- •Release History
- •Contents
- •List of Figures
- •List of Tables
- •1 TMS320TCI6618 Features
- •1.1 KeyStone Architecture
- •1.2 Device Description
- •1.3 Functional Block Diagram
- •2 Device Overview
- •2.1 Device Characteristics
- •2.2 CPU (DSP Core) Description
- •2.3 Memory Map Summary
- •2.4 Boot Sequence
- •2.5 Boot Modes Supported and PLL Settings
- •2.5.1 Boot Device Field
- •2.5.2 Device Configuration Field
- •2.5.2.1 No Boot Device Configuration
- •2.5.2.2 Serial Rapid I/O Boot Device Configuration
- •2.5.2.3 Ethernet (SGMII) Boot Device Configuration
- •2.5.2.4 PCI Boot Device Configuration
- •2.5.2.5 I2C Boot Device Configuration
- •2.5.2.6 SPI Boot Device Configuration
- •2.5.2.7 HyperLink Boot Device Configuration
- •2.5.3 PLL Settings
- •2.6 Second-Level Bootloaders
- •2.7 Terminals
- •2.8 Terminal Functions
- •2.9 Development
- •2.9.1 Development Support
- •2.9.2 Device Support
- •Related Documentation from Texas Instruments
- •3 Device Configuration
- •3.1 Device Configuration at Device Reset
- •3.2 Peripheral Selection After Device Reset
- •3.3 Device State Control Registers
- •3.3.1 Device Status (DEVSTAT) Register
- •3.3.2 Device Configuration Register
- •3.3.3 JTAG ID (JTAGID) Register Description
- •3.3.4 Kicker Mechanism (KICK0 and KICK1) Register
- •3.3.5 LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
- •3.3.6 LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
- •3.3.7 Reset Status (RESET_STAT) Register
- •3.3.8 Reset Status Clear (RESET_STAT_CLR) Register
- •3.3.9 Boot Complete (BOOTCOMPLETE) Register
- •3.3.10 Power State Control (PWRSTATECTL) Register
- •3.3.11 NMI Even Generation to CorePac (NMIGRx) Register
- •3.3.12 IPC Generation (IPCGRx) Registers
- •3.3.13 IPC Acknowledgement (IPCARx) Registers
- •3.3.14 IPC Generation Host (IPCGRH) Register
- •3.3.15 IPC Acknowledgement Host (IPCARH) Register
- •3.3.16 Timer Input Selection Register (TINPSEL)
- •3.3.17 Timer Output Selection Register (TOUTPSEL)
- •3.3.18 Reset Mux (RSTMUXx) Register
- •3.4 Pullup/Pulldown Resistors
- •4 System Interconnect
- •4.1 Internal Buses, Bridges, and Switch Fabrics
- •4.2 Data Switch Fabric Connections
- •4.3 Configuration Switch Fabric
- •4.4 Bus Priorities
- •5 C66x CorePac
- •5.1 Memory Architecture
- •5.1.1 L1P Memory
- •5.1.2 L1D Memory
- •5.1.3 L2 Memory
- •5.1.4 MSM SRAM
- •5.1.5 L3 Memory
- •5.2 Memory Protection
- •5.3 Bandwidth Management
- •5.4 Power-Down Control
- •5.5 CorePac Resets
- •5.6 CorePac Revision
- •5.7 C66x CorePac Register Descriptions
- •6 Device Operating Conditions
- •6.1 Absolute Maximum Ratings
- •6.2 Recommended Operating Conditions
- •6.3 Electrical Characteristics
- •7 TMS320TCI6618 Peripheral Information and Electrical Specifications
- •7.1 Parameter Information
- •7.1.1 1.8-V Signal Transition Levels
- •7.1.2 Timing Parameters and Board Routing Analysis
- •7.2 Recommended Clock and Control Signal Transition Behavior
- •7.3 Power Supplies
- •7.3.1 Power-Up Sequencing
- •7.3.1.1 Core-Before-IO Power Sequencing
- •7.3.1.2 IO-Before-Core Power Sequencing
- •7.3.1.3 Prolonged Resets
- •7.3.2 Power-Down Sequence
- •7.3.3 Power Supply Decoupling and Bulk Capacitors
- •7.3.4 SmartReflex
- •7.4 Enhanced Direct Memory Access (EDMA3) Controller
- •7.4.1 EDMA3 Device-Specific Information
- •7.4.2 EDMA3 Channel Synchronization Events
- •7.5 Interrupts
