- •Методическое пособие
- •Contents
- •UnitI Quantum systems Word List
- •Quantum Mechanics
- •Quantum Information
- •Unit II Nanotechnologies and nanomaterials in electronics Word List
- •What Is Nanotechnology?
- •UnitIii Microfabrication Word List
- •Microfabrication
- •Micro Electro Mechanical Systems
- •Unit IV
- •Information protection Word List
- •Basic Principle of Information Protection
- •Descriptor-Based Protection Systems
- •The Personal Information Protection and Electronic Documents Act
- •Unit V Computer security Word list
- •Computer Security
- •Secure Coding
- •Hardware Mechanisms that Protect Computers and Data
- •Unit VI Cryptography Word List
- •Symmetric Key Algorithm
- •From the History of Cryptography
- •Unit VII New electronics: research and development Word List
- •Ferreting out Contraband
- •Spintronics Technology May Cool the Laptop
- •Unit VIII
- •Integrated circuits Word List
- •Integrated Circuits
- •The ic Manufacturing Process
- •Unit IX Semiconductors Word List
- •Semiconductors
- •Return of the Vacuum Valve
- •Appendix Supplementary Reading
- •What are Potential Harmful Effects of Nanoparticles?
- •Information Security
- •Security Classification for Information
- •Методическое пособие
UnitIii Microfabrication Word List
|
align |
/ q'laIn / |
выстраивать в линию, ставить в ряд; выравнивать |
|
application |
/ "xplI'keISqn / |
применение, использование; приложение |
|
bulk |
/ bAlk / |
груда, кипа; масса |
|
density |
/ 'densItI / |
плотность; концентрация |
|
device |
/ dI'vaIs / |
устройство, приспособление; механизм; аппарат, машина, прибор |
|
deposition |
/"depq'zISqn / |
отложение; осаждение |
|
enable |
/ I'neIbl / |
давать возможность, право |
|
evaporation |
/ I"vxpq'reISqn / |
испарение, выпаривание; парообразование |
|
feature |
/ 'fi:tSq / |
особенность, характерная черта; деталь, признак, свойство |
|
gear |
/ gIq / |
механизм, устройство, инструмент, прибор |
|
humidity |
/ hju:'mIdItI / |
сырость, влажность |
|
pervasive |
/ pq:'veIsIv / |
распространяющийся, проникающий, пропитывающий, заполняющий |
|
precede |
/ prI'si:d / |
предшествовать |
|
semiconductor |
/ "semIkqn'dAktq / |
полупроводник |
|
substrate |
/ 'sAbstreIt / |
основа, подложка |
|
versatility |
/ "vq:sq'tIlItI / |
непостоянство, изменчивость; многосторонность, разносторонность |
|
wafer |
/ 'weIfq / |
подложка; пластина |
Part A
1. Define the following words as parts of speech and give the initial words of the following derivatives.
Earliest, integrated, fabrication, processing, repeatedly, handling, productive, deposition, contaminated, reconstruct, completely, sophisticated, actually.
2. Read the following words in each line and define their roots. Translate the words into Russian:
1) technical, technique, technically;
2) scale, scaling, scaled;
3) classify, classified, classification;
4) application, applied, apply;
5) fabricate, fabrication, fabricator;
6) designer, designing, design;
7) process, processing, processed;
8) conduct, conductor, conductive, semiconductor.
3. Match the following terms with their definitions.
|
1) miniaturize |
a) a thin coating or layer |
|
2) substrate |
b) make dirty, impure or diseased |
|
3) semiconductor |
c) putting to practical use |
|
4) contaminate |
d) easy to see through |
|
5) transparent |
e) to make or construct (something, esp. electronic equipment) on a very small scale; reduce in size |
|
6) particle |
f) the semiconductor base on which other material is deposited, esp. in the construction of integrated circuits |
|
7) application |
g) a body with finite mass that can be treated as having negligible size, and internal structure |
|
8) film
|
h) a substance, such as germanium or silicon, that has an electrical conductivity that increases with temperature and is intermediate between that of a metal and an insulator |
4. Translate the following sentences paying attention to the words in bold type.
1. Microfabrication technologies originate from the microelectronics industry, and the devices are usually made on silicon wafers.
2. Microfabrication is actually a collection of technologies which are utilized in making microdevices.
3. The substrate enables easy handling of the microdevice through the many fabrication steps.
4. To fabricate a microdevice, many processes must be performed, one after the other, many times repeatedly.
5. The complexity of microfabrication processes can be described by their “mask count”.
6. Microfabricated devices are not generally freestanding devices but are usually formed over or in a thicker support substrate.
5. Read the text and name the key points raised in it.
6. Divide the text into logical parts and entitle them.