- •CONTENTS
- •FIGURES
- •TABLES
- •1.1 Manual Contents
- •1.2 Notational Conventions and Terminology
- •1.3 Related Documents
- •1.4 Application Support Services
- •2.1 Typical Applications
- •2.2 Microcontroller Features
- •2.3 Functional Overview
- •2.3.1 Core
- •2.3.1.3 Register File
- •2.3.2 Memory Controller
- •2.4 Internal Timing
- •2.4.1 Clock and Power Management Logic
- •2.4.2 Internal Timing
- •2.4.2.1 Clock Failure Detection Logic
- •2.4.2.2 External Timing
- •2.4.2.3 Power Management Options
- •2.4.3 Internal Memory
- •2.4.4 Serial Debug Unit
- •2.4.5 Interrupt Service
- •2.5 Internal Peripherals
- •2.5.1 I/O Ports
- •2.5.2 Serial I/O (SIO) Port
- •2.5.3 Synchronous Serial I/O (SSIO) Port
- •2.5.4 Event Processor Array (EPA) and Timer/Counters
- •2.5.7 Stack Overflow Module
- •2.5.8 Watchdog Timer
- •2.6 Special Operating Modes
- •2.7 Chip Configuration Registers
- •3.1 Overview of the Instruction Set
- •3.1.1 BIT Operands
- •3.1.2 BYTE Operands
- •3.1.4 WORD Operands
- •3.1.5 INTEGER Operands
- •3.1.9 Converting Operands
- •3.1.10 Conditional Jumps
- •3.1.11 Floating-Point Operations
- •3.1.12 Extended Instructions
- •3.2 Addressing Modes
- •3.2.1 Direct Addressing
- •3.2.2 Immediate Addressing
- •3.2.3 Indirect Addressing
- •3.2.3.1 Extended Indirect Addressing
- •3.2.3.2 Indirect Addressing with Autoincrement
- •3.2.3.3 Extended Indirect Addressing with Autoincrement
- •3.2.3.4 Indirect Addressing with the Stack Pointer
- •3.2.4 Indexed Addressing
- •3.2.4.3 Extended Indexed Addressing
- •3.2.4.4 Zero-indexed Addressing
- •3.3 Considerations for Crossing Page Boundaries
- •3.4 Software Protection Features and Guidelines
- •4.1 Memory Map Overview
- •4.2 Memory Partitions
- •4.2.1 External Memory
- •4.2.2 Internal ROM
- •4.2.2.1 Program Memory in Page FFH
- •4.2.2.3 Reserved Memory Locations
- •4.2.2.4 Interrupt, PIH, and PTS Vectors
- •4.2.2.5 Chip Configuration Bytes
- •4.2.3 Internal RAM (Code RAM)
- •4.2.4.2 Peripheral SFRs
- •4.2.5 Register File
- •4.2.5.2 Stack Pointer (SP)
- •4.3 Windowing
- •4.3.1 Selecting a Window
- •4.3.2 Addressing a Location Through a Window
- •4.3.2.4 Unsupported Locations Windowing Example
- •4.3.2.5 Using the Linker Locator to Set Up a Window
- •4.3.3 Windowing and Addressing Modes
- •4.4 Controlling Read Access to the Internal ROM
- •4.5 Remapping Internal ROM
- •5.1 Functional Overview
- •5.2 Stack Operations
- •5.3 Stack Overflow Module Registers
- •5.4 Programming the Stack Overflow Module
- •5.4.1 Initializing the Stack Pointer
- •5.4.2 Enabling the Stack Overflow Module and Specifying Stack Boundaries
- •6.1 Overview of the Interrupt Control Circuitry
- •6.2 Interrupt Signals and Registers
- •6.3 Interrupt Sources, Priorities, and Vector Addresses
- •6.3.1 PIH Interrupt Sources, Priorities, and Vector Addresses
- •6.3.1.1 Using Software to Provide the Vector Address
- •6.3.1.2 Providing the Vector Address in Response to a CPU Request
- •6.3.2 Special Interrupts
- •6.3.2.1 Unimplemented Opcode
- •6.3.2.2 Software Trap
- •6.3.2.4 Stack Overflow
- •6.3.3 External Interrupt Signal
- •6.3.4 Shared Interrupt Requests
- •6.4 Interrupt Latency
- •6.4.1 Situations that Increase Interrupt Latency
- •6.4.2 Calculating Latency
- •6.4.2.2 PTS Interrupt Latency
- •6.5 Programming the Interrupts
- •6.5.1 Modifying Interrupt Priorities
- •6.5.2 Determining the Source of an Interrupt
- •6.6 Initializing the PTS Control Blocks
- •6.6.1 Specifying the PTS Count
- •6.6.2 Selecting the PTS Mode
- •6.6.3 Single Transfer Mode
- •6.6.4 Block Transfer Mode
- •6.6.5 Dummy Mode
- •7.1 I/O Ports Overview
- •7.2 Configuring the Port Pins
- •7.2.2 Configuring Ports 3 and 4 (Address/Data Bus)
- •7.2.3 Port Configuration Example
