Материалы к лабораторным работам / ГОСТы / Packages_Diodes_Inc
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Package Outline Dimensions
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U-DFN2020-6 |
A1 |
A3 |
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A |
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Seating Plane |
D |
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D2 |
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D/2 |
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0 |
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.1 |
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0 |
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R |
E/2 |
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E |
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E2 |
Pin#1ID |
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L |
e |
b |
U-DFN2020-6
Dim |
Min |
Max |
Typ |
A |
0.57 |
0.63 |
0.60 |
A1 |
0 |
0.05 |
0.03 |
A3 |
- |
- |
0.15 |
b |
0.20 |
0.30 |
0.25 |
D |
1.95 |
2.075 |
2.00 |
D2 |
1.45 |
1.65 |
1.55 |
e |
- |
- |
0.65 |
E |
1.95 |
2.075 |
2.00 |
E2 |
0.76 |
0.96 |
0.86 |
L |
0.30 |
0.40 |
0.35 |
All Dimensions in mm
Suggested Pad Layout
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Y |
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Dimensions |
Value (in mm) |
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G |
Z |
1.67 |
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X2 |
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G |
0.15 |
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X1 |
0.90 |
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X2 |
0.45 |
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X1 |
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Y |
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C |
0.65 |
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G
Y
Z
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
51 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
U-DFN2020-6/SWP
A1
A3
A
Seating Plane
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D |
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b1 |
K1 |
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E |
D2 |
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E2 |
L1 |
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K2 |
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L2X |
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︶ |
Z4X |
e b |
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︶ |
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U-DFN2020-6/SWP
Dim |
Min |
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Max |
Typ |
A |
0.57 |
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0.63 |
0.60 |
A1 |
0 |
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0.05 |
0.03 |
A3 |
- |
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- |
0.15 |
b |
0.25 |
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0.35 |
0.30 |
b1 |
0.185 |
0.285 |
0.235 |
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D |
1.95 |
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2.05 |
2.00 |
D2 |
0.85 |
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1.05 |
0.95 |
e |
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0.65 BSC |
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E |
1.95 |
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2.05 |
2.00 |
E2 |
1.40 |
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1.60 |
1.50 |
L |
0.25 |
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0.35 |
0.30 |
L1 |
0.675 |
0.775 |
0.725 |
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K1 |
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0.450 |
BSC |
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K2 |
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0.225 BSC |
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Z |
- |
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- |
0.20 |
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-6/SWP
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Y1 |
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X1 |
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G1 |
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Dimensions |
Value (in mm) |
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C |
0.650 |
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G |
0.125 |
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Y3 |
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G1 |
0.350 |
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X |
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Y2 |
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X1 |
1.700 |
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Y |
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Y1 |
0.515 |
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G |
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Y |
Y2 |
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Y3 |
2.330 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
52 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions |
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|
U-DFN2020-6 (Type B) |
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U-DFN2020-6 |
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A |
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A3 |
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Type B |
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Dim |
Min |
Max |
Typ |
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SEATING PLANE |
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A1 |
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A |
0.545 |
0.605 |
0.575 |
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D |
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A1 |
0 |
0.05 |
0.02 |
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A3 |
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- |
0.13 |
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Pin#1 ID |
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D2 |
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b |
0.20 |
0.30 |
0.25 |
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D |
1.95 |
2.075 |
2.00 |
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z |
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d |
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0.45 |
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d |
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D2 |
0.50 |
0.70 |
0.60 |
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e |
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0.65 |
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E |
E2 |
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E |
1.95 |
2.075 |
2.00 |
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f |
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E2 |
0.90 |
1.10 |
1.00 |
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L |
f |
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0.15 |
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L |
0.25 |
0.35 |
0.30 |
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e |
b |
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z |
- |
- |
0.225 |
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All Dimensions in mm |
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Suggested Pad Layout
U-DFN2020-6 (Type B)
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Y |
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C |
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G |
Dimensions |
Value |
