- •Foreword
- •Foreword to First Edition
- •Contributors
- •Preface
- •A.1 Piezoelectric Materials
- •A.3 Optical Fiber Sensors
- •A.4 Electrorheological Fluids
- •A.5 Magnetostrictive Materials
- •A.6 Micro-Electro-Mechanical Systems
- •A.7 Comparison Of Actuators
- •References
- •Index
- •1. Introduction and Overview
- •1.1 General
- •1.3 High-Performance Fiber Composite Concepts
- •1.4 Fiber Reinforcements
- •1.5 Matrices
- •References
- •Bibliography
- •2. Basic Principles of Fiber Composite Materials
- •2.1 Introduction to Fiber Composite Systems
- •2.3 Micromechanics
- •2.4 Elastic Constants
- •2.5 Micromechanics Approach to Strength
- •2.6 Simple Estimate of Compressive Strength
- •References
- •3. Fibers for Polymer-Matrix Composites
- •3.1 Overview
- •3.3 Carbon Fibers
- •3.4 Boron Fibers
- •3.5 Silicon Carbide
- •3.6 Aramid Fibers
- •3.7 Orientated Polyethylene Fibers
- •3.8 Dry Fiber Forms
- •References
- •4. Polymeric Matrix Materials
- •4.1 Introduction
- •4.2 Thermoset and Thermoplastic Polymer Matrix Materials
- •4.3 Thermosetting Resin Systems
- •4.4 Thermoplastic Systems
- •References
- •5. Component Form and Manufacture
- •5.1 Introduction
- •5.2 Outline of General Laminating Procedures
- •5.5 Filament Winding
- •5.7 Process Modelling
- •5.8 Tooling
- •References
- •6. Structural Analysis
- •6.1 Overview
- •6.2 Laminate Theory
- •6.3 Stress Concentration and Edge Effects
- •6.4 Failure Theories
- •6.7 Buckling
- •6.8 Summary
- •References
- •7. Mechanical Property Measurement
- •7.1 Introduction
- •7.2 Coupon Tests
- •7.3 Laboratory Simulation of Environmental Effects
- •7.4 Measurement of Residual Strength
- •7.5 Measurement of Interlaminar Fracture Energy
- •References
- •8. Properties of Composite Systems
- •8.1 Introduction
- •8.3 Boron Fiber Composite Systems
- •8.4 Aramid Fiber Composite Systems
- •8.6 Properties of Laminates
- •References
- •9. Joining of Composite Structures
- •9.1 Introduction
- •9.2 Comparison Between Mechanically Fastened and Adhesively Bonded Joints
- •9.3 Adhesively Bonded Joints
- •9.4 Mechanically Fastened Joints
- •References
- •10. Repair Technology
- •10.1 Introduction
- •10.2 Assessment of the Need to Repair
- •10.3 Classification of Types of Structure
- •10.4 Repair Requirements
- •10.6 Patch Repairs: General Considerations
- •10.7 Bonded Patch Repairs
- •10.9 Application Technology: In Situ Repairs
- •10.10 Bolted Repairs
- •References
- •11. Quality Assurance
- •11.1 Introduction
- •11.2 Quality Control
- •11.3 Cure Monitoring
- •References
- •12. Aircraft Applications and Design Issues
- •12.1 Overview
- •12.2 Applications of Glass-Fiber Composites
- •12.3 Current Applications
- •12.4 Design Considerations
- •12.7 A Value Engineering Approach to the Use of Composite Materials
- •12.8 Conclusion
- •References
- •13. Airworthiness Considerations For Airframe Structures
- •13.1 Overview
- •13.2 Certification of Airframe Structures
- •13.3 The Development of Design Allowables
- •13.4 Demonstration of Static Strength
- •13.5 Demonstration of Fatigue Strength
- •13.6 Demonstration of Damage Tolerance
- •13.7 Assessment of the Impact Damage Threat
- •References
- •14. Three-Dimensionally Reinforced Preforms and Composites
- •14.1 Introduction
- •14.2 Stitching
- •14.3 Z-Pinning
- •14.6 Knitting
- •14.8 Conclusion
- •References
- •15. Smart Structures
- •15.1 Introduction
- •15.2 Engineering Approaches
- •15.3 Selected Applications and Demonstrators
- •References
- •16. Knowledge-Based Engineering, Computer-Aided Design, and Finite Element Analysis
- •16.2 Finite Element Modelling of Composite Structures
- •16.3 Finite Element Solution Process
- •16.4 Element Types
- •16.5 Finite Element Modelling of Composite Structures
- •16.6 Implementation
- •References
AI~I')I:NL)IX |
577 |
grating characteristics, for example, strain and/or temperature, results in a shift in the reflected Bragg wavelength. The outer fiber diameter can vary between 80 and 250 txm, with gauge lengths from 1 nun to approximately 100 mm. The disadvantages with this approach at present are that costly and bulky instrumentation is needed to extract the information such as strain or temperature. However, the main advantage of these sensors is the potential of significant multiplexing, using wavelength division multiplexing (WDM), with the potential of hundreds of discrete sensing elements on the one optical fiber.
