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ADSP-BF531/ADSP-BF532/ADSP-BF533

SPECIFICATIONS

Component specifications are subject to change without notice.

OPERATING CONDITIONS

Parameter		Conditions	Min	Nominal	Max	Unit

VDDINT	Internal Supply Voltage1	Nonautomotive 400 MHz and 500 MHz speed grade models2	0.8	1.2	1.32	V
VDDINT	Internal Supply Voltage1	Nonautomotive 533 MHz speed grade models2	0.8	1.25	1.375	V
VDDINT	Internal Supply Voltage1	600 MHz speed grade models2	0.8	1.30	1.45	V
VDDINT	Internal Supply Voltage1	Automotive grade models2	0.95	1.2	1.32	V
VDDEXT	External Supply Voltage	Nonautomotive grade models2	1.75	1.8/2.5/3.3	3.6	V
VDDEXT	External Supply Voltage	Automotive grade models2	2.7	3.3	3.6	V
VDDRTC	Real-Time Clock	Nonautomotive grade models2	1.75	1.8/2.5/3.3	3.6	V
	Power Supply Voltage
VDDRTC	Real-Time Clock	Automotive grade models2	2.7	3.3	3.6	V
	Power Supply Voltage
VIH	High Level Input Voltage3, 4	VDDEXT =1.85 V	1.3		3.6	V
VIH	High Level Input Voltage3, 4	VDDEXT =Maximum	2.0		3.6	V
VIHCLKIN	High Level Input Voltage5	VDDEXT =Maximum	2.2		3.6	V
VIL	Low Level Input Voltage3, 6	VDDEXT =1.75 V	–0.3		+0.3	V
VIL	Low Level Input Voltage3, 6	VDDEXT =2.25 V	–0.3		+0.6	V
TJ	Junction Temperature	160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = 0°C to +70°C	0		+95	°C
TJ	Junction Temperature	160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to +85°C	–40		+105	°C
TJ	Junction Temperature	160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to +105°C	–40		+125	°C
TJ	Junction Temperature	169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to +105°C	–40		+125	°C
TJ	Junction Temperature	169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to +85°C	–40		+105	°C
TJ	Junction Temperature	176-Lead Quad Flatpack (LQFP) @ TAMBIENT = –40°C to +85°C	–40		+100	°C

1 The regulator can generate VDDINT at levels of 0.85 V to 1.2 V with –5% to +10% tolerance, 1.25 V with–4% to +10% tolerance, and 1.3 V with –0% to +10% tolerance.

2 See Ordering Guide on Page 59.

3 Applies to all input and bidirectional pins except CLKIN.

4The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional pins (DATA15–0, TMR2–0, PF15–0, PPI3–0, RSCLK1–0, TSCLK1–0, RFS1–0, TFS1–0, MOSI, MISO, SCK) and input only pins (BR, ARDY, PPI_CLK, DR0PRI, DR0SEC, DR1PRI, DR1SEC, RX, RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE1–0).

5 Applies to CLKIN pin only.

6 Applies to all input and bidirectional pins.

Rev. E | Page 21 of 60 | July 2007

ADSP-BF531/ADSP-BF532/ADSP-BF533

ELECTRICAL CHARACTERISTICS

						Low Power1		High Speed2
Parameter					Test Conditions	Min Typical	Max	Min Typical	Max	Unit