- •7.5.1 Interrupt Sources and Interrupt Controller
- •7.5.2 INTC Registers
- •7.5.2.1 INTC0 Register Map
- •7.5.2.2 INTC1 Register Map
- •7.5.2.3 INTC2 Register Map
- •7.5.3 Inter-Processor Register Map
- •7.5.4 NMI and LRESET
- •7.5.5 External Interrupts Electrical Data/Timing
- •7.6 Memory Protection Unit (MPU)
- •7.6.1 MPU Registers
- •7.6.1.1 MPU Register Map
- •7.6.1.2 Device-Specific MPU Registers
- •7.6.2 MPU Programmable Range Registers
- •7.6.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
- •7.6.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
- •7.6.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPA)
- •7.7 Reset Controller
- •7.7.1 Power-on Reset
- •7.7.2 Hard Reset
- •7.7.3 Soft Reset
- •7.7.4 Local Reset
- •7.7.5 Reset Priority
- •7.7.6 Reset Controller Register
- •7.7.7 Reset Electrical Data/Timing
- •7.8 Main PLL and the PLL Controller
- •7.8.1 Main PLL Controller Device-Specific Information
- •7.8.1.1 Internal Clocks and Maximum Operating Frequencies
- •7.8.1.2 Main PLL Controller Operating Modes
- •7.8.1.3 Main PLL Stabilization, Lock, and Reset Times
- •7.8.2 PLL Controller Memory Map
- •7.8.2.1 PLL Secondary Control Register (SECCTL)
- •7.8.2.2 PLL Controller Divider Register (PLLDIV2, PLLDIV5, PLLDIV8)
- •7.8.2.3 PLL Controller Clock Align Control Register (ALNCTL)
- •7.8.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
- •7.8.2.5 SYSCLK Status Register (SYSTAT)
- •7.8.2.6 Reset Type Status Register (RSTYPE)
- •7.8.2.7 Reset Control Register (RSTCTRL)
- •7.8.2.8 Reset Configuration Register (RSTCFG)
- •7.8.2.9 Reset Isolation Register (RSISO)
- •7.8.3 Main PLL Control Registers
- •7.8.4 Main PLL Controller/SRIO/HyperLink/PCIe Clock Input Electrical Data/Timing
- •7.9.1 DDR3 PLL Control Register
- •7.9.2 DDR3 PLL Device-Specific Information
- •7.9.3 DDR3 PLL Input Clock Electrical Data/Timing
- •7.10 PASS PLL
- •7.10.1 PASS PLL Control Register
- •7.10.2 PASS PLL Device-Specific Information
- •7.10.3 PASS PLL Input Clock Electrical Data/Timing
- •7.11 DDR3 Memory Controller
- •7.11.1 DDR3 Memory Controller Device-Specific Information
- •7.11.2 DDR3 Memory Controller Electrical Data/Timing
- •7.12 I2C Peripheral
- •7.12.1 I2C Device-Specific Information
- •7.12.2 I2C Peripheral Register Description(s)
- •7.12.3 I2C Electrical Data/Timing
- •7.12.3.1 Inter-Integrated Circuits (I2C) Timing
- •7.13 SPI Peripheral
- •7.13.1 SPI Electrical Data/Timing
- •7.13.1.1 SPI Timing
- •7.14 HyperLink Peripheral
- •7.15 UART Peripheral
- •7.16 PCIe Peripheral
- •7.17 Packet Accelerator
- •7.18 Security Accelerator
- •7.19 Ethernet MAC (EMAC)
- •7.20 Management Data Input/Output (MDIO)
- •7.21 Timers
- •7.21.1 Timers Device-Specific Information
- •7.21.2 Timers Electrical Data/Timing
- •7.22 Rake Search Accelerator (RSA)
- •7.23 Enhanced Viterbi-Decoder Coprocessor (VCP2)
- •7.24 Third-Generation Turbo Decoder Coprocessor (TCP3d)
- •7.25 Turbo Encoder Coprocessor (TCP3e)
- •7.26 Bit Rate Coprocessor (BCP)
- •7.27 Serial RapidIO (SRIO) Port
- •7.28 General-Purpose Input/Output (GPIO)
- •7.28.1 GPIO Device-Specific Information
- •7.28.2 GPIO Electrical Data/Timing
- •7.29 Semaphore2
- •7.30 Antenna Interface Subsystem 2
- •7.33 FFTC
- •7.34 Emulation Features and Capability
- •7.34.1 Advanced Event Triggering (AET)
- •7.34.2 Trace
- •7.34.2.1 Trace Electrical Data/Timing