A.4 Electrorheological Fluids
In this system, microscopic hydrophilic non-conducting particles such as silica are suspended in a non-conducting hydrophobic carrier fluid. When a high voltage is applied to this suspension, the particles form a tight columnar arrangement. The viscosity of the fluid then increases dramatically to form a pseudo solid able to transmit forces.
Tubes or layers carrying these fluids could be used in smart structures, for example, to develop high damping properties.
A.5 Magnetostrictive Materials
Magnetostrictive materials develop large mechanical deformations when subjected to an external magnetic field. This phenomenon (as with normal magnetism) is attributed to the rotations of small magnetic domains that are randomly orientated when the material is not exposed to a magnetic field. The orientation of these small domains by the imposition of a magnetic field results in the development of a strain field. Terbium-iron alloys are typical magnetostrictive materials.
Magnetostrictive materials typically can develop strains an order of magnitude greater than the current generation of piezoelectric ceramic materials. Generally, magnetostrictive materials generate a greater force response than piezoelectric materials (when subjected to compressive loads) but have significantly greater power requirements.
A.6 Micro-Electro-Mechanical Systems
Micro-electro-mechanical systems (MEMS) are the integration of mechanical devices, such as sensors and actuators, and electronics on a common silicon substrate through microfabrication technology. MEMS fabrication technology is based on techniques developed by and used in the electronics industry. Whereas the electronics are fabricated using integrated circuit (IC) process sequences [e.g., complementary metal-oxide semiconductor (CMOS), Bipolar, or BICMOS
578 COMPOSITE MATERIALS FOR AIRCRAFT STRUCTURES
processes], the micromechanical components are fabricated using compatible "micromachining" processes that selectively etch away parts of the silicon wafer or add new structural layers to form the mechanical and electromechanical devices, and can range in size from micrometers to millimetres,tl The most common MEMS process is based on the use of masks (resists) and chemical etching techniques to produce three-dimensional and free-standing structures with integrated electronics. Because the fabrication process is currently limited to a few materials, with silicon predominating, the challenge is to design MEMS in more durable materials that can be fabricated as part of (or be compatible with) standard fabricating techniques for integrated circuits. Even though a significant number of MEMS fabrication processes have evolved from the lithography-based batch-fabricated world of microelectronics, some MEMS processes have evolved from other engineering activities and include microgrinding, electro-discharge machining (EDM), hot embossing, laser machining, and sol-gel techniques. These nonlithographic processes are extended to high-volume applications through their use is in creating master molds, for parts replication.