- •7.3.1 Address and Data Signals (Ports 3, 4, and EPORT)
- •7.3.1.1 EPORT Status During Reset, CCB Fetch, Idle, Powerdown, and Hold
- •7.3.5 External Interrupt Signal (Port 2)
- •7.3.6 PWM Signals (Port 11)
- •7.3.7 Serial I/O Port Signals (Ports 2 and 7)
- •7.3.8 Special Operating Mode Signal (Port 5 Pin 7)
- •7.3.9 Synchronous Serial I/O Port Signals (Port 10)
- •7.4 I/O Port Internal Structures
- •7.4.3 Internal Structure for Ports 3 and 4 (Address/Data Bus)
- •8.1 Serial I/O (SIO) Port Functional Overview
- •8.2 Serial I/O Port Signals and Registers
- •8.3 Serial Port Modes
- •8.3.1 Synchronous Mode (Mode 0)
- •8.3.2 Asynchronous Modes (Modes 1, 2, and 3)
- •8.3.2.1 Mode 1
- •8.3.2.2 Mode 2
- •8.3.2.3 Mode 3
- •8.3.2.4 Multiprocessor Communications
- •8.4 Programming the Serial Port
- •8.4.1 Configuring the Serial Port Pins
- •8.4.2 Programming the Control Register
- •8.4.3 Programming the Baud Rate and Clock Source
- •8.4.4 Enabling the Serial Port Interrupts
- •8.4.5 Determining Serial Port Status
- •CHAPTER 9 Synchronous Serial I/O (SSIO) Port
- •9.1 SSIO Port Overview
- •9.1.1 Standard Mode
- •9.1.2 Duplex Mode
- •9.2 SSIO pORT sIGNALS AND rEGISTERS
- •9.3 ssio Port Operation
- •9.3.1 Transmitting and Receiving Data
- •9.3.1.1 Normal Transfers (All Modes)
- •9.3.1.2 Handshaking Transfers (Standard Mode Only)
- •9.4 Programming the SSIO Port
- •9.4.1 Configuring the SSIO Port Pins
- •9.4.2 Configuring the SSIO Registers
- •9.4.2.1 The SSIO Baud (SSIO_BAUD) Register
- •9.4.2.3 The SSIO 0 Clock (SSIO0_CLK) Register
- •9.4.2.4 The SSIO 1 Clock (SSIO1_CLK) Register
- •9.4.3 Enabling the SSIO Interrupts
- •9.5 Programming Considerations
- •9.5.2 Standard Mode Considerations
- •9.5.3 Duplex Mode Considerations
- •10.1 PWM FUNCTIONAL OVERVIEW
- •10.2 PWM Signals and Registers
- •10.3 pwm operation
- •10.4 Programming the Frequency and Period
- •10.5 Programming the Duty Cycle
- •10.5.1 Sample Calculations
- •10.5.2 Reading the Current Value of the Down-counter
- •10.5.3 Enabling the PWM Outputs
- •10.5.4 Generating Analog Outputs
- •11.1 EPA Functional Overview
- •11.2 EPA and Timer/Counter Signals and Registers
- •11.3 Timer/Counter Functional Overview
- •11.3.1 Timer Multiplexing on the Time Bus
- •11.4 EPA Channel Functional Overview
- •11.4.1 Operating in Input Capture Mode
- •11.4.2 Operating in Output Compare Mode
- •11.4.3 Operating in Compare Mode with the Output/Simulcapture Channels
- •11.4.4 Generating a 32-bit Time Value
- •11.4.5 Controlling a Pair of Adjacent Pins
- •11.5 Programming the EPA and Timer/Counters
- •11.5.1 Configuring the EPA and Timer/Counter Signals
- •11.5.2 Programming the Timers
- •11.5.3 Programming the Capture/Compare Channels
- •11.5.4 Programming the Compare-only (Output/Simulcapture) Channels
- •11.6 Enabling the EPA Interrupts
- •11.7 Determining Event Status
- •CHAPTER 12 Analog-to-digital (A/D) Converter
- •12.1 A/D Converter Functional Overview
- •12.2 A/D Converter Signals and Registers
- •12.3 A/D Converter Operation
- •12.4 Programming the A/D Converter
- •12.4.1 Programming the A/D Test Register
- •12.4.2 Programming the A/D Result Register (for Threshold Detection Only)
- •12.4.3 Programming the A/D Time Register
- •12.4.4 Programming the A/D Command Register
- •12.4.5 Programming the A/D Scan Register
- •12.4.6 Enabling the A/D Interrupt
- •12.5 Determining A/D Status and Conversion Results
- •12.6 Design Considerations
- •12.6.1 Designing External Interface Circuitry
- •12.6.1.1 Minimizing the Effect of High Input Source Resistance
- •12.6.1.2 Suggested A/D Input Circuit
- •12.6.1.3 Analog Ground and Reference Voltages
- •12.6.2 Understanding A/D Conversion Errors
- •CHAPTER 13 Minimum Hardware Considerations
