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Patterson, Bailey - Solid State Physics Introduction to theory

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336 6 Semiconductors

What are surface states? A solid surface is a solid terminated at a twodimensional surface. The effect on charge carriers is modeled by using a surface potential barrier. This can cause surface states with energy levels in the forbidden gap. The name “surface states” is used because the corresponding wave function is localized near the surface. Further comments about surface states are found in Chap. 11.

Surface states can have interesting effects, which we will illustrate with an example. Let us consider a p-type semiconductor (bulk) with surface states that are donors. The situation before and after equilibrium is shown in Fig. 6.20. For the equilibrium case (b), we assume that all donor states have given up their electrons, and hence, are positively charged. Thus, the Fermi energy is less than the donorlevel energy. A particularly interesting case occurs when the Fermi level is pinned at the surface donor level. This occurs when there are so many donor states on the surface that not all of them can be ionized. In that case (b), the Fermi level would be drawn on the same level as the donor level.

One can calculate the amount of band bending by a straightforward calculation. The band bending is caused by the electrons flowing from the donor states at the surface to the acceptor states in the bulk. For the depletion region, we assume,

ρ(x) = −eNa

(6.194)

 

dE

 

=

eNa

.

(6.195)

 

dx

 

 

 

 

 

 

 

ε

 

So,

 

 

 

 

 

 

 

 

d2V

=

eNa

.

(6.196)

 

dx2

 

 

 

 

 

 

ε

 

If nd is the number of donors per unit area, the surface charge density is σ = end. The boundary condition at the surface is then

E

surface

= − dV

 

 

 

=

end

.

(6.197)

 

 

 

 

 

 

dx

 

x=0

 

ε

 

 

 

 

 

 

 

 

 

 

 

If the width of the depletion layer is d, then

 

 

 

 

 

E(x = d) = 0 .

(6.198)

Integrating (6.196) with boundary condition (6.198) gives

 

 

E =

eNa

(d x) .

(6.199)

 

 

 

 

 

 

ε

 

 

 

 

Using the boundary condition (6.197), we find

 

 

 

 

 

 

d =

nd

.

 

 

 

(6.200)

 

 

 

 

 

 

 

 

 

 

Na

 

 

 

 

6.3 Semiconductor Device Physics

337

 

 

Integrating a second time, we find

V =

eNa

x2

eNad

x + constant .

(6.201)

 

 

 

2ε

ε

 

 

 

 

 

 

 

Therefore, the total amount of band bending is

 

 

 

 

 

 

 

 

 

 

e2N

a

d 2

 

e

2n2

 

e[V (0) V (d )] =

 

 

 

=

 

d

.

(6.202)

2ε

 

 

 

 

 

 

 

 

 

2εNa

 

This band bending is caused entirely by the assumed ionized donor surface states. We have already mentioned that surface states can complicate the analysis of metal-semiconductor junctions.

CB

VB

(a) negative

CB

VB

(b) positive

CB

Fermi

Level

VB

(c) strong positive

Fig. 6.21. p-type semiconductor under bias voltage (energies in each figure are relative)

6.3.7 Surfaces Under Bias Voltage (EE)

Let us consider a p-type surface under three kinds of voltage shown in Fig. 6.21:

(a) a negative bias voltage, (b) a positive bias voltage, and then (c) a very strong, positive bias voltage.

In case (a), the bands bend upward, holes are attracted to the surface, and thus, an accumulation layer of holes is founded. In (b), holes are repelled from the surface forming the depletion layer. In (c) the bands are bent sufficiently such that the conduction band bottom is below the Fermi energy and the semiconductor becomes n-type, forming an inversion region. In all these cases, we are essentially considering a capacitor with the semiconductor forming one plate. These ideas have been further developed into the MOSFET (metal-oxide semiconductor fieldeffect transistor, see Sect. 6.3.10).

338 6 Semiconductors

6.3.8 Inhomogeneous Semiconductors Not in Equilibrium (EE)

Here we will discuss pn-junctions under bias and how this leads to electron and hole injection. We will start with a qualitative treatment and then do a more quantitative analysis. The study of pn-junctions is fundamental for the study of transistors.

Fig. 6.22. The pn-junction under bias V: (a) Forward bias, (b) Reverse bias. (Only relative shift is shown)

We start by looking at a pn-junction in equilibrium where there are two types of electron flow that balance in equilibrium (as well as two types of hole flow which also balance in equilibrium). See also, e.g., Kittel [6.17, p. 572] or Ashcroft and Mermin [6.2, p. 600].

