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Одесский национальный политехнический университет

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Package characteristics	STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

6 Package characteristics

6.1Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

74/86

Doc ID 16455 Rev 3

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB	Package characteristics

Figure 37. LQFP100, 14 x 14 mm, 100-pin low-profile Figure 38.	Recommended footprint(1)(2)
quad flat package outline(1)

					0.25 mm
					0.10 inch
					GAGE PLANE
					k		75	51
		D
		D1			L		76	50
		D1						0.5
								0.5
		D3			L1
		D3
	75	51			C
								0.3
76		50
						16.7	14.3
b
		E3	E1	E
							100	26
								1.2
							1	25
100		26						12.3
Pin 1	1	25			ccc	C		12.3
Pin 1	1	25
identification
identification
								16.7
		e			A1
					A1			ai14906
								ai14906
					A2
					A
		SEATING PLANE			C
					C
						1L_ME

1.Drawing is not to scale.

2.Dimensions are in millimeters.

Table 47.	LQPF100 – 14 x 14 mm, 100-pin low-profile quad flat package mechanical data
Symbol			millimeters			inches(1)

		Min	Typ	Max	Min	Typ	Max
		Min	Typ	Max	Min	Typ	Max

A				1.60			0.063

A1		0.05		0.15	0.002		0.0059

A2		1.35	1.40	1.45	0.0531	0.0551	0.0571

b		0.17	0.22	0.27	0.0067	0.0087	0.0106

c		0.09		0.2	0.0035		0.0079

D		15.80	16.00	16.2	0.622	0.6299	0.6378

D1		13.80	14.00	14.2	0.5433	0.5512	0.5591

D3			12.00			0.4724

E		15.80	16.00	16.2	0.622	0.6299	0.6378

E1		13.80	14.00	14.2	0.5433	0.5512	0.5591

E3			12.00			0.4724

e			0.50			0.0197

L		0.45	0.60	0.75	0.0177	0.0236	0.0295

L1			1.00			0.0394

k		0°	3.5°	7°	0.0°	3.5°	7.0°

ccc			0.08			0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Doc ID 16455 Rev 3

75/86

Package characteristics	STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Figure 39. LQFP64 – 10 x 10 mm, 64 pin low-profile quad Figure 40. Recommended
flat package outline(1)	footprint(1)(2)

	D							48		33
	D1			ccc	C
	D1									0.3
	D3				A					0.3
	D3				A			49		32
	48	33			A2			49	0.5	32
	48	33
49		32
b							12.7	10.3
b
						L1
		E3	E1	E					10.3
		E3	E1	E				64		17
								64		17
						L				1.2
					A1	L	K
					A1		K	1		16
								1		16
64		17							7.8
		17
Pin 1									12.7
identification	1	16			c				12.7
identification	1	16			c
					5W_ME
										ai14909

1.Drawing is not to scale.

2.Dimensions are in millimeters.

Table 48.	LQFP64 – 10 x 10 mm, 64-pin low-profile quad flat package mechanical data
Symbol			millimeters			inches(1)

		Min	Typ	Max	Min	Typ	Max
		Min	Typ	Max	Min	Typ	Max

A				1.60			0.0630

A1		0.05		0.15	0.0020		0.0059

A2		1.35	1.40	1.45	0.0531	0.0551	0.0571

b		0.17	0.22	0.27	0.0067	0.0087	0.0106

c		0.09		0.20	0.0035		0.0079

D			12.00			0.4724

D1			10.00			0.3937

E			12.00			0.4724

E1			10.00			0.3937

e			0.50			0.0197

		0°	3.5°	7°	0°	3.5°	7°

L		0.45	0.60	0.75	0.0177	0.0236	0.0295

L1			1.00			0.0394

				Number of pins

N				64

1. Values in inches are converted from mm and rounded to 4 decimal digits.

76/86

Doc ID 16455 Rev 3

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB	Package characteristics

Figure 41. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline

		A
		A1
		A3
		A4
		A2
	Seating	C
	plane	C
	plane

B				D
				D1				A
e								A
e						F
H
G							F
G
F
E							E1	E
D							E1	E
D
C
B
A
							e
1	2	3	4	5	6	7	8
A1 ball pad corner					Øb (64 balls)

