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Файл:nRF24L01P_Product_Specification_1_0.pdf
X
- •1 Introduction
- •1.1 Features
- •1.2 Block diagram
- •2 Pin Information
- •2.1 Pin assignment
- •2.2 Pin functions
- •3 Absolute maximum ratings
- •4 Operating conditions
- •5 Electrical specifications
- •5.1 Power consumption
- •5.2 General RF conditions
- •5.3 Transmitter operation
- •5.4 Receiver operation
- •5.5 Crystal specifications
- •5.6 DC characteristics
- •5.7 Power on reset
- •6 Radio Control
- •6.1 Operational Modes
- •6.1.1 State diagram
- •6.1.2 Power Down Mode
- •6.1.3 Standby Modes
- •6.1.4 RX mode
- •6.1.5 TX mode
- •6.1.6 Operational modes configuration
- •6.1.7 Timing Information
- •6.2 Air data rate
- •6.3 RF channel frequency
- •6.4 Received Power Detector measurements
- •6.5 PA control
- •6.6 RX/TX control
- •7 Enhanced ShockBurst™
- •7.1 Features
- •7.2 Enhanced ShockBurst™ overview
- •7.3.1 Preamble
- •7.3.2 Address
- •7.3.3 Packet control field
- •7.3.3.1 Payload length
- •7.3.3.2 PID (Packet identification)
- •7.3.4 Payload
- •7.3.5 CRC (Cyclic Redundancy Check)
- •7.3.6 Automatic packet assembly
- •7.3.7 Automatic packet disassembly
- •7.4 Automatic packet transaction handling
- •7.4.1 Auto acknowledgement
- •7.4.2 Auto Retransmission (ART)
- •7.5 Enhanced ShockBurst flowcharts
- •7.5.1 PTX operation
- •7.5.2 PRX operation
- •7.8.1 Single transaction with ACK packet and interrupts
- •7.8.2 Single transaction with a lost packet
- •7.8.3 Single transaction with a lost ACK packet
- •7.8.4 Single transaction with ACK payload packet
- •7.8.5 Single transaction with ACK payload packet and lost packet
- •7.8.6 Two transactions with ACK payload packet and the first ACK packet lost
- •7.8.7 Two transactions where max retransmissions is reached
- •7.9 Compatibility with ShockBurst™
- •7.9.1 ShockBurst™ packet format
- •8 Data and Control Interface
- •8.1 Features
- •8.2 Functional description
- •8.3 SPI operation
- •8.3.1 SPI commands
- •8.3.2 SPI timing
- •8.4 Data FIFO
- •8.5 Interrupt
- •9 Register Map
- •9.1 Register map table
- •10 Peripheral RF Information
- •10.1 Antenna output
- •10.2 Crystal oscillator
- •10.3 nRF24L01+ crystal sharing with an MCU
- •10.3.1 Crystal parameters
- •10.3.2 Input crystal amplitude and current consumption
- •10.4 PCB layout and decoupling guidelines
- •11 Application example
- •11.1 PCB layout examples
- •12 Mechanical specifications
- •13 Ordering information
- •13.1 Package marking
- •13.2 Abbreviations
- •13.3 Product options
- •13.3.1 RF silicon
- •13.3.2 Development tools
- •14 Glossary of Terms
- •Appendix A - Enhanced ShockBurst™ - Configuration and communication example
- •Enhanced ShockBurst™ transmitting payload
- •Enhanced ShockBurst™ receive payload
- •Appendix B - Configuration for compatibility with nRF24XX
- •Appendix C - Constant carrier wave output for testing
- •Configuration
nRF24L01+ Product Specification
12 Mechanical specifications
nRF24L01+ uses the QFN20 4x4 package, with matt tin plating.
Revision 1.0 |
Page 71 of 78 |
nRF24L01+ Product Specification
Package Type |
|
A |
A1 |
A3 |
K |
D/E |
e |
D2/E2 |
L |
L1 |
b |
Saw QFN20 |
Min. |
0.80 |
0.00 |
|
|
|
|
2.50 |
0.35 |
|
0.18 |
(4x4 mm) |
Typ. |
0.85 |
0.02 |
0.20 |
0.20 |
4.0 |
0.5 BSC |
2.60 |
0.40 |
0.15 |
0.25 |
|
Max |
0.95 |
0.05 |
REF. |
min. |
BSCa |
|
2.70 |
0.45 |
max |
0.30 |
a. BSC: Basic Spacing between Centers, ref. JEDEC standard 95, page 4.17-11/A
Figure 39. nRF24L01+ Package Outline
Revision 1.0 |
Page 72 of 78 |
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