System Interconnect
- •4.1 Internal Buses, Bridges, and Switch Fabrics
- •4.2 Data Switch Fabric Connections
- •4.3 Configuration Switch Fabric
- •4.4 Bus Priorities
- •5 C66x CorePac
- •5.1 Memory Architecture
- •5.1.1 L1P Memory
- •5.1.2 L1D Memory
- •5.1.3 L2 Memory
- •5.1.4 MSM SRAM
- •5.1.5 L3 Memory
- •5.2 Memory Protection
- •5.3 Bandwidth Management
- •5.4 Power-Down Control
- •5.5 CorePac Resets
- •5.6 CorePac Revision
- •5.7 C66x CorePac Register Descriptions
- •6 Device Operating Conditions
- •6.1 Absolute Maximum Ratings
- •6.2 Recommended Operating Conditions
- •6.3 Electrical Characteristics
- •7 TMS320TCI6618 Peripheral Information and Electrical Specifications
- •7.1 Parameter Information
- •7.1.1 1.8-V Signal Transition Levels
- •7.1.2 Timing Parameters and Board Routing Analysis
- •7.2 Recommended Clock and Control Signal Transition Behavior
- •7.3 Power Supplies
- •7.3.1 Power-Up Sequencing
- •7.3.1.1 Core-Before-IO Power Sequencing
- •7.3.1.2 IO-Before-Core Power Sequencing
- •7.3.1.3 Prolonged Resets
- •7.3.2 Power-Down Sequence
- •7.3.3 Power Supply Decoupling and Bulk Capacitors
- •7.3.4 SmartReflex
- •7.4 Enhanced Direct Memory Access (EDMA3) Controller
- •7.4.1 EDMA3 Device-Specific Information
- •7.4.2 EDMA3 Channel Synchronization Events
- •7.5 Interrupts
- •7.5.1 Interrupt Sources and Interrupt Controller
- •7.5.2 INTC Registers
- •7.5.2.1 INTC0 Register Map
- •7.5.2.2 INTC1 Register Map
- •7.5.2.3 INTC2 Register Map
- •7.5.3 Inter-Processor Register Map
- •7.5.4 NMI and LRESET
- •7.5.5 External Interrupts Electrical Data/Timing
- •7.6 Memory Protection Unit (MPU)
- •7.6.1 MPU Registers
- •7.6.1.1 MPU Register Map
- •7.6.1.2 Device-Specific MPU Registers
- •7.6.2 MPU Programmable Range Registers
- •7.6.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
- •7.6.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
- •7.6.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
- •7.7 Reset Controller
- •7.7.1 Power-on Reset
- •7.7.2 Hard Reset
- •7.7.3 Soft Reset
- •7.7.4 Local Reset
- •7.7.5 Reset Priority
- •7.7.6 Reset Controller Register
- •7.7.7 Reset Electrical Data/Timing
- •7.8 Main PLL and the PLL Controller
- •7.8.1 Main PLL Controller Device-Specific Information
- •7.8.1.1 Internal Clocks and Maximum Operating Frequencies
- •7.8.1.2 Main PLL Controller Operating Modes
- •7.8.1.3 Main PLL Stabilization, Lock, and Reset Times
- •7.8.2 PLL Controller Memory Map
- •7.8.2.1 PLL Secondary Control Register (SECCTL)
- •7.8.2.2 PLL Controller Divider Register (PLLDIV2, PLLDIV5, PLLDIV8)
- •7.8.2.3 PLL Controller Clock Align Control Register (ALNCTL)
- •7.8.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
- •7.8.2.5 SYSCLK Status Register (SYSTAT)
- •7.8.2.6 Reset Type Status Register (RSTYPE)
- •7.8.2.7 Reset Control Register (RSTCTRL)
- •7.8.2.8 Reset Configuration Register (RSTCFG)
- •7.8.2.9 Reset Isolation Register (RSISO)
- •7.8.3 Main PLL Control Registers
- •7.8.4 Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing
- •7.9.1 DDR3 PLL Control Register
- •7.9.2 DDR3 PLL Device-Specific Information
- •7.9.3 DDR3 PLL Input Clock Electrical Data/Timing
- •7.10 PASS PLL
- •7.10.1 PASS PLL Control Register
- •7.10.2 PASS PLL Device-Specific Information
- •7.10.3 PASS PLL Input Clock Electrical Data/Timing
- •7.11 DDR3 Memory Controller
- •7.11.1 DDR3 Memory Controller Device-Specific Information
- •7.11.2 DDR3 Memory Controller Electrical Data/Timing
- •7.12 I2C Peripheral
- •7.12.1 I2C Device-Specific Information
- •7.12.2 I2C Peripheral Register Description(s)
- •7.12.3 I2C Electrical Data/Timing
- •7.12.3.1 Inter-Integrated Circuits (I2C) Timing
- •7.13 SPI Peripheral
- •7.13.1 SPI Electrical Data/Timing
- •7.13.1.1 SPI Timing
- •7.14 HyperLink Peripheral
- •7.15 UART Peripheral
- •7.16 PCIe Peripheral
- •7.17 Packet Accelerator
- •7.18 Security Accelerator