Bottom view

ME_R8

1. Drawing is not to scale.

Table 49. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package mechanical data

Symbol		millimeters			inches(1)

	Min	Typ	Max	Min	Typ	Max
	Min	Typ	Max	Min	Typ	Max

A			1.200			0.0472

A1	0.150			0.0059

A2		0.785			0.0309

A3		0.200			0.0079

A4			0.600			0.0236

b	0.250	0.300	0.350	0.0098	0.0118	0.0138

D	4.850	5.000	5.150	0.1909	0.1969	0.2028

D1		3.500			0.1378

E	4.850	5.000	5.150	0.1909	0.1969	0.2028

E1		3.500			0.1378

e		0.500			0.0197

F		0.750			0.0295

ddd		0.080			0.0031

eee		0.150			0.0059

fff		0.050			0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Doc ID 16455 Rev 3

77/86

Package characteristics	STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB

Figure 42. Recommended PCB design rules for pads (0.5 mm pitch BGA)

		Pitch	0.5 mm

		D pad	0.27 mm

		Dsm	0.35 mm typ (depends on
		Dsm	0.35 mm typ (depends on
			the soldermask registration
			tolerance)

		Solder paste	0.27 mm aperture diameter
Dpad
Dpad
	Dsm
	Dsm

ai15495

1.Non solder mask defined (NSMD) pads are recommended

2.4 to 6 mils solder paste screen printing process

78/86

Doc ID 16455 Rev 3

STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB									Package characteristics
Figure 43.	LQFP48 – 7 x 7 mm, 48-pin low-profile quad flat							Figure 44.	Recommended
		package outline(1)							footprint(1)(2)
Seating plane
C
	A	A2
		A1	b		c					0.50
			b							1.20
							0.25 mm			1.20
		ccc					0.25 mm
		ccc	C				Gage plane
			D						36	25	0.30
									36	25
									37	24
									37	24
			D1				k
			D3				k			0.20
										0.20
						A1	L	9.70 5.80		7.30
		36		25		A1	L	9.70 5.80
		36		25			L1
							L1
										7.30
	37			24					48	13
	37								1	12
									1	12
										1.20
				E3	E1	E				5.80
				E3	E1	E
										9.70
											ai14911b
	48			13
				13
Pin 1		1		12
identification
							5B_ME

1.Drawing is not to scale.

2.Dimensions are in millimeters.

Table 50.	LQFP48 – 7 x 7 mm, 48-pin low-profile quad flat package mechanical data
Symbol		millimeters			inches(1)

	Min	Typ	Max	Min	Typ	Max
	Min	Typ	Max	Min	Typ	Max

A			1.600			0.0630

A1	0.050		0.150	0.0020		0.0059

A2	1.350	1.400	1.450	0.0531	0.0551	0.0571

b	0.170	0.220	0.270	0.0067	0.0087	0.0106

c	0.090		0.200	0.0035		0.0079

D	8.800	9.000	9.200	0.3465	0.3543	0.3622

D1	6.800	7.000	7.200	0.2677	0.2756	0.2835

D3		5.500			0.2165

E	8.800	9.000	9.200	0.3465	0.3543	0.3622

E1	6.800	7.000	7.200	0.2677	0.2756	0.2835

E3		5.500			0.2165

e		0.500			0.0197

L	0.450	0.600	0.750	0.0177	0.0236	0.0295

L1		1.000			0.0394

k	0°	3.5°	7°	0°	3.5°	7°

ccc		0.080			0.0031

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Doc ID 16455 Rev 3

79/86

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