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X2 |
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Z |
1.67 |
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G1 |
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G |
0.20 |
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X1 |
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G1 |
0.40 |
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X1 |
1.0 |
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X2 |
0.45 |
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G |
Y |
0.37 |
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Y1 |
0.70 |
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Z |
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Y1 |
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C |
0.65 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
53 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
U-DFN2020-6 (Type C) |
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A1 |
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A |
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Seating Plane |
U-DFN2020-6 |
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A3 |
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Type C |
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D |
Dim |
Min |
Max |
Typ |
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A |
0.57 |
0.63 |
0.60 |
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D2 |
||||
|
Pin #1 ID |
A1 |
0.00 |
0.05 |
0.02 |
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A3 |
–– |
–– |
0.15 |
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b |
0.25 |
0.35 |
0.30 |
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D |
1.95 |
2.075 |
2.00 |
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D2 |
1.55 |
1.75 |
1.65 |
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E |
1.95 |
2.075 |
2.00 |
E |
E2 |
|
E2 |
0.86 |
1.06 |
0.96 |
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e |
–– |
–– |
0.65 |
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L |
0.25 |
0.35 |
0.30 |
|
Z(4x) |
|
Z |
–– |
–– |
0.20 |
|
L |
All Dimensions in mm |
||||
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|||||
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e |
b |
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Suggested Pad Layout
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U-DFN2020-6 (Type C) |
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X2 |
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X1 |
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Dimensions |
Value |
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Y |
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(in mm) |
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C |
0.650 |
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X |
0.350 |
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X1 |
1.650 |
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Y2 |
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Y1 |
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X2 |
1.700 |
||||||||||||||||||||||||||||||
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Y |
0.525 |
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Y1 |
1.010 |
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C |
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Y2 |
2.400 |
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X |
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|
|||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
54 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
|
U-DFN2020-6 (Type E) |
|
|
|
A3 |
A |
|
|
A1 |
|
|
|
|
|
D |
|
|
|
D2 |
b1 K1 |
|
|
|
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|
E |
|
L1 |
|
E2 |
|
︶ |
|
|
|
|
L2X |
︶ |
|
|
K2 |
|
|
︶ |
|
Z4X |
e |
|
b6X |
|
|
||
U-DFN2020-6
Type E
Dim |
Min |
Max |
Typ |
A |
0.57 |
0.63 |
0.60 |
A1 |
0 |
0.05 |
0.03 |
A3 |
− |
− |
0.15 |
b |
0.25 |
0.35 |
0.30 |
b1 |
0.185 |
0.285 |
0.235 |
D |
1.95 |
2.05 |
2.00 |
D2 |
0.85 |
1.05 |
0.95 |
E |
1.95 |
2.05 |
2.00 |
E2 |
1.40 |
1.60 |
1.50 |
e |
− |
− |
0.65 |
L |
0.25 |
0.35 |
0.30 |
L1 |
0.82 |
0.92 |
0.87 |
K1 |
− |
− |
0.305 |
K2 |
− |
− |
0.225 |
Z |
− |
− |
0.20 |
All Dimensions in mm
Suggested Pad Layout
U-DFN2020-6 (Type E)
Y3Y2 |
X2 |
|
Y1 |
|
|
||
|
|
X1 |
|
︶ |
|
|
︶ |
X6x |
|
C |
Y2x |
|
|
||
Dimensions |
Value |
|
(in mm) |
||
|
||
C |
0.650 |
|
X |
0.400 |
|
X1 |
0.285 |
|
X2 |
1.050 |
|
Y |
0.500 |
|
Y1 |
0.920 |
|
Y2 |
1.600 |
|
Y3 |
2.300 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
55 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
U-DFN2020-6 (Type F)
A
A1A3
Seating Plane
|
D |
|
|
E3 |
D3 |
|
|
|
|
|
|
E |
|
D2 |
E2 |
|
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||
e2 |
|
|
L |
|
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|
Z1 |
|
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|
e |
b |
|
Z4X |
|
|
|
︶ |
|
|
|
U-DFN2020-6
(Type F)
Dim |
Min |
|
Max |
Typ |
A |
0.57 |
|
0.63 |
0.60 |
A1 |
0 |
|
0.05 |
0.03 |
A3 |
- |
|
- |
0.15 |
b |
0.25 |
|
0.35 |
0.30 |
D |
1.95 |
|
2.05 |
2.00 |
D2 |
0.85 |
|
1.05 |
0.95 |
D3 |
0.33 |
|
0.43 |
0.38 |
e |
|
|
0.65 BSC |
|
e2 |
|
0.863 BSC |
||
E |
1.95 |
|
2.05 |
2.00 |
E2 |
1.05 |
|
1.25 |
1.15 |
E3 |
0.65 |
|
0.75 |
0.70 |
L |
0.225 |
0.325 |
0.275 |
|
Z |
|
|
0.20 BSC |
|
Z1 |
|
0.110 BSC |
||
All Dimensions in mm
Suggested Pad Layout
|
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|
U-DFN2020-6 (Type F) |
|
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|||||||||
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X3 |
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Y |
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C |
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X |
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Dimensions |
Value |
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(in mm) |
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C |
0.650 |
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X |
0.400 |
|
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|
X1 |
0.480 |
|
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X2 |
0.950 |
Y3Y2 |
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Y1Y4 |
X3 |
1.700 |
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Y |
0.425 |
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X1 |
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Y1 |
0.800 |
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Y2 |
1.150 |
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Pin1 |
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Y3 |
1.450 |
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Y4 |
2.300 |
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X2 |
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||||||||||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
56 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
X2-DFN2020-6 |
|
X2-DFN2020-6 |
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A1 |
A3 |
Dim |
Min |
Max |
Typ |
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A |
− |
0.40 |
− |
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A |
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A1 |
0 |
0.05 |
0.03 |
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D |
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A3 |
− |
− |
0.13 |
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b |
0.25 |
0.35 |
0.30 |
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e |
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D |
1.95 |
2.05 |
2.00 |
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L |
