Universal Serial Bus Specification Revision 1.1
6.5.4 Series “A” and Series “B” Plugs
Electrical and mechanical interface configuration data for Series "A" and Series "B" plugs are shown in Figure 6-9 and Figure 6-10.
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Universal Serial Bus Specification Revision 1.1 |
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6 |
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B |
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12.00 ± 0.10 |
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R 0.64 + 0.13 Typical |
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11.75 MIN |
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H |
8.0 MAX |
0.315 ± 0.03 Typical |
0.15 ± 0.10 Typical |
300 ± 20 Typical |
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H |
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4.50 ± 0.10 |
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300 ± 20 |
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4 |
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1 |
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G |
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1.95 ± 0.05 |
0.38 ± 0.13 |
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G |
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A |
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8.0 MAX |
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Plug Contact |
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UL 94-V0 Plug Housing |
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A |
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11.75 MIN |
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16.0 MAX |
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4.0 MAX |
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Center Line |
5.16 ± 0.10 |
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2.00 ± 0.13 (4) |
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F |
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1.00 ± 0.05 (4) |
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F |
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2.50 ± 0.05 (2) |
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Boot |
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Section A - A |
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2.00 ± 0.05 (2) |
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Overmold |
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B |
Center Line |
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E |
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B |
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E |
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2.50 ± 0.13 (4) |
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Overmold |
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Boot |
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B |
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1 |
Overall connector and cable assembly |
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D |
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length is measured from Datum 'A' of D |
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the Series "A" Plug to Datum 'A' of the |
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8.65 ± 0.19 |
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S e r i e s " B " P l u g o r t o t h e b l u n t e n d |
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7.41 ± 0 |
.31 |
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termination. |
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4.2 MIN |
6.41 ± 0.31 |
GOLD PLATE AREA |
All dimensions are in millimeters m( m ) |
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unless otherwise noted. |
C |
C |
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1.0 ± 0.05 (2) |
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3.5 ± 0.05 (2) |
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9.70 ± 0.13 |
Section B - B
B |
B |
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Interface Drawing |
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A |
0.16 ± 0.15 |
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USB Series "A" Plug |
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A |
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0.13 ± 0.13 |
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SIZE |
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DATE |
DRAWING NUMBER |
REV |
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A |
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2/98 |
N/A |
C |
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SCALE: |
N/A |
SHEET |
1 of 1 |
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8 |
7 |
6 |
5 |
4 |
3 |
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2 |
1 |
Figure 6-9. USB Series "A" Plug Interface Drawing
87
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|
Universal Serial Bus Specification Revision 1.1 |
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8 |
7 |
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6 |
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5 |
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4 |
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3 |
2 |
1 |
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H |
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8.00 ± 0.10 |
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H |
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C |
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5.83 ± 0.10 |
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0.38 MAX |
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10.5 MAX |
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1.46 ± 0.10 |
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B |
300 |
± 20 |
Typical |
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G |
450 ± 0.50 (2) |
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1 |
2 |
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Boot |
G |
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0.80 ± 0.05 |
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Overmold |
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3.29 ± 0.05 |
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4 |
3 |
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7.26 ± 0.10 |
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Center Line |
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F |
of 2.85 |
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300 ± 2 |
0 (2) |
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F |
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A |
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A |
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2.85 ± 0.13 (2) |
C |
Center Line |
B |
Center Line |
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11.75 MIN |
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11.5 MAX |
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1 |
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A |
3.70 ± 0.13 |
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B |
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E |
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Section A - A |
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Boot |
E |
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0.25 ± 0.05 |
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Overmold |
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D |
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6.41 ± 0.31 |
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D |
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4.20 MIN |
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B |
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Gold Plate Area |
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8.65 ± 0.19 |
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Overall connector and cable assembly length |
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1 |
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is measured from Datum 'A' of the Series "B" |
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1.16 MAX |
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7.41 ± 0.31 |
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Plug to Datum 'A' of the Series "A" Plug or |
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C |
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the blunt end termination. |
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C |
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1.25 ± 0.10 (4) |
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4.67 ± 0.10 |
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All dimensions are in millimeters (m m ) |
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C |
Center Line |
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unless otherwise noted. |
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Section B - B |
B |
B |
0.16 ± 0.15 |
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0.13 ± 0.13 |
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Interface Drawing |
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Typical |
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Typical |
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A |
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USB Series "B" Plug |
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A |
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SIZE |
DATE |
DRAWING NUMBER |
REV |
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A |
2/98 |
N/A |
C |
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SCALE: |
N/A |
SHEET |
1 of 1 |
8 |
7 |
6 |
5 |
4 |
3 |
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1 |
Figure 6-10. USB Series “B” Plug Interface Drawing
88
Universal Serial Bus Specification Revision 1.1
6.5.4.1Plug Injection Molded Thermoplastic Insulator Material
Minimum UL 94-V0 rated, thirty percent (30%) glass-filled polybutylene terephthalate (PBT) or polyethylene terephthalate (PET) or better.
Typical Colors: Black, Gray and Natural.
Flammability Characteristics: UL 94-V0 rated.
Flame Retardant Package must meet or exceed the requirements for UL, CSA and VDE.
Oxygen Index (LOI): 21%. ASTM D 2863.
6.5.4.2Plug Shell Materials
Substrate Material: 0.30 + 0.05 mm phosphor bronze, nickel silver or other suitable material.
Plating:
A.Underplate: Optional. Minimum 1.00 micrometers (40 microinches) nickel. In addition, manufacturer may use a copper underplate beneath the nickel.
B.Outside: Minimum 2.5 micrometers (100 microinches) bright tin or bright tin-lead.
6.5.4.3Plug (Male) Contact M aterials
Substrate Material. 0.30 + 0.05 mm half-hard phosphor bronze.
Plating. Contacts are to be selectively plated.
A.Option I
1.Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material is optional.
2.Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of 0.70 micrometers (28 microinches) palladium.
3.Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the underplate.
B.Option II
1.Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material is optional.
2.Mating Area: Minimum 0.05 micrometers (2 microinches) gold over a minimum of 0.75 micrometers (30 microinches) palladium-nickel.
3.Wire Crimp/Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the underplate.
C.Option III
1.Underplate: Minimum 1.25 micrometers (50 microinches) nickel. Copper over base material is optional.
2.Mating Area: Minimum 0.75 micrometers (30 microinches) gold.
3.Solder Tails: Minimum 3.8 micrometers (150 microinches) bright tin-lead over the underplate.
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