ADSP-21262

PACKAGE DIMENSIONS

The ADSP-21262 is available in a 136-ball BGA package and a 144-lead LQFP package shown in Figure 35 and Figure 36.

12.00 BSC SQ

0.80

10.40 BSC SQ

 

 

 

 

 

 

 

 

 

 

 

 

 

 

BSC

 

 

 

 

 

 

 

 

 

 

TYP A

 

 

 

 

 

 

 

 

 

PIN A1 INDICATOR

B

 

 

 

 

 

 

 

 

 

 

C

 

 

 

 

 

 

 

 

 

 

D

 

 

 

 

 

 

 

 

 

 

E

 

 

 

 

 

 

 

 

 

 

F

 

 

 

 

 

 

 

 

 

 

G

 

 

 

 

 

 

 

 

 

 

H

 

 

 

 

 

 

 

 

 

 

J

 

 

 

 

 

 

 

 

 

 

K

 

 

 

 

 

 

 

 

0.80

 

L

 

 

 

 

 

 

 

 

BSC

 

M

 

 

 

 

 

 

 

 

TYP

 

N

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

P

 

 

 

 

 

 

 

 

 

TOP VIEW

 

14 13 12 11 10 9

8

7

6

5

4

3

2

1

 

 

 

 

 

 

 

 

 

 

1.70

DETAIL A

BOTTOM VIEW

 

 

 

 

MAX

 

 

 

 

 

 

 

 

 

 

 

 

 

 

1.

DIMENSIONS ARE IN MILIMETERS (MM).

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

2.

THE ACTUAL POSITION OF THE BALL GRID IS

0.25

 

 

0.50

 

 

 

 

 

 

 

 

 

SEATING

 

WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE

MIN

 

0.45

 

 

 

 

 

 

 

 

 

PLANE

 

TO THE PACKAGE EDGES.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

0.40

 

 

 

 

 

 

 

0.12 MAX (BALL

3.

COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR

 

 

 

 

 

 

 

 

 

 

 

 

(BALL

 

 

 

COPLANARITY)

 

THE BALL DIAMETER.

 

 

 

 

 

 

4.

CENTER DIMENSIONS ARE NOMINAL.

 

 

 

DIAMETER)

 

 

 

 

 

 

DETAIL A

Figure 35. 136-Ball BGA (BC-136-3)

 

 

 

22.00 BSC SQ

 

 

 

20.00 BSC SQ

 

 

144

109

 

 

1

108

 

 

 

PIN 1 INDICATOR

0.27

 

0.50

 

0.22 TYP

 

BSC

 

0.17

 

TYP

 

 

(LEAD

 

 

 

 

 

 

PITCH)

 

SEATING

 

 

 

PLANE

 

 

 

0.08 MAX (LEAD

 

 

 

COPLANARITY)

 

 

 

0.15

 

 

 

0.05

 

 

 

0.75

1.45

 

 

1.40

 

 

0.60 TYP

 

73

1.35

3 6

0.45

 

37

72

 

1.60 MAX

 

 

 

 

 

DETAIL A

 

DETAIL A

 

TOP VIEW (PINS DOWN)

1.DIMENSIONS ARE IN MILLIMETERS AND COMPLY WITH JEDEC STANDARD MS-026-BFB.

2.ACTUAL POSITION OF EACH LEAD

IS WITHIN 0.08 OF ITS IDEAL POSITION WHEN MEASURED IN THE LATERAL DIRECTION.

3.CENTER DIMENSIONS ARE NOMINAL.

Figure 36. 144-Lead LQFP (ST-144-2)

Rev. B | Page 45 of 48 | August 2005

ADSP-21262

ORDERING GUIDE

 

Temperature

Instruction

On-Chip

 

Operating

Package

Package

Model

Range1

Rate

SRAM

ROM

Voltage

Description

Option

ADSP-21262SKBC-200

0°C to +70°C

200 MHz

2M bit

4M bit

1.2 INT/3.3 EXT V

136-Lead BGA

BC-136-3

ADSP-21262SKBCZ2002

0°C to +70°C

200 MHz

2M bit

4M bit

1.2 INT/3.3 EXT V

136-Lead BGA

BC-136-3

ADSP-21262SKSTZ2002

0°C to +70°C

200 MHz

2M bit

4M bit

1.2 INT/3.3 EXT V

144-Lead LQFP

ST-144-2

ADSP-21262SBBC-150

–40°C to +85°C

150 MHz

2M bit

4M bit

1.2 INT/3.3 EXT V

136-Lead BGA

BC-136-3

ADSP-21262SBBCZ1502

–40°C to +85°C

150 MHz

2M bit

4M bit

1.2 INT/3.3 EXT V

136-Lead BGA

BC-136-3

1 Ranges shown represent ambient temperature.

2 Z=Pb-free part.

Rev. B | Page 46 of 48 | September 2005

ADSP-21262

Rev. B | Page 47 of 48 | August 2005

ADSP-21262

© 2005 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.

D04442-0-8/05(B)

Rev. B | Page 48 of 48 | August 2005

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