VOH		High Level Output Voltage3			@ VDDEXT = 1.75 V, IOH = –0.5 mA	1.5		1.5		V
VOH		High Level Output Voltage3			@ VDDEXT = 2.25 V, IOH = –0.5 mA	1.9		1.9		V
VOH		High Level Output Voltage3			@ VDDEXT = 3.0 V, IOH = –0.5 mA	2.4		2.4		V
VOL		Low Level Output Voltage3			@ VDDEXT = 1.75 V, IOL = 2.0 mA		0.2		0.2	V
VOL		Low Level Output Voltage3			@ VDDEXT = 2.25 V/3.0 V, IOL = 2.0 mA		0.4		0.4	V
IIH		High Level Input Current4			@ VDDEXT = Maximum, VIN = VDD Maximum		10.0		10.0	μA
IIHP		High Level Input Current JTAG5			@ VDDEXT = Maximum, VIN = VDD Maximum		50.0		50.0	μA
IIL6		Low Level Input Current4			@ VDDEXT = Maximum, VIN = 0 V		10.0		10.0	μA
IOZH		Three-State Leakage Current7			@ VDDEXT = Maximum, VIN = VDD Maximum		10.0		10.0	μA
IOZL6		Three-State Leakage Current7			@ VDDEXT = Maximum, VIN = 0 V		10.0		10.0	μA
CIN		Input Capacitance8			fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V	4	89	4	89	pF
IDDHIBERNATE		VDDINT Current in Hibernate State			VDDEXT = 3.65 V	50		50		μA
					with voltage regulator off (VDDINT = 0 V)
IDDRTC		VDDRTC Current			VDDRTC = 3.3 V, TJUNCTION = 25°C	20		20		μA
	10	VDDINT Current in Deep Sleep Mode			VDDINT = 0.8 V, TJUNCTION = 25°C	7.5		35		mA
IDDDEEPSLEEP		VDDINT Current in Deep Sleep Mode			VDDINT = 0.8 V, TJUNCTION = 25°C	7.5		35		mA
IDDSLEEP		VDDINT Current in Sleep Mode			VDDINT = 0.8 V, TJUNCTION = 25°C, SCLK = 25 MHz	10		37.5		mA
	10, 11	VDDINT Current Dissipation (Typical)			VDDINT = 0.8 V, fCCLK = 50 MHz, TJUNCTION = 25°C	20		47		mA
IDD_TYP		VDDINT Current Dissipation (Typical)			VDDINT = 0.8 V, fCCLK = 50 MHz, TJUNCTION = 25°C	20		47		mA
	10, 11	VDDINT Current Dissipation (Typical)			VDDINT = 1.14 V, fCCLK = 400 MHz, TJUNCTION = 25°C	132		198		mA
IDD_TYP		VDDINT Current Dissipation (Typical)			VDDINT = 1.14 V, fCCLK = 400 MHz, TJUNCTION = 25°C	132		198		mA
	10, 11	VDDINT Current Dissipation (Typical)			VDDINT = 1.2 V, fCCLK = 500 MHz, TJUNCTION = 25°C			240		mA
IDD_TYP		VDDINT Current Dissipation (Typical)			VDDINT = 1.2 V, fCCLK = 500 MHz, TJUNCTION = 25°C			240		mA
	10, 11	VDDINT Current Dissipation (Typical)			VDDINT = 1.2 V, fCCLK = 533 MHz, TJUNCTION = 25°C			250		mA
IDD_TYP		VDDINT Current Dissipation (Typical)			VDDINT = 1.2 V, fCCLK = 533 MHz, TJUNCTION = 25°C			250		mA
	10, 11	VDDINT Current Dissipation (Typical)			VDDINT = 1.3 V, fCCLK = 600 MHz, TJUNCTION = 25°C			308		mA
IDD_TYP		VDDINT Current Dissipation (Typical)			VDDINT = 1.3 V, fCCLK = 600 MHz, TJUNCTION = 25°C			308		mA
1	Applies to all 400 MHz speed grade models. See Ordering Guide on Page 59.
2	Applies to all 500 MHz, 533 MHz, and 600 MHz speed grade models. See Ordering Guide on Page 59.
3	Applies to output and bidirectional pins.
4	Applies to input pins except JTAG inputs.
5	Applies to JTAG input pins (TCK, TDI, TMS,		TRST)	.
6	Absolute value.
7	Applies to three-statable pins.
8	Applies to all signal pins.
9	Guaranteed, but not tested.

10See Estimating Power for ADSP-BF531/BF532/BF533 Blackfin Processors (EE-229) on the Analog Devices website (www.analog.com)—use site search on “EE-229.” 11Processor executing 75% dual MAC, 25% ADD with moderate data bus activity.

Rev. E | Page 22 of 60 | July 2007

ADSP-BF531/ADSP-BF532/ADSP-BF533

ABSOLUTE MAXIMUM RATINGS

Stresses greater than those listed in the table may cause perma nent damage to the device. These are stress ratings only. Functional operation of the device at these or any other condi tions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

PACKAGE INFORMATION

The information presented in Figure 10 and Table 11 provides details about the package branding for the Blackfin processors. For a complete listing of product availability, see the Ordering Guide on Page 59.

Parameter	Rating

Internal (Core) Supply Voltage (VDDINT)	–0.3 V to +1.4 V
External (I/O) Supply Voltage (VDDEXT)	–0.5 V to +3.8 V
Input Voltage1	–0.5 V to +3.8 V
Output Voltage Swing	–0.5 V to VDDEXT +0.5 V
Load Capacitance2	200 pF
Storage Temperature Range	–65 C to +150°C
Junction Temperature Under Bias	125°C

1 Applies to 100% transient duty cycle. For other duty cycles see Table 10.

2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0,

CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS.

Table 10. Maximum Duty Cycle for Input Transient Voltage1

VIN Min (V)	VIN Max (V)2	Maximum Duty Cycle
–0.50	+3.80	100%
–0.70	+4.00	40%
–0.80	+4.10	25%
–0.90	+4.20	15%
–1.00	+4.30	10%

1 Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0.

2 Only one of the listed options can apply to a particular design.

ESD SENSITIVITY

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can discharge without detection. Although this product features patented or proprietary circuitry, damage may occur on devices subjected to high energy ESD. Therefore, proper ESD precautions should be take to avoid performance degradation or loss of functionality.

ADSP-BF53x

tppZ-cc

vvvvvv.x n.n

yyww country_of_origin

Figure 10. Product Information on Package

Table 11. Package Brand Information

Brand Key Field Description

ADSP-BF53x Either ADSP-BF531, ADSP-BF532, or ADSP-BF533

tTemperature Range

pp	Package Type

ZRoHS Compliant Part

cc	See Ordering Guide
vvvvvv.x	Assembly Lot Code

n.nSilicon Revision

yyww

Date Code

Rev. E | Page 23 of 60 | July 2007

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