A.7 Comparison of Actuators
The preceding sections describe actuator systems that have been incorporated into composite structures for smart structure applications. A comparison of some
Table A.2 A Comparison of Smart Actuator Properties
|
PZT G1195 |
PVDF |
|
|
|
|
Materials |
Piezoelectric |
Piezoelectric |
PMN-BA |
Terfenol |
|
|
Properties |
Ceramic |
Polymer |
Electrostrictive |
Magnetostrictive |
Nitinol SMA |
|
Strain to failure |
|
0.13 |
300-400 |
0.13 |
>0 . 2 |
8.0 |
(%) |
|
|
|
|
|
|
Elastic modulus |
|
63 |
2 |
121 |
48 |
83a |
(GPa) |
|
|
|
|
|
28 -41 m |
Max. operating |
|
360 |
80-120 |
> 500 |
380 |
-- 200-110°C |
temperature |
|
|
|
|
|
|
(°c) |
|
|
|
|
|
|
Linearity |
|
good |
Good |
fair |
fair |
Poor |
Hysteresis (%) |
|
10 |
> 10 |
1 |
2 |
5 |
Temperature |
|
0.05 |
0.8 |
0.9 |
high |
|
sensitivity |
|
|
|
|
|
|
(~/o c) |
|
|
|
|
|
|
Bandwidth |
|
high |
high |
high |
moderate |
Low |
Sources: h t t p : / / w w w ' s m a - i n c ' c ° m / N i T i P r ° p e r t i e s ' h t m l ; |
h t t p : / / w w w . t e x l o c . c o m / c l o s e t / |
|||||
cl_pvdf_properties.htm and Ref. 4. |
|
|
|
|||
a - - austenitic phase |
m - - |
martensite phase |
c - - transformation temperatures |
|
|
APPENDIX |
|
|
579 |
|
Table A.3 Comparison of the Capabilities of Various Smart Actuator Materials |
||||||
|
Stress |
|
Efficiency |
Bandwith |
Work |
Power |
|
(Mpa) |
Strain |
(%) |
(Hz) |
(J/cm2) |
(W-3) |
Shape memory alloy |
200 |
0.1 |
3 |
3 |
10 |
30 |
Electrostrictive |
50 |
0.002 |
50 |
5000 |
0.05 |
250 |
Piezoelectric ceramic |
35 |
0.002 |
50 |
5000 |
0.035 |
175 |
Magnetostrictive |
35 |
0.002 |
80 |
2000 |
0.035 |
70 |
Single crystal |
300 |
0.017 |
90 |
5800 |
2.55 |
15000 |
(PZN:PT) |
|
|
|
|
|
|
Source: Hollerbacket al. "A ComparativeAnalysisof ActuatorTechnologiesfor Robotics."
mechanical and physical properties of various actuator materials is illustrated in Tables A.2 and A.3 The application of these actuators to dynamic applications for composite structures will depend on their relative weight, bandwidth, hysteresis, and environmental stability. The actuator performance is also an issue and is given by actuator authority, which is characterized by the maximum amount of work (stress strain product). Another significant parameter that needs to be considered is the robustness or damage tolerance of the actuator system.
References
1Tresler, J. F., "Piezoelectric Composite Sensors," Comprehensive Composite Materials, edited by A. Kelly and C. Zweben, Elsevier, 2000, Sec. 5.24.
2Roytburd, J., Slutsker, J., and Wuttig, M., "Smart Composites with Shape Memory Alloys," Comprehensive Composite Materials, edited by A. Kelly and C. Zweben, Elsevier, 2000, Sec. 5.23.
3Wayman, C. M., and Duerig, T. W., "Engineering Aspects of Shape Memory Alloys,"
An Introduction to Martensite and Shape Memory, Butterworth-Heinemann, Boston, 1990. 4Kelly Tsoi, A., Stalmans, R., and Schrooten, J., "Transformation Behaviour of Constrained Shape Memory Alloys," Acta Materialia, Vol. 50, Sept. 2002, pp. 3535-
3544.
5Michie, C., "Optical Fibre Sensors for Advanced Composite Materials," Comprehensive Composite Materials, edited by A. Kelly and C. Zweben, Elsevier, 2000, Sec. 5.21.
6Rogers, A., "Distributed Optical-fibre Sensing," Meas. Sci. Techno, Vol. 10, 1999, pp. R75-R99.
7Mrad, N., "Optical Fiber Sensor Technology: Introduction and Evaluation and Application," The Encyclopedia of Smart Materials, Vol. 2, John Wiley and Sons, 2002, pp. 715-737.
SHill, K. O., Fujii, F., Johnson, D. C., and Kawasaki, B., "Photosensitivity on Optical Fibre Waveguides: Applicatgion to Reflection Filter Fabrication" Applied Physics Letters, Vol. 32, 1978, pp. 647-649.
580 COMPOSITE MATERIALS FOR AIRCRAFT STRUCTURES
9Rao, Y. J., Ribeiro, A. B. L., Jackson, D. A., Zhang L., and Bennion, I., "Combined Spatialand Time-division-multiplexing for Fibre Grating Sensors with Driftcompensated Phase-sensitive Detection," Optics Letters, 1995, pp. 2149-2151.
l°Roa, Y. J., "In-fibre Bragg Grating Sensors," Meas. Sci. Technol, Vol. 8, 1997, pp. 355-375.
l lTrimmer, W., Micromechanics and MEMS, IEEE Number PC4390, IEEE Press, New York, 1997.