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D2 |
0.85 |
1.05 |
0.95 |
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E |
1.95 |
2.05 |
2.00 |
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D2 |
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E2 |
1.40 |
1.60 |
1.50 |
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e |
− |
− |
0.65 |
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EE2 |
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L |
0.25 |
0.35 |
0.30 |
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L1 |
|
L1 |
1.35 |
1.45 |
1.40 |
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Z |
− |
− |
0.20 |
︶ |
|
︶ |
All Dimensions in mm |
||||
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|||
Z3X |
e |
b6X |
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Suggested Pad Layout
X2-DFN2020-6
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X2 |
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X1 |
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Dimensions |
Value |
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Y |
(in mm) |
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C |
0.650 |
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X |
0.400 |
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X1 |
1.050 |
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Y3 |
Y2 |
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X2 |
1.700 |
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Y |
0.500 |
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Y1 |
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Y1 |
1.600 |
|||||||||||||||||||||||
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Y2 |
1.600 |
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Y3 |
2.300 |
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X (6x) |
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C |
|
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|||||||
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||||||||||||
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|
|
|
|||||||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
57 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Suggested Pad Layout
U-DFN2020-8
|
|
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X3 |
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||||||
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||||||||
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X |
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C |
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Value |
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Y |
|
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G |
Dimensions |
(in mm) |
||||||
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C |
0.500 |
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X1 |
|
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|
G |
0.150 |
||||
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X |
0.350 |
|||||
|
Y2Y1 |
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|
X1 |
0.700 |
|||
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|||||||
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|
X2 |
1.660 |
|
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Y |
0.490 |
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|
Y1 |
1.020 |
|
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|
Y1 |
2.300 |
|
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
58 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
W-DFN2020-8 (Type C)
A A1







A3Seating Plane
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*D |
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D2 |
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D/2 |
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K |
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Pin#1ID |
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E |
R |
E/2 |
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E2 |
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0 |
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. |
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2 |
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0 |
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L |
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e b |
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W-DFN2020-8
Type C
Dim |
Min |
Max |
Typ |
A |
0.770 |
0.830 |
0.800 |
A1 |
0 |
0.05 |
0.02 |
A3 |
- |
- |
0.152 |
b |
0.20 |
0.30 |
0.25 |
D |
1.950 |
2.075 |
2.000 |
D2 |
1.50 |
1.70 |
1.60 |
E |
1.950 |
2.075 |
2.000 |
E2 |
0.80 |
1.00 |
0.90 |
e |
- |
- |
0.50 |
K |
- |
- |
0.125 |
L |
0.240 |
0.340 |
0.290 |
All Dimensions in mm
Suggested Pad Layout
W-DFN2020-8
X2 |
Y |
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G |
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Dimensions Value (in mm) |
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C |
0.500 |
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G |
0.200 |
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G1 |
0.210 |
Y2Y1 |
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G1 |
X |
0.300 |
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X1 |
1.600 |
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X1 |
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X2 |
1.750 |
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Y |
0.490 |
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Y1 |
0.900 |
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Y2 |
2.300 |
X |
C |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
59 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
U-DFN2030-6 (Type B)
A1 |
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A3 |
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A |
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Seating Plane |
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D |
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e |
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Pin#1ID |
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E |
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E2 |
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D2 |
L |
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︶ |
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b |
Z4x |
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U-DFN2030-6
Type B
Dim |
Min |
Max |
Typ |
A |
0.55 |
0.65 |
0.60 |
A1 |
0 |
0.05 |
0.02 |
A3 |
- |
- |
0.15 |
b |
0.25 |
0.35 |
0.30 |
D |
1.95 |
2.05 |
2.00 |
D2 |
1.40 |
1.60 |
1.50 |
E |
2.95 |
3.05 |
3.00 |
E2 |
1.74 |
1.94 |
1.84 |
e |
- |
- |
0.65 |
L |
0.28 |
0.38 |
0.33 |
Z |
- |
- |
0.20 |
All Dimensions in mm
Suggested Pad Layout
U-DFN2030-6 (Type B)
X2
G

X1
Y2 


Y |
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Dimensions |
Value |
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(in mm) |
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C |
0.650 |
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G |
0.150 |
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X |
0.400 |
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Y1 |
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X1 |
1.600 |
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X2 |
1.700 |
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Y |
0.530 |
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Y1 |
1.940 |
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Y2 |
3.300 |
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C
X

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
60 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
