- •Table of Contents
- •REVISION HISTORY
- •GNZ, GLS, and GNY BGA packages (bottom view)
- •description
- •device characteristics
- •functional and CPU (DSP core) block diagram
- •CPU (DSP core) description
- •memory map summary
- •peripheral register descriptions
- •DMA synchronization events
- •interrupt sources and interrupt selector
- •signal groups description
- •Signal Descriptions
- •development support
- •Software Development Tools:
- •Hardware Development Tools:
- •device and development-support tool nomenclature
- •TMDX
- •TMDS
- •documentation support
- •clock PLL
- •power-supply sequencing
- •system-level design considerations
- •power-supply design considerations
- •IEEE 1149.1 JTAG compatibility statement
- •recommended operating conditions
- •PARAMETER MEASUREMENT INFORMATION
- •signal transition levels
- •timing parameters and board routing analysis
- •INPUT AND OUTPUT CLOCKS
- •ASYNCHRONOUS MEMORY TIMING
- •SYNCHRONOUS-BURST MEMORY TIMING
- •SYNCHRONOUS DRAM TIMING
- •RESET TIMING
- •EXTERNAL INTERRUPT TIMING
- •EXPANSION BUS SYNCHRONOUS FIFO TIMING
- •EXPANSION BUS ASYNCHRONOUS PERIPHERAL TIMING
- •EXPANSION BUS SYNCHRONOUS HOST-PORT TIMING
- •EXPANSION BUS ASYNCHRONOUS HOST-PORT TIMING
- •XHOLD/XHOLDA TIMING
- •MULTICHANNEL BUFFERED SERIAL PORT TIMING
- •timing requirements for FSR when GSYNC = 1 (see Figure 48)
- •DMAC, TIMER, POWER-DOWN TIMING
- •JTAG TEST-PORT TIMING
- •timing requirements for JTAG test port (see Figure 56)
- •MECHANICAL DATA
- •thermal resistance characteristics (S-PBGA package)
- •thermal resistance characteristics (S-PBGA package)
- •thermal resistance characteristics (S-PBGA package)
- •IMPORTANT NOTICE
TMS320C6203B
FIXED POINT DIGITAL SIGNAL PROCESSOR
SPRS086K – JANUARY 1999 – REVISED APRIL 2003
MECHANICAL DATA
GNZ (S–PBGA–N352) |
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PLASTIC BALL GRID ARRAY |
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27,20 |
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25,00 TYP |
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SQ |
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26,80 |
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25,20 |
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1,00 |
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24,80 SQ |
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0,50 |
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AF |
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AE |
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AD |
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AC |
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AB |
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AA |
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Y |
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V |
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1,00 |
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U |
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A1 Corner |
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T |
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N |
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M |
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L |
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0,50 |
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K |
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J |
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H |
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G |
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E |
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D |
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C |
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B |
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A |
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1 |
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Bottom View |
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2,80 MAX |
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0,50 NOM |
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Seating Plane |
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0,70 |
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0,60 |
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0,15 |
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0,50 |
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0,40 |
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4202595-2/E 12/02 |
NOTES: A. All linear dimensions are in millimeters.
B.This drawing is subject to change without notice.
C.Flip chip application only.
D.Substrate color may vary.
thermal resistance characteristics (S-PBGA package)
NO |
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° C/W |
Air Flow m/s† |
1 |
RΘ |
JC |
Junction-to-case |
6.35 |
N/A |
2 |
RΘ |
JA |
Junction-to-free air |
20.0 |
0.00 |
3 |
RΘ |
JA |
Junction-to-free air |
17.0 |
0.50 |
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RΘ |
JA |
Junction-to-free air |
16.3 |
1.00 |
5 |
RΘ |
JA |
Junction-to-free air |
15.2 |
2.00 |
† m/s = meters per second
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 |
97 |
TMS320C6203B
FIXED POINT DIGITAL SIGNAL PROCESSOR
SPRS086K – JANUARY 1999 – REVISED APRIL 2003
MECHANICAL DATA
GLS (S-PBGA-N384) |
PLASTIC BALL GRID ARRAY |
18,10 |
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16,80 TYP |
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17,90 |
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0,80 |
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0,40 |
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AB |
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AA |
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Y |
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W |
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V |
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U |
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0,80 |
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T |
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R |
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P |
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N |
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A1 Corner |
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M |
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L |
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K |
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J |
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0,40 |
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H |
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G |
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F |
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E |
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D |
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C |
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B |
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A |
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Heat Slug |
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Bottom View |
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1,00 NOM |
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2,80 MAX |
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Seating Plane |
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0,55 |
0,10 |
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0,45 |
0,12 |
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0,45 |
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0,35 |
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4188959-3/E 11/01 |
NOTES: A. All linear dimensions are in millimeters.
B.This drawing is subject to change without notice.
C.Thermally enhanced plastic package with heat slug (HSL)
D.Flip chip application only
thermal resistance characteristics (S-PBGA package)
NO |
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° C/W |
Air Flow m/s† |
1 |
RΘ |
JC |
Junction-to-case |
0.85 |
N/A |
2 |
RΘ |
JA |
Junction-to-free air |
21.6 |
0.0 |
3 |
RΘ |
JA |
Junction-to-free air |
18.0 |
0.5 |
4 |
RΘ |
JA |
Junction-to-free air |
15.5 |
1.0 |
5 |
RΘ |
JA |
Junction-to-free air |
12.8 |
2.0 |
† m/s = meters per second
98 |
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 |
TMS320C6203B
FIXED POINT DIGITAL SIGNAL PROCESSOR
SPRS086K – JANUARY 1999 – REVISED APRIL 2003
MECHANICAL DATA
GNY (S-PBGA-N384) |
PLASTIC BALL GRID ARRAY |
18,10 |
SQ |
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16,80 TYP |
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17,90 |
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0,80 |
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0,40 |
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AB |
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AA |
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Y |
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W |
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V |
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U |
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0,80 |
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T |
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R |
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P |
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N |
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M |
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A1 Corner |
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L |
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K |
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J |
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0,40 |
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H |
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G |
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B |
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A |
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Bottom View |
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2,35 MAX |
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Seating Plane |
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M |
0,45 |
0,12 |
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0,45 |
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4201137/C 11/01 |
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0,35 |
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NOTES: A. All linear dimensions are in millimeters.
B.This drawing is subject to change without notice.
C.Flip chip application only
D.Substrate color may vary
thermal resistance characteristics (S-PBGA package)
NO |
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C6203B |
Air Flow m/s† |
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(° C/W) |
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1 |
RΘ |
JC |
Junction-to-case |
6.27 |
N/A |
2 |
RΘ |
JA |
Junction-to-free air |
17.6 |
0.0 |
3 |
RΘ |
JA |
Junction-to-free air |
13.9 |
0.5 |
4 |
RΘ |
JA |
Junction-to-free air |
13.1 |
1.0 |
5 |
RΘ |
JA |
Junction-to-free air |
11.9 |
2.0 |
† m/s = meters per second
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 |
99 |