ORDERING GUIDE

Temperature

Speed Grade

Operating Voltage

Package

Model

Range1

(Max)

(Nom)

Package Description

Option

ADSP-BF531SBB400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF531SBBZ400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF531SBBC400

–40°C to +85°C

400 MHz

1.2 V internal,

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF531SBBCZ4002

–40°C to +85°C

400 MHz

1.2 V internal,

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF531SBST400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF531SBSTZ4002

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF531WBBCZ-4A2,3

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF531WBBZ-4A2,3

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF531WBSTZ-4A2,3

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF531WYBCZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF531WYBZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF532SBB400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF532SBBZ4002

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF532SBBC400

–40°C to +85°C

400 MHz

1.2 V internal,

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF532SBBCZ4002

–40°C to +85°C

400 MHz

1.2 V internal,

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF532SBST400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF532SBSTZ400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF532WBBCZ-4A2

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF532WBBZ-4A2,3

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF532WBSTZ-4A2,3

–40°C to +85°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF532WYBCZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF532WYBZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

Temperature

Speed Grade

Operating Voltage

Package

Model

Range1

(Max)

(Nom)

Package Description

Option

ADSP-BF533SBB500

–40°C to +85°C

500 MHz

1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF533SBBZ5002

–40°C to +85°C

500 MHz

1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF533SBBC500

–40°C to +85°C

500 MHz

1.2 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SBBCZ5002

–40°C to +85°C

500 MHz

1.2 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SBBC-5V

–40°C to +85°C

533 MHz

1.25 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SBBCZ-5V2

–40°C to +85°C

533 MHz

1.2 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SBBCZ4002

–40°C to +85°C

400 MHz

1.25 V internal,

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SBST400

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF533SBSTZ4002

–40°C to +85°C

400 MHz

1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O

176-Lead Quad Flatpack

ST-176-1

(LQFP)

ADSP-BF533SKBC-6V

0°C to +70°C

600 MHz

1.3 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533SKBCZ-6V2

0°C to +70°C

600 MHz

1.3 V Internal

160-Ball Chip Scale Package

BC-160-2

1.8 V, 2.5 V or 3.3 V I/O

Ball Grid Array (CSP_BGA)

ADSP-BF533WBBCZ-5A2,3

–40°C to +85°C

500 MHz

1.2 V Internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF533WBBZ-5A2,3

–40°C to +85°C

500 MHz

1.2 V Internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

ADSP-BF533WYBCZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

160-Ball Chip Scale Package

BC-160-2

Ball Grid Array (CSP_BGA)

ADSP-BF533WYBZ-4A2,3

–40°C to +105°C

400 MHz

1.2 V internal, 3.0 V or 3.3 V I/O

169-Ball Plastic Ball Grid Array

B-169

(PBGA)

1 Referenced temperature is ambient temperature.

2 Z = RoHS Compliant Part.

3 Automotive grade part.