- •13.1 Minimum Connections
- •13.1.1 Unused Inputs
- •13.1.2 I/O Port Pin Connections
- •13.2 Applying and Removing Power
- •13.3 Noise Protection Tips
- •13.4 The On-chip Oscillator Circuitry
- •13.5 Using an External Clock Source
- •13.6 Resetting the Microcontroller
- •13.6.1 Generating an External Reset
- •13.6.2 Issuing the Reset (RST) Instruction
- •13.6.3 Issuing an Illegal IDLPD Key Operand
- •13.6.4 Enabling the Watchdog Timer
- •13.6.5 Detecting Clock Failure
- •13.7 Identifying the Reset Source
- •14.1 Special Operating Mode Signals and Registers
- •14.2 Reducing Power Consumption
- •14.3 Idle Mode
- •14.3.1 Enabling and Disabling Idle Mode
- •14.3.2 Entering and Exiting Idle Mode
- •14.4 Powerdown Mode
- •14.4.1 Enabling and Disabling Powerdown Mode
- •14.4.2 Entering Powerdown Mode
- •14.4.3 Exiting Powerdown Mode
- •14.4.3.1 Generating a Hardware Reset
- •14.4.3.2 Asserting the External Interrupt Signal
- •14.4.3.3 Selecting an External Capacitor
- •14.5 ONCE Mode
- •CHAPTER 15 Interfacing with External Memory
- •15.1 Internal and External Addresses
- •15.2 External Memory Interface Signals and Registers
- •15.3 The Chip-select Unit
- •15.3.1 Defining Chip-select Address Ranges
- •15.3.2 Controlling Bus Parameters
- •15.3.3 Chip-select Unit Initial Conditions
- •15.3.4 Programming the Chip-select Registers
- •15.3.5 Example of a Chip-select Setup
- •15.4 Chip Configuration Registers and Chip Configuration Bytes
- •15.5 Bus Width and Multiplexing
- •15.5.1 A 16-bit Example System
- •15.5.2 16-bit Bus Timings
- •15.5.3 8-bit Bus Timings
- •15.5.4 Comparison of Multiplexed and Demultiplexed Buses
- •15.6 Wait States (Ready Control)
- •15.7 Bus-hold Protocol
- •15.7.1 Enabling the Bus-hold Protocol
- •15.7.2 Disabling the Bus-hold Protocol
- •15.7.3 Hold Latency
- •15.7.4 Regaining Bus Control
- •15.8 Write-control Modes
- •15.9 System Bus AC Timing Specifications
- •15.9.1 Deferred Bus-cycle Mode
- •15.9.2 Explanation of AC Symbols
- •15.9.3 AC Timing Definitions
- •16.1 Serial Debug Unit (SDU) Functional Overview
- •16.2 SDU Signals and Registers
- •16.3 SDU Operation
- •16.3.1 SDU State Machine
- •16.3.2 Code RAM Access State Machine
- •16.3.3 Minimizing Latency
- •16.4 Code RAM Access
- •16.4.1 Code RAM Data Transfer
- •16.4.2 Code RAM Access Instructions
- •16.4.3 Code RAM Data Transfer Example
- •16.5 SDU Interface Connector
- •17.1 Signals and Registers
- •17.2 Memory Protection Options
- •17.3 Entering Test-ROM Routines
- •17.3.1 Power-up and Power-down Sequences
- •17.4 ROM-dump Routine and Circuit
- •17.5 Serial Port Mode Routine
- •17.5.1 Serial Port RISM
- •17.5.2 Serial Port Mode Circuit
- •17.6 SDU RISM Execution Routine
- •17.6.1 SDU RISM Data Transfer
- •17.6.1.1 SDU RISM Data Transfer Before
- •17.6.1.2 SDU RISM Data Transfer After
- •17.6.2 SDU RISM Execution Circuit
- •17.7 RISM Command Descriptions
- •17.8 Executing Programs from Register RAM
- •17.9 RISM Command Examples
- •17.9.1 Serial Port Mode RISM Read Command Example
- •17.9.2 Serial Port Mode RISM Write Command Example
- •17.9.3 SDU RISM Execution Write Command Example
- •17.9.4 SDU RISM Execution Go Command Example
- •B.1 Functional Groupings of Signals
- •B.2 Signal Descriptions
- •B.3 Default Conditions
8XC196EA USER’S MANUAL
12.6.1 Designing External Interface Circuitry
The external interface circuitry to an analog input is highly dependent upon the application and can affect the converter characteristics. Factors such as input pin leakage, sample capacitor size, and multiplexer series resistance from the input pin to the sample capacitor must be considered in the external circuit’s design. These factors are idealized in Figure 12-9.
