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Одесский национальный политехнический университет

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Description	STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

2 Description

The STM32F100xx value line family incorporates the high-performance ARM Cortex™-M3 32-bit RISC core operating at a 24 MHz frequency, high-speed embedded memories (Flash memory up to 128 Kbytes and SRAM up to 8 Kbytes), and an extensive range of enhanced peripherals and I/Os connected to two APB buses. All devices offer standard communication interfaces (up to two I2Cs, two SPIs, one HDMI CEC, and up to three USARTs), one 12-bit ADC, two 12-bit DACs, up to six general-purpose 16-bit timers and an advanced-control PWM timer.

The STM32F100xx lowand medium-density value line family operates in the –40 to +85 °C and –40 to +105 °C temperature ranges, from a 2.0 to 3.6 V power supply. A comprehensive set of power-saving mode allows the design of low-power applications.

The STM32F100xx value line family includes devices in three different packages ranging from 48 pins to 100 pins. Depending on the device chosen, different sets of peripherals are included, the description below gives an overview of the complete range of peripherals proposed in this family.

These features make the STM32F100xx value line microcontroller family suitable for a wide range of applications:

●Application control and user interface

●Medical and handheld equipment

●PC peripherals, gaming and GPS platforms

●Industrial applications: PLC, inverters, printers, and scanners

●Alarm systems, Video intercom, and HVAC

Figure 1 shows the general block diagram of the device family.

10/86

Doc ID 16455 Rev 3

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB	Description

2.1Device overview

Table 2.	STM32F100xx features and peripheral counts
	Peripheral		STM32F100Cx							STM32F100Rx					STM32F100Vx

Flash - Kbytes			16		32		64	128	16		32	64		128	64		128

SRAM - Kbytes			4		4		8	8	4		4	8		8	8		8

Timers		Advanced-control	1				1			1			1			1

		General-purpose	5(1)				6			5(1)			6			6
		General-purpose	5(1)				6			5(1)			6			6
		SPI	1(2)				2			1(2)			2			2
Communication		I2C	1(3)				2			1(3)			2			2
interfaces		USART	2(4)				3			2(4)			3			3
		CEC								1

12-bit synchronized ADC						1				1						1
number of channels				10 channels							16 channels				16 channels

GPIOs						37				51						80

12-bit DAC										2
Number of channels										2

CPU frequency										24 MHz

Operating voltage									2.0 to 3.6 V

Operating temperatures			Ambient operating temperature: –40 to +85 °C /–40 to +105 °C (see Table 8)
Operating temperatures						Junction temperature: –40 to +125 °C (see Table 8)
						Junction temperature: –40 to +125 °C (see Table 8)

Packages					LQFP48				LQFP64, TFBGA64						LQFP100

1.TIM4 not present.

2.SPI2 is not present.

3.I2C2 is not present.

4.USART3 is not present.

Doc ID 16455 Rev 3

11/86

Description	STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Figure 1. STM32F100xx value line block diagram

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1.Peripherals not present in low-density value line devices.

2.AF = alternate function on I/O port pin.

3.TA = –40 °C to +85 °C (junction temperature up to 105 °C) or TA = –40 °C to +105 °C (junction temperature up to 125 °C).

12/86

Doc ID 16455 Rev 3

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB											Description
Figure 2.	Clock tree
	-(Z	(3)
	(3) 2#	(3)
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									TO !(" BUS CORE
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		0,,-5,		37					,+ #ORTEX
		0,,-5,							,+ #ORTEX
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4. To have an ADC conversion time of 1.2 µs, APB2 must be at 24 MHz.

Doc ID 16455 Rev 3

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