From the n-side to the p-side, there is an electron recombination (r) or diffusion current (Jnr) where n denotes electrons. This is due to the majority carrier electrons, which have enough energy to surmount the potential barrier. This current is very sensitive to a bias field that would change the potential barrier. On the p-side, there are thermally generated electrons, which in the space-charge region may be swiftly swept downhill into the n-region. This causes the thermal generation (g) or drift current (Jng). Electrons produced farther than a diffusion

6.3 Semiconductor Device Physics

339

 

 

length (to be defined) recombine before being swept across. As mentioned, in the absence of potential, the electron currents balance and we have

Jnr (0) + Jng (0) = 0 ,

(6.203)

where the 0 in Jnr(0), etc. means zero bias voltage. Similarly, for holes, denoted by p,

J pr (0) + J pg (0) = 0 .

(6.204)

We set the notation that forward bias (V > 0) is when the p-side is higher in potential than the n-side. See Fig. 6.22. Since the barrier responds exponentially to the bias voltage, we might expect the electron injection current, from n to p, to be given by

eV

Jnr (V ) = Jnr (0) exp

.

kT

The thermal generation current is essentially independent of voltage so Jng (V ) = Jng (0) = −Jnr (0) .

Similarly, for injection of holes from p to n, we expect

eV

J pr (V ) = J pr (0) exp

,

kT

and similarly for the generation current,

J pg (V ) = J pg (0) = −J pr (0) .

(6.205)

(6.206)

(6.207)

(6.208)

Adding everything up, we get the Shockley diode equation for a pn-junction under bias

J = Jnr (V ) + Jng (V ) + J pr (V ) + J pg (V )

(6.209)

= J0[exp(eV / kT ) 1]

 

where J0 = Jnr(0) + Jpr(0).

We now give a more detailed derivation, in which the exponential term is more carefully argued, and J0 is calculated. We assume that both electrons and holes recombine (due to various processes) with characteristic recombination times τn and τp. The usual assumption is, that as far as net recombination goes with no flow,

p

 

p p

0

 

 

 

= −

 

,

(6.210)

τ p

 

∂τ r

 

 

 

 

340 6 Semiconductors

and

n

 

n n

 

 

= −

0

,

(6.211)

 

∂τ r

 

τn

 

where r denotes recombination. Assuming no external generation of electrons or holes, the continuity equation with flow and recombination can be written (in one dimension):

J p

 

p

 

p p

0

 

 

 

 

 

 

 

 

 

 

 

 

x

+ e

∂τ

= −e

τ

 

 

 

,

(6.212)

 

 

p

 

 

 

 

 

 

 

 

 

 

 

 

Jn

 

n

 

n n0

 

 

 

 

x

e

∂τ

= +e

τn .

The electron and hole current densities are given by

J p = −eDp px + epμp E , Jn = eDn nx + enμn E .

And, as always, we assume Gauss’ law, where ρ is the total charge density

Ex = ερ . We will also assume a steady state, so

pt = nt = 0 .

(6.213)

(6.214)

(6.215)

(6.216)

(6.217)

 

p

 

 

n

 

Homogeneous

Diffusion

Depletion

Depletion

Diffusion

Homogeneous

p region

region

region

region

region

n region

 

Lp

 

 

Ln

 

 

 

x = dp

x = 0

x = dn

 

Fig. 6.23. Schematic of pn-junction (p region for x < 0 and n region for x > 0). Ln and Lp are n and p diffusion lengths

6.3 Semiconductor Device Physics

341

 

 

An explicit solution is fairly easy to obtain if we make three further assumptions (See Fig. 6.23):

(a)The electric field is very small outside the depletion region, so whatever drop in potential there is occurs across the depletion region.

(b)The concentrations of injected minority carriers in the region outside the depletion region is negligible compared to the majority carrier concentration. Also, the majority carrier concentration is essentially constant beyond the depletion and diffusion regions.

(c)Finally, we assume negligible generation or recombination of carriers in the depletion region. We can argue that this ought to be a good approximation if the depletion layer is sufficiently thin. Under this approximation, the electron and hole currents are constant across the depletion region.

A few further comments are necessary before we analyze the pn-junction. In the depletion region there are both drift and diffusion currents that are large. In the nonequilibrium case they do not quite cancel. Consistent with this the electric fields, gradient of carrier densities and space charge are all large. Electric fields can be so large here as to lead to the validity of the semiclassical model being open to question. However, we are only trying to develop approximate device equations so our approximations are probably OK.

The diffusion region only exists under applied voltage. The minority drift current is negligible here but the gradient of carrier densities can still be appreciable as can the drift current even though electric fields and space charges are small. The majority drift current is not small as the majority density is large.

In the homogeneous region the whole current is carried by drift and both diffusion currents are negligible. The carrier densities are nearly the same as in equilibrium, but the electric field, space charge, and gradient of carrier densities are all small.

