
- •Table of Contents
- •REVISION HISTORY
- •GNZ, GLS, and GNY BGA packages (bottom view)
- •description
- •device characteristics
- •functional and CPU (DSP core) block diagram
- •CPU (DSP core) description
- •memory map summary
- •peripheral register descriptions
- •DMA synchronization events
- •interrupt sources and interrupt selector
- •signal groups description
- •Signal Descriptions
- •development support
- •Software Development Tools:
- •Hardware Development Tools:
- •device and development-support tool nomenclature
- •TMDX
- •TMDS
- •documentation support
- •clock PLL
- •power-supply sequencing
- •system-level design considerations
- •power-supply design considerations
- •IEEE 1149.1 JTAG compatibility statement
- •recommended operating conditions
- •PARAMETER MEASUREMENT INFORMATION
- •signal transition levels
- •timing parameters and board routing analysis
- •INPUT AND OUTPUT CLOCKS
- •ASYNCHRONOUS MEMORY TIMING
- •SYNCHRONOUS-BURST MEMORY TIMING
- •SYNCHRONOUS DRAM TIMING
- •RESET TIMING
- •EXTERNAL INTERRUPT TIMING
- •EXPANSION BUS SYNCHRONOUS FIFO TIMING
- •EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING
- •EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING
- •EXPANSION BUS ASYNCHRONOUS HOST-PORT TIMING
- •XHOLD/XHOLDA TIMING
- •MULTICHANNEL BUFFERED SERIAL PORT TIMING
- •timing requirements for FSR when GSYNC = 1 (see Figure 48)
- •DMAC, TIMER, POWER-DOWN TIMING
- •JTAG TEST-PORT TIMING
- •timing requirements for JTAG test port (see Figure 56)
- •MECHANICAL DATA
- •thermal resistance characteristics (S-PBGA package)
- •thermal resistance characteristics (S-PBGA package)
- •thermal resistance characteristics (S-PBGA package)
- •IMPORTANT NOTICE

TMS320C6203B
FIXED POINT DIGITAL SIGNAL PROCESSOR
SPRS086K – JANUARY 1999 – REVISED APRIL 2003
device and development-support tool nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all TMS320 DSP devices and support tools. Each TMS320 DSP commercial family member has one of three prefixes: TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device’s electrical specifications
TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality and reliability verification
TMS |
Fully qualified production device |
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification testing.
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, GLS), the temperature range (for example, blank is the default commercial temperature range), and the device speed range in megahertz (for example, -300 is 300 MHz).
Table 15 lists the device orderable part numbers (P/Ns) and Figure 4 provides a legend for reading the complete device name for any member of the TMS320C6000 DSP platform. For more information on the C6203B device orderable P/Ns, visit the Texas Instruments web site on the Worldwide web at http://www.ti.com URL, or contact the nearest TI field sales office or authorized distributor.
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 |
35 |

TMS320C6203B
FIXED POINT DIGITAL SIGNAL PROCESSOR
SPRS086K – JANUARY 1999 – REVISED APRIL 2003
device and development-support tool nomenclature (continued)
Table 15. TMS320C6203B Device Part Numbers (P/Ns) and Ordering Information
DEVICE ORDERABLE P/N |
DEVICE SPEED |
CORE and I/O VOLTAGE |
OPERATING CASE |
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TEMPERATURE |
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CVDD (CORE) |
DVDD (I/O) |
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RANGE |
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C6203B Rev. 2 |
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TMS32C6203BGLS173H |
250 MHz/2000 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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300 MHz/2400 MIPS |
1.7 V |
3.3 V |
0_C to 90_C |
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TMS320C6203BGLS-3H |
300 MHz/2400 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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C6203B Rev. 3 |
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TMS320C6203BGNY300 |
300 MHz/2400 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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1.7 V |
3.3 V |
0_C to 90_C |
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TMS320C6203BGNY173 |
250 MHz/2000 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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300 MHz/2400 MIPS |
1.7 V |
3.3 V |
0_C to 90_C |
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TMS320C6203BGNY3E |
300 MHz/2400 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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TMS320C6203BGNZ300 |
300 MHz/2400 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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1.7 V |
3.3 V |
0_C to 90_C |
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TMS320C6203BGNZ173 |
250 MHz/2000 MIPS |
1.5 V |
3.3 V |
0_C to 90_C |
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300 MHz/2400 MIPS |
1.7 V |
3.3 V |
0_C to 90_C |
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TMS32C6203BGNZA250 |
250 MHz/2000 MIPS |
1.5 V |
3.3 V |
–40_C to 105_C |
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TMS 320 |
C 6203B GNZ ( ) 300 |
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PREFIX |
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DEVICE SPEED RANGE |
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TMX = |
Experimental device |
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100 MHz |
200 MHz |
500 MHz |
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TMP = |
Prototype device |
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120 MHz |
233 MHz |
600 MHz |
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TMS = |
Qualified device |
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150 MHz |
250 MHz |
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SMJ = |
MIL-PRF-38535, QML |
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167 MHz |
300 MHz |
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SM = |
High Rel (non-38535) |
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TEMPERATURE RANGE (DEFAULT: 0° C TO 90° C) |
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Blank = |
0° C to 90° C, commercial temperature |
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DEVICE FAMILY |
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A |
= |
–40° C to 105° C, extended temperature |
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320 = TMS320t DSP family |
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PACKAGE TYPE† |
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GFN = 256-pin plastic BGA |
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TECHNOLOGY |
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GGP = |
352-pin plastic BGA |
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C |
= CMOS |
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GJC = |
352-pin plastic BGA |
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GJL |
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352-pin plastic BGA |
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GLS = |
384-pin plastic BGA |
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GLW = 340-pin plastic BGA |
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GNY = 384-pin plastic BGA |
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GNZ = 352-pin plastic BGA |
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GLZ = |
532-pin plastic BGA |
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GHK = 288-pin plastic MicroStar BGAt |
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DEVICE |
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C6000 DSP: |
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6201 |
6205 |
6415 |
6711C |
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6202 |
6211 |
6416 |
6712 |
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6202B |
6211B |
6701 |
6712C |
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6203B |
6411 |
6711 |
6713 |
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6204 |
6414 |
6711B |
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† BGA = Ball Grid Array
Figure 4. TMS320C6000 DSP Platform Device Nomenclature (Including TMS320C6203B)
MicroStar BGA is a trademark of Texas Instruments.
36 |
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 |