- •1 Introduction
- •1.1 Features
- •1.2 Block diagram
- •2 Pin Information
- •2.1 Pin assignment
- •2.2 Pin functions
- •3 Absolute maximum ratings
- •4 Operating conditions
- •5 Electrical specifications
- •5.1 Power consumption
- •5.2 General RF conditions
- •5.3 Transmitter operation
- •5.4 Receiver operation
- •5.5 Crystal specifications
- •5.6 DC characteristics
- •5.7 Power on reset
- •6 Radio Control
- •6.1 Operational Modes
- •6.1.1 State diagram
- •6.1.2 Power Down Mode
- •6.1.3 Standby Modes
- •6.1.4 RX mode
- •6.1.5 TX mode
- •6.1.6 Operational modes configuration
- •6.1.7 Timing Information
- •6.2 Air data rate
- •6.3 RF channel frequency
- •6.4 Received Power Detector measurements
- •6.5 PA control
- •6.6 RX/TX control
- •7 Enhanced ShockBurst™
- •7.1 Features
- •7.2 Enhanced ShockBurst™ overview
- •7.3.1 Preamble
- •7.3.2 Address
- •7.3.3 Packet control field
- •7.3.3.1 Payload length
- •7.3.3.2 PID (Packet identification)
- •7.3.4 Payload
- •7.3.5 CRC (Cyclic Redundancy Check)
- •7.3.6 Automatic packet assembly
- •7.3.7 Automatic packet disassembly
- •7.4 Automatic packet transaction handling
- •7.4.1 Auto acknowledgement
- •7.4.2 Auto Retransmission (ART)
- •7.5 Enhanced ShockBurst flowcharts
- •7.5.1 PTX operation
- •7.5.2 PRX operation
- •7.8.1 Single transaction with ACK packet and interrupts
- •7.8.2 Single transaction with a lost packet
- •7.8.3 Single transaction with a lost ACK packet
- •7.8.4 Single transaction with ACK payload packet
- •7.8.5 Single transaction with ACK payload packet and lost packet
- •7.8.6 Two transactions with ACK payload packet and the first ACK packet lost
- •7.8.7 Two transactions where max retransmissions is reached
- •7.9 Compatibility with ShockBurst™
- •7.9.1 ShockBurst™ packet format
- •8 Data and Control Interface
- •8.1 Features
- •8.2 Functional description
- •8.3 SPI operation
- •8.3.1 SPI commands
- •8.3.2 SPI timing
- •8.4 Data FIFO
- •8.5 Interrupt
- •9 Register Map
- •9.1 Register map table
- •10 Peripheral RF Information
- •10.1 Antenna output
- •10.2 Crystal oscillator
- •10.3 nRF24L01+ crystal sharing with an MCU
- •10.3.1 Crystal parameters
- •10.3.2 Input crystal amplitude and current consumption
- •10.4 PCB layout and decoupling guidelines
- •11 Application example
- •11.1 PCB layout examples
- •12 Mechanical specifications
- •13 Ordering information
- •13.1 Package marking
- •13.2 Abbreviations
- •13.3 Product options
- •13.3.1 RF silicon
- •13.3.2 Development tools
- •14 Glossary of Terms
- •Appendix A - Enhanced ShockBurst™ - Configuration and communication example
- •Enhanced ShockBurst™ transmitting payload
- •Enhanced ShockBurst™ receive payload
- •Appendix B - Configuration for compatibility with nRF24XX
- •Appendix C - Constant carrier wave output for testing
- •Configuration
nRF24L01+ Product Specification
5.5Crystal specifications
Symbol |
Parameter (condition) |
Notes |
Min. |
Typ. |
Max. |
Units |
Fxo |
Crystal Frequency |
|
|
16 |
|
MHz |
F |
Tolerance |
a b |
|
|
±60 |
ppm |
|
|
|
|
|
|
|
C0 |
Equivalent parallel capacitance |
|
|
1.5 |
7.0 |
pF |
Ls |
Equivalent serial inductance |
c |
|
30 |
|
mH |
|
|
|
|
|
|
|
CL |
Load capacitance |
|
8 |
12 |
16 |
pF |
ESR |
Equivalent Series Resistance |
|
|
|
100 |
Ω |
a.Frequency accuracy including; tolerance at 25ºC, temperature drift, aging and crystal loading.
b.Frequency regulations in certain regions set tighter requirements for frequency tolerance (For example, Japan and South Korea specify max. +/- 50ppm).
c.Startup time from power down to standby mode is dependant on the Ls parameter. See Table 16. on page 24 for details.
Table 11. Crystal specifications
The crystal oscillator startup time is proportional to the crystal equivalent inductance. The trend in crystal design is to reduce the physical outline. An effect of a small outline is an increase in equivalent serial inductance Ls, which gives a longer startup time. The maximum crystal oscillator startup time, Tpd2stby = 1.5 ms, is set using a crystal with equivalent serial inductance of maximum 30mH.
An application specific worst case startup time can be calculated as :
Tpd2stby= Ls/30mH *1.5ms if Ls exceeds 30mH.
Note: In some crystal datasheets Ls is called L1 or Lm and Cs is called C1 or Cm.
Co
ESR Cs Ls
Figure 3. Equivalent crystal components
Revision 1.0 |
Page 19 of 78 |
nRF24L01+ Product Specification
5.6DC characteristics
|
Symbol |
|
Parameter (condition) |
Notes |
|
Min. |
|
Typ. |
Max. |
|
Units |
||
|
|
VIH |
HIGH level input voltage |
|
|
0.7VDD |
|
|
5.25a |
|
V |
||
|
|
VIL |
LOW level input voltage |
|
|
|
VSS |
|
|
0.3VDD |
|
V |
|
|
|
a. If the input signal >3.6V, the VDD of the nRF24L01+ must be between 2.7V and 3.3V (3.0V±10%) |
|
||||||||||
|
|
|
|
Table 12. Digital input pin |
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Symbol |
|
Parameter (condition) |
Notes |
|
Min. |
|
Typ. |
Max. |
|
Units |
||
|
|
VOH |
HIGH level output voltage (IOH=-0.25mA) |
|
|
VDD -0.3 |
|
|
VDD |
|
V |
||
|
|
VOL |
LOW level output voltage (IOL=0.25mA) |
|
|
|
|
|
|
0.3 |
|
V |
|
|
|
|
|
Table 13. Digital output pin |
|
|
|
|
|
|
|||
5.7 |
Power on reset |
|
|
|
|
|
|
|
|
|
|||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Symbol |
|
Parameter (condition) |
|
Notes |
Min. |
|
Typ. |
Max. |
|
Units |
|
|
|
TPUP |
|
Power ramp up time |
|
a |
|
|
|
100 |
|
ms |
|
|
|
TPOR |
|
Power on reset |
|
b |
1 |
|
|
100 |
|
ms |
a. From 0V to 1.9V.
b. Measured from when the VDD reaches 1.9V to when the reset finishes.
Table 14. Power on reset
Revision 1.0 |
Page 20 of 78 |