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Московский государственный университет приборостроения и информатики

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бакМИТ_КП2015 / Компоненты по вариантам / Операционные_усилители / LTC6252IS6.pdf

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LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

DC8 Package

8-Lead Plastic DFN (2mm × 2mm)

(Reference LTC DWG # 05-08-1719 Rev A)

	0.70 ±0.05
2.55 ±0.05	0.64 ±0.05
1.15 ±0.05	0.64 ±0.05
	(2 SIDES)
	PACKAGE
	OUTLINE
	0.25 ± 0.05
	0.45 BSC
	1.37 ±0.05
	(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED			R = 0.115
			R = 0.115
			TYP
		R = 0.05	5	8
		TYP		0.40 ± 0.10
				0.40 ± 0.10
	2.00 ±0.10	0.64 ± 0.10		PIN 1 NOTCH
	(4 SIDES)	(2 SIDES)		PIN 1 NOTCH
PIN 1 BAR	(4 SIDES)	(2 SIDES)		R = 0.20 OR
				R = 0.20 OR
				0.25 × 45°
TOP MARK				0.25 × 45°
TOP MARK				CHAMFER
(SEE NOTE 6)				CHAMFER
(SEE NOTE 6)				(DC8) DFN 0106 REVØ
				(DC8) DFN 0106 REVØ
			4	1
				0.23 ± 0.05
0.200 REF	0.75 ±0.05			0.45 BSC
			1.37 ±0.10
			(2 SIDES)
	0.00 – 0.05		BOTTOM VIEW—EXPOSED PAD

NOTE:

1.DRAWING IS NOT A JEDEC PACKAGE OUTLINE

2.DRAWING NOT TO SCALE

3.ALL DIMENSIONS ARE IN MILLIMETERS

4.DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5.EXPOSED PAD SHALL BE SOLDER PLATED

6.SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

625234fc

LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

MS8 Package

8-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1660 Rev F)

			0.889 ± 0.127											3.00 ± 0.102								0.52
														3.00 ± 0.102
														(.118 ± .004)
			(.035 ± .005)				0.254		DETAIL “A”					(NOTE 3)		8	7	6	5			(.0205)
							0.254									8	7	6	5				REF
							(.010)				0° – 6° TYP												REF



5.23							GAUGE PLANE
						3.20 – 3.45								4.90 ± 0.152							3.00 ± 0.102
(.206)
(.206)
		MIN			(.126 – .136)								0.53 ± 0.152	(.193 ± .006)						(.118 ± .004)
		MIN											0.53 ± 0.152	(.193 ± .006)								(NOTE 4)
												(.021 ± .006)										(NOTE 4)
												(.021 ± .006)
										DETAIL “A”
	0.42 ± 0.038			0.65			0.18
	0.42 ± 0.038			0.65			0.18									1	2	3	4
	(.0165 ± .0015)				(.0256)
								(.007)


	TYP					BSC								1.10						0.86
	RECOMMENDED SOLDER PAD LAYOUT													1.10						0.86
	RECOMMENDED SOLDER PAD LAYOUT														(.043)								(.034)
															MAX								REF

NOTE:

1.DIMENSIONS IN MILLIMETER/(INCH)

2.DRAWING NOT TO SCALE

3.DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4.DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5.LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

SEATING




PLANE	0.22	– 0.38
PLANE

	(.009	– .015)
	(.009	– .015)		0.65
	TYP			0.65
	TYP		(.0256)
			(.0256)

BSC

0.1016 ± 0.0508

(.004 ± .002)

MSOP (MS8) 0307 REV F

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LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

MS Package

10-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1661 Rev E)

0.889 ± 0.127

(.035 ± .005)

5.23

3.20 – 3.45

(.206)

(.126 – .136)

MIN

3.00 ± 0.102

0.305 ± 0.038

0.50

(.118 ± .004)

0.497 ± 0.076

(NOTE 3)

(.0120 ± .0015)

(.0197)

10 9

(.0196 ± .003)

TYP

BSC

REF

RECOMMENDED SOLDER PAD LAYOUT

3.00 ±

0.102

4.90 ± 0.152

DETAIL “A”

(.118 ± .004)

0.254

(.193 ± .006)

(NOTE 4)