|
|
Sample |
|
External |
Internal |
RF |
|
|
|
||
RSOURCE |
~1K |
~2pF |
|
AV |
|||
|
R1 |
||
|
CS |
||
V |
|
||
+ |
ILI1 |
|
|
- |
Leakage |
|
|
|
|
||
|
|
A6021-01 |
Figure 12-9. Idealized A/D Sampling Circuitry
During the sample window, the external input circuit must be able to charge the sample capacitor
(CS) through the series combination of the input source resistance (RSOURCE), the input series resistance (R1), and the comparator feedback resistance (RF). The total effective series resistance
(RT) is calculated using the following formula, where AV is the gain of the comparator circuit.
RF
RT = RSOURCE + R1 + ----------------
AV + 1
Typically, the (RF / AV + 1) term is the major contributor to the total resistance and the factor that determines the minimum sample time specified in the datasheet.
12-14
ANALOG-TO-DIGITAL (A/D) CONVERTER
12.6.1.1Minimizing the Effect of High Input Source Resistance
Under some conditions, the input source resistance (RSOURCE) can be great enough to affect the measurement. You can minimize this effect by increasing the sample time or by connecting an
external capacitor (CEXT) from the input pin to ANGND. The external signal will charge CEXT to the source voltage level. When the channel is sampled, CEXT acts as a low-impedance source to charge the sample capacitor (CS). A small portion of the charge in CEXT is transferred to CS, resulting in a drop of the sampled voltage. The voltage drop is calculated using the following formula.
Sampled Voltage Drop, % = |
CS |
× 100% |
--------------------------- |
CEXT + CS
If CEXT is 0.005 µF or greater, the error will be less than –0.4 LSB in 10-bit conversion mode. The
use of CEXT in conjunction with RSOURCE forms a low-pass filter that reduces noise input to the A/D converter.
High RSOURCE resistance can also cause errors due to the input leakage (ILI1). ILI1 is typically much lower than its specified maximum (consult the datasheet for specifications). The combined effect
of ILI1 leakage and high RSOURCE resistance is calculated using the following formula.
|
RSOURCE × ILI1 × 1024 |
error (LSBs) = ----------------------------------------------------------- |
|
|
VREF |
where: |
|
RSOURCE |
is the input source resistance, in ohms |
ILI1 |
is the input leakage, in amperes |
VREF |
is the reference voltage, in volts |
External circuits with RSOURCE resistance of 1 kΩ or lower and VREF equal to 5.0 volts will have a resultant error due to source impedance of 0.6 LSB or less.
12-15
8XC196EA USER’S MANUAL
12.6.1.2Suggested A/D Input Circuit
The suggested A/D input circuit shown in Figure 12-10 provides limited protection against overvoltage conditions on the analog input. Should the input voltage be driven significantly below ANGND or above VREF, diode D2 or D1 will forward bias at about 0.8 volts. The device’s input protection begins to turn on at approximately 0.5 volts beyond ANGND or VREF. The 270Ω resistor limits the current input to the analog input pin to a safe value, less than 1 mA.
NOTE
Driving any analog input more than 0.5 volts beyond ANGND or VREF begins to activate the input protection devices. This drives current into the internal reference circuitry and substantially degrades the accuracy of A/D conversions on all channels.
VREF |
|
|
|
VREF |
|
D1 |
270 |
|
100 |
||
(Optional) |
ACHx |
|
0.005 F |
||
D2 |
||
|
ANGND |
|
|
8XC196 Device |
|
|
ANGND |
|
|
A6022-01 |
Figure 12-10. Suggested A/D Input Circuit
12.6.1.3Analog Ground and Reference Voltages
Reference supply levels strongly influence the absolute accuracy of the conversion. For this reason, we recommend that you tie the ANGND pin to the VSS pin as close to the device as possible, using a minimum trace length. In a noisy environment, we highly recommend the use of a separate analog ground plane that connects to VSS at a single point as close to the device as possible. IREF may vary between 2 mA and 5 mA during a conversion. To minimize the effect of this fluctuation, mount a 1.0 µF ceramic or tantalum bypass capacitor between V REF and ANGND, as close to the device as possible.
12-16