- •7.34.3 IEEE 1149.1 JTAG
- •7.34.3.1 IEEE 1149.1 JTAG Compatibility Statement
- •7.34.3.2 JTAG Electrical Data/Timing
- •8 Mechanical Data
- •8.1 Packaging Information
- •8.2 Package CYP
TMS320TCI6618
Communications Infrastructure KeyStone SoC
www.ti.com |
SPRS688—February 2011 |
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7.31 RAC
The TMS320TCI6618 has two receive accelerator coprocessor (RAC) subsystems. Each RAC subsystem is a receive chip rate accelerator based on a generic correlator coprocessor (GCCP). It supports UMTS operations; assists in transferring data received from the antenna data to the receive core and performs receive functions targets at W-CDMA macro bits.
The RAC subsystem consists of several components:
•2 GCCP accelerators for finger despread (FD), path monitor (PM), preamble detection (PD), and stream power estimator (SPE).
•Back-end interface (BEI) for management of the RAC configuration and the data output.
•Front-end interface (FEI) for reception of the antenna data for processing and access to all memory mapped registers (MMRs) and memories in the RAC components.
The RAC has a total of three ports connected to the DMA crossbar:
•BEI includes two master connections to the DMA SCR for output data to device memory. One is 128-bit and the other is 64-bit, both are clocked at the same rate as the DMA crossbar.
•The FEI has a slave connection to the DMA SCR for input data as well as direct memory access (to facilitate debug).
7.32 TAC
The transmit accelerator coprocessor (TAC) subsystem is a transmit chip-rate accelerator intended to support UMTS applications. For more information, see the Transmit Accelerator (TAC) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 59.
7.33 FFTC
There are three fast Fourier transform coprocessors (FFTC) intended to accelerate FFT, IFFT, DFT, and IDFT operations.For more information, see the Fast Fourier Transform Coprocessor (FFTC) for KeyStone Devices User Guide in ‘‘Related Documentation from Texas Instruments’’ on page 59.
7.34 Emulation Features and Capability
7.34.1 Advanced Event Triggering (AET)
The TMS320TCI6618 device supports advanced event triggering (AET). This capability can be used to debug complex problems as well as understand performance characteristics of user applications. AET provides the following capabilities:
•Hardware Program Breakpoints: specify addresses or address ranges that can generate events such as halting the processor or triggering the trace capture.
•Data Watchpoints: specify data variable addresses, address ranges, or data values that can generate events such as halting the processor or triggering the trace capture.
•Counters: count the occurrence of an event or cycles for performance monitoring.
•State Sequencing: allows combinations of hardware program breakpoints and data watchpoints to precisely generate events for complex sequences.
For more information on the AET, see the following documents in ‘‘Related Documentation from Texas Instruments’’ on page 59:
•Using Advanced Event Triggering to Find and Fix Intermittent Real-Time Bugs application report
•Using Advanced Event Triggering to Debug Real-Time Problems in High Speed Embedded Microprocessor Systems application report
Copyright 2011 Texas Instruments Incorporated |
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