GAUGE PLANE

(.010)

0° – 6° TYP

0.53 ± 0.152

1.10

0.86

(.021 ± .006)

DETAIL “A”

(.043)

(.034)

MAX

REF

0.18

(.007)

SEATING

PLANE

0.17 – 0.27

0.1016 ± 0.0508

(.007 – .011)

0.50

(.004 ± .002)

TYP

MSOP (MS) 0307 REV E

NOTE:

(.0197)

1. DIMENSIONS IN MILLIMETER/(INCH)	BSC

2.DRAWING NOT TO SCALE

3.DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4.DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5.LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

625234fc

LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

MS Package

16-Lead Plastic MSOP

(Reference LTC DWG # 05-08-1669 Rev Ø)

0.889 ± 0.127

(.035 ± .005)

5.23

3.20 – 3.45

(.206)

(.126 – .136)

MIN

4.039 ± 0.102

0.305 ± 0.038

0.50

(.159 ± .004)

(.0120 ± .0015)

(.0197)

(NOTE 3)

0.280 ± 0.076

TYP

BSC

16151413121110

(.011 ± .003)

RECOMMENDED SOLDER PAD LAYOUT

REF

DETAIL “A”

3.00 ±

0.102

0.254

4.90

± 0.152

(.118 ± .004)

(.010)

(.193 ± .006)

0° – 6° TYP

(NOTE 4)

GAUGE PLANE

0.53 ± 0.152

(.021 ± .006)

1.10

1 2 3 4

5 6 7 8

0.86

DETAIL “A”

(.043)

(.034)

MAX

REF

0.18

(.007)

SEATING

PLANE

0.17 – 0.27

0.1016 ± 0.0508

(.007 – .011)

0.50

(.004 ± .002)

NOTE:

TYP

MSOP (MS16) 1107 REV Ø

(.0197)

1.DIMENSIONS IN MILLIMETER/(INCH) BSC

2.DRAWING NOT TO SCALE

3.DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

4.DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.

INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE

5.LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX

625234fc

LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

S6 Package

6-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1636)

0.62

0.95

2.90 BSC

(NOTE 4)

MAX

REF

1.22

REF

3.85 MAX 2.62 REF

1.4

MIN

2.80 BSC

1.50 – 1.75

(NOTE 4)

PIN ONE ID

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

0.20 BSC

DATUM ‘A’

0.30 – 0.50 REF

0.09 – 0.20

NOTE:	(NOTE 3)

1.DIMENSIONS ARE IN MILLIMETERS

2.DRAWING NOT TO SCALE

3.DIMENSIONS ARE INCLUSIVE OF PLATING

4.DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5.MOLD FLASH SHALL NOT EXCEED 0.254mm

6.JEDEC PACKAGE REFERENCE IS MO-193

0.95 BSC

0.80 – 0.90

1.00MAX

1.90 BSC

0.30 – 0.45

6 PLCS (NOTE 3)

0.01 – 0.10

S6 TSOT-23 0302 REV B

625234fc

LTC6252/LTC6253/LTC6254

PACKAGE DESCRIPTION

Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings.

TS8 Package

8-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1637 Rev A)

0.40

0.65

2.90 BSC

(NOTE 4)

MAX

REF

1.22

REF

3.85 MAX 2.62 REF

1.4

MIN

2.80 BSC

1.50 – 1.75

(NOTE 4)

		PIN ONE ID
	RECOMMENDED SOLDER PAD LAYOUT	0.65 BSC
	PER IPC CALCULATOR	0.65 BSC
	PER IPC CALCULATOR
		0.80 – 0.90

0.22 – 0.36

8 PLCS (NOTE 3)

0.20 BSC	0.01 – 0.10

DATUM ‘A’	1.00 MAX

0.30 – 0.50 REF

1.95 BSC

0.09 – 0.20

TS8 TSOT-23 0710 REV A

NOTE:	(NOTE 3)

1.DIMENSIONS ARE IN MILLIMETERS

2.DRAWING NOT TO SCALE

3.DIMENSIONS ARE INCLUSIVE OF PLATING

4.DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5.MOLD FLASH SHALL NOT EXCEED 0.254mm

6.JEDEC PACKAGE REFERENCE IS MO-193

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