For any x (the direction along the pn-junction, see Fig. 6.23), the total current should be given by

Jtotal = Jn (x) + J p (x) .

(6.218)

Since by (c) both Jn and Jp are independent of x in the depletion region, we can evaluate them for the x that is most convenient, see Fig. 6.23,

Jtotal = Jn (d p ) + J p (dn ) .

(6.219)

That is, we need to evaluate only minority current densities. Also, since by (a) and (b), the minority current drift densities are negligible, we can write

J

 

= eD n

 

 

eD

p

 

(6.220)

 

 

 

,

 

total

n x

 

x = −d p

 

p x

 

x = −dn

 

 

 

 

 

 

 

342 6 Semiconductors

which means we only need to find the minority carrier concentrations. In the steady state, neglecting carrier drift currents, we have

d2 pn pn pn0 dx2 L2p

and

d2np np np0 dx2 L2n

= 0 , for x dn ,

(6.221)

= 0 , for x ≤ −d p ,

(6.222)

where the diffusion lengths are defined by

 

L2p = Dpτ p ,

(6.223)

and

 

L2n = Dnτn .

(6.224)

Diffusion lengths measure the distance a carrier goes before recombining. The solutions obeying appropriate boundary conditions can be written

pn (x) pn0

= [ pn (dn ) pn0

 

(x dn )

 

]exp

 

Lp

 

 

,

 

 

 

 

 

 

 

 

and

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(x + d

p

)

np (x) np0

= [np (dp) np0

 

+

 

 

 

 

 

]exp

 

Ln

 

 

 

.

 

 

 

 

 

 

 

 

 

Thus,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

p

n

 

 

=

[ pn (dn ) pn

0

]

 

,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

and

 

 

 

x

 

x=dn

 

 

Lp

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

+

np

 

 

 

 

=

[np (d p ) np

0

]

.

 

 

 

 

 

 

 

x

 

 

 

 

 

 

L

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Thus,

 

 

 

 

 

x=−d p

 

 

 

n

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

eD

 

 

 

 

 

 

 

 

 

eDp

 

 

 

 

 

 

 

n

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Jtotal =

L

 

[np (d p )

np0

] +

L

p

[ pn (dn ) pn0 ] .

 

n

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

(6.225)

(6.226)

(6.227)

(6.228)

(6.229)

6.3 Semiconductor Device Physics 343

To finish the calculation, we need expressions for np(−dp) − np0 and pn(−dn) − pn0, which are determined by the injected minority carrier densities.

Across the depletion region, even with applied bias, Jn and Jp are very small compared to individual drift and diffusion currents of electrons and holes (which nearly cancel). Therefore, we can assume Jn 0 and Jp 0 across the depletion regions. Using the Einstein relations, as well as the definition of drift and diffusion currents, we have

kT nx = en ϕx ,

and

kT px = −ep ϕx . Integrating across the depletion region

n(dn )

 

 

e

 

 

= exp

+

 

[ϕ(dn ) ϕ(d p )] ,

n(d p )

kT

 

 

 

and

(6.230)

(6.231)

(6.232)

p(dn )

 

 

e

 

 

 

= exp

 

[ϕ(dn ) ϕ(d p )] .

(6.233)

p(d p )

kT

 

 

 

 

If φ is the built-in potential and φb is the bias voltage with the conventional sign

 

 

 

 

ϕ(dn ) ϕ(d p ) =

ϕ ϕb .

 

 

 

 

 

(6.234)

Thus,

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

n(d

n

)

e

ϕ

 

 

eϕ

b

 

 

nn

0

 

 

 

eϕ

b

 

 

 

 

 

= exp

 

 

exp

 

 

=

 

 

exp

 

,

(6.235)

 

 

 

 

 

 

 

 

np0

 

 

 

n(d p )

kT

 

 

kT

 

 

 

kT

 

and

p(d

n

)

 

 

 

 

= exp

p(d p )

 

 

e ϕ

eϕ

b

 

 

pn

0

 

 

eϕ

b

 

 

 

exp

 

 

=

 

exp

 

.

(6.236)

 

 

 

p p0

 

 

kT

 

 

kT

 

 

 

kT

 

By assumption (b)

 

n(dn ) nn0 ,

(6.237)

and

 

p(d p ) p p0 .

(6.238)

344 6 Semiconductors

So, we find

 

 

 

 

 

 

 

 

 

 

 

eϕ

b

 

n

p

(d

p

) = n

p0

exp

 

 

,

 

 

 

 

 

 

 

 

 

 

kT

 

 

 

 

 

 

 

 

 

 

 

and

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

eϕ

b

 

p

n

(d

n

) = p

n0

exp

 

 

.