- •7.19 Ethernet MAC (EMAC)
- •7.20 Management Data Input/Output (MDIO)
- •7.21 Timers
- •7.21.1 Timers Device-Specific Information
- •7.21.2 Timers Electrical Data/Timing
- •7.22 Rake Search Accelerator (RSA)
- •7.23 Enhanced Viterbi-Decoder Coprocessor (VCP2)
- •7.24 Third-Generation Turbo Decoder Coprocessor (TCP3d)
- •7.25 Turbo Encoder Coprocessor (TCP3e)
- •7.26 Bit Rate Coprocessor (BCP)
- •7.27 Serial RapidIO (SRIO) Port
- •7.28 General-Purpose Input/Output (GPIO)
- •7.28.1 GPIO Device-Specific Information
- •7.28.2 GPIO Electrical Data/Timing
- •7.29 Semaphore2
- •7.30 Antenna Interface Subsystem 2
- •7.33 FFTC
- •7.34 Emulation Features and Capability
- •7.34.1 Advanced Event Triggering (AET)
- •7.34.2 Trace
- •7.34.2.1 Trace Electrical Data/Timing
- •7.34.3 IEEE 1149.1 JTAG
- •7.34.3.1 IEEE 1149.1 JTAG Compatibility Statement
- •7.34.3.2 JTAG Electrical Data/Timing
- •8 Mechanical Data
- •8.1 Packaging Information
- •8.2 Package CYP
TMS320TCI6618
Communications Infrastructure KeyStone SoC
www.ti.com |
SPRS688—February 2011 |
|
2.4 Boot Sequence
The boot sequence is a process by which the DSP's internal memory is loaded with program and data sections. The DSP's internal registers are programmed with predetermined values. The boot sequence is started automatically after each power-on reset. A Hard reset, Soft reset or Local reset to an individual C66x CorePac should not affect the state of the hardware boot controller on the device. For more details on the initiators of the resets, see section
7.7 ‘‘Reset Controller’’ on page 149.
The TCI6618 supports several boot processes that begins execution at the ROM base address, which contains the bootloader code necessary to support various device boot modes. The boot processes are software-driven and use the BOOTMODE[12:0] device configuration inputs to determine the software configuration that must be completed. For more details on Boot Sequence see the Bootloader for the C66x DSP User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 59.
2.5 Boot Modes Supported and PLL Settings
The device supports several boot processes, which leverage the internal boot ROM. Most boot processes are software driven, using the BOOTMODE[3:0] device configuration inputs to determine the software configuration that must be completed. From a hardware perspective, there are two possible boot modes:
•Public ROM Boot - C66x CorePac is released from reset and begins executing from the L3 ROM base address. After performing the boot process (e.g., from I2C ROM, Ethernet, or RapidIO), the C66x CorePac then begins execution from the L2 RAM base address.
•Secure ROM Boot - On secure devices, the C66x CorePac is released from reset and begin executing from secure ROM. Software in the secure ROM will free up internal RAM pages, after which the C66x CorePac initiates the boot process. The C66x CorePac performs any authentication and decryption required on the bootloaded image prior to beginning execution.
The boot process performed by the C66x CorePac in public ROM boot and secure ROM boot are determined by the BOOTMODE[12:0] value in the DEVSTAT register. The C66x CorePac reads this value, and then executes the associated boot process in software. Figure 2-2 shows the bits associated with BOOTMODE[12:0]. The PLL settings is shown at the end of this section, and the PLL setup details can be found in Section 7.8 ‘‘Main PLL and the PLL Controller’’ on page 155
Figure 2-2 |
Boot Mode Pin Decoding |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
||||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Boot Mode Pins |
|
|
|
|
|
|
|
|
||
12 |
|
11 |
10 |
9 |
|
8 |
|
7 |
|
6 |
|
5 |
4 |
|
3 |
2 |
1 |
|
0 |
PLL Mult I2C /SPI Ext Dev Cfg |
|
|
|
Device Configuration |
|
|
Reserved |
|
Boot Device |
|
ADVANCE INFORMATION
Copyright 2011 Texas Instruments Incorporated |
27 |