 

 

 

 

 

 

 

 

 

kT

 

 

 

 

 

 

 

 

 

 

 

(6.239)

(6.240)

Substituting, we can find the total current, as given by the Shockley diode equation

 

D

 

 

Dp

 

 

eϕ

b

 

 

 

 

n

 

 

 

 

 

 

 

 

 

 

Jtotal = e

Ln

np0

+

Lp

pn0

exp

kT

 

1 .

(6.241)

 

 

 

 

 

 

 

 

 

Reverse Bias Breakdown (EE)

The Shockley diode equation indicates that the current attains a constant value of −J0 when the reverse bias is sufficiently strong. Actually, under large reverse bias, the Shockley diode equation is no longer valid and the current becomes arbitrarily large and negative. There are two mechanisms for this reverse current breakdown, as we discuss below (which may or may not destroy the device).

One is called the Zener breakdown. This is due to quantum-mechanical interband tunneling and involves a breakdown of the quasiclassical approximation. It can occur at lower voltages in narrow junctions with high doping. At higher voltages, another mechanism for reverse bias breakdown is dominant. This is the avalanche mechanism. The electric field in the junction accelerates electrons in the electric field. When the electron gains kinetic energy equal to the gap energy, then the electron can create an electron–hole pair (ee+ e+ h). If the sample is wide enough to allow further accelerations and/or if the electrons themselves retain sufficient energy, then further electron–hole pairs can form, etc. Since a very narrow junction is required for tunneling, avalanching is usually the mode by which reverse bias breakdown occurs.

6.3.9 Solar Cells (EE)

One of the most important applications of pn-junctions is for obtaining energy of the sun. Compare, e.g., Sze, [6.42, p. 473]. The photovoltaic effect is the appearance of a forward voltage across an illuminated junction. By use of the photovoltaic effect, the energy of the sun, as received at the earth, can be converted directly into electrical power. When the light is absorbed, mobile electron–hole pairs are created, and they may diffuse to the pn-junction region if they are created nearby (within a diffusion length). Once in this region, the large built-in electric field acts on electrons on the p-side, and holes on the n-side to produce a voltage that drives a current in the external circuit.

6.3 Semiconductor Device Physics

345

 

 

The first practical solar cell was developed at Bell Labs in 1954 (by Daryl M. Chapin, Calvin S. Fuller, and Gerald L. Pearson). A photovoltaic cell converts sunlight directly into electrical energy. An antireflective coating is used to maximize energy transfer. The surface of the earth receives about 1000 W/m2 from the sun. More specifically, AM0 (air mass zero) has 1367 W/m2, while AM1 (directly overhead through atmosphere without clouds) is 1000 W/m2. Solar cells are used in spacecraft as well as in certain remote terrestrial regions where an economical power grid is not available.

If PM is the maximum power produced by the solar cell and PI is the incident solar power, the efficiency is

E =100

PM

% .

(6.242)

 

 

P

 

 

I

 

A typical efficiency is of order 10%. Efficiencies are limited because photons with energy less than the bandgap energy do not create electron–hole pairs and so, cannot contribute to the output power. On the other hand, photons with energy much greater than the bandgap energy tend to produce carriers that dissipate much of their energy by heat generation. For maximum efficiency, the bandgap energy needs to be just less than the energy of the peak of the solar energy distribution. It turns out that GaAs with E 1.4 eV tends to fit the bill fairly well. In principle, GaAs can produce an efficiency of 20% or so.

The GaAs cell is covered by a thin epitaxial layer of mixed GaAs-AlAs that has a good lattice match with the GaAs and that has a large energy gap thus being transparent to sunlight. The purpose of this over-layer is to reduce the number of surface states (and, hence, the surface recombination velocity) at the GaAs surface. Since GaAs is expensive, focused light can be used effectively. Less expensive Si is often used as a solar cell material.

Single-crystal Si pn-junctions still have the disadvantage of relatively high cost. Amorphous Si is much cheaper, but one cannot make a solar cell with it unless it is treated with hydrogen. Hydrogenated amorphous Si can be used since the hydrogen apparently saturates some dangling or broken bonds and allows pn- junction solar cells to be built. We should mention also that new materials for photovoltaic solar cells are constantly under development. For example, copper indium gallium selenide (CIGS) thin films are being considered as a low-cost alternative.

Let us start with a one-dimensional model. The dark current, neglecting the series resistance of the diode can be written

I =

I

 

 

eV

 

(6.243)

0 exp

 

1 .

 

 

 

 

kT

 

 

 

The illuminated current is

 

 

 

 

 

 

 

 

 

 

 

eV

 

 

IS ,

(6.244)

I = I0 exp

 

1

 

 

 

kT

 

 

 

 

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