Материалы к лабораторным работам / ГОСТы / Packages_Diodes_Inc
.pdf
Package Outline Dimensions
U-WLB1515-9
D
PIN ID
6X-Ø b |
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e |
E |
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e |
e |
e |
A3 A2 A
SEATING PLANE
U-WLB1515-9
Dim |
Min |
Max |
Typ |
A |
- |
0.62 |
- |
A2 |
- |
0.36 |
0.36 |
A3 |
0.020 |
0.030 |
0.025 |
b |
0.27 |
0.37 |
0.32 |
D |
1.47 |
1.51 |
1.49 |
E |
1.47 |
1.51 |
1.49 |
e |
- |
- |
0.50 |
All Dimensions in mm
Suggested Pad Layout
U-WLB1515-9
D
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Dimensions |
Value |
C1 |
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(in mm) |
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C |
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C |
0.50 |
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C1 |
1.00 |
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C2 |
1.00 |
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D |
0.25 |
C
C2
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
201 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
A
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D |
R=0.10 |
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b1 |
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L1 |
L2 |
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K |
X3-WLB1608-2
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A1 |
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X3-WLB1608-2 |
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Seating Plane |
Dim |
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Typ |
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A |
0.250 |
0.300 |
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0.275 |
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A1 |
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0.015 |
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b |
- |
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0.600 |
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b1 |
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0.600 |
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D |
1.57 |
1.63 |
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1.60 |
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E |
0.77 |
0.83 |
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0.80 |
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bE |
K |
- |
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0.282 |
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L1 |
0.25 |
0.35 |
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0.30 |
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L2 |
0.90 |
1.00 |
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0.95 |
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All Dimensions in mm |
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Suggested Pad Layout
X3-WLB1608-2
X2
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Dimensions |
Value |
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(in mm) |
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X |
0.385 |
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Y |
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X1 |
1.035 |
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X2 |
1.622 |
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Y |
0.690 |
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X X1
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
202 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
A
D
L
L/2
K
Eb1
L3 
L2
X2-WLB1608-3
A1
Seating Plane
Z12X
b2X
X2-WLB1608-3
Dim |
Min |
Max |
Typ |
A |
− |
0.310 |
− |
A1 |
0.015 |
0.025 |
0.020 |
b |
0.190 |
0.250 |
0.220 |
b1 |
0.570 |
0.630 |
0.600 |
D |
1.570 |
1.630 |
1.600 |
E |
0.770 |
0.830 |
0.800 |
L |
1.384 |
1.484 |
1.434 |
L2 |
0.784 |
0.844 |
0.814 |
L3 |
0.280 |
0.340 |
0.310 |
K |
0.10 |
0.22 |
0.16 |
Z1 |
0.07 |
0.13 |
0.10 |
All Dimensions in mm
Suggested Pad Layout
X2-WLB1608-3
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X2 |
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Dimensions |
Value |
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(in mm) |
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X |
0.410 |
Y |
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X1 |
0.914 |
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X2 |
1.534 |
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Y3 |
0.700 |
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X |
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X1 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
203 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
U-WLB1818-4
D |
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1 |
2 |
PINID |
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A |
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B |
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A1 |
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e |
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B |
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U-WLB1818-4 |
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e |
Dim |
Min |
Max |
Typ |
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E |
A |
− |
0.62 |
− |
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A |
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A2 |
− |
− |
0.36 |
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6X-Øb |
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b |
− |
− |
0.30 |
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D |
1.75 |
1.80 |
1.79 |
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1 |
2 |
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E |
1.75 |
1.80 |
1.79 |
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A2 |
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e |
− |
− |
0.65 |
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A |
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All Dimensions in mm |
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SEATIN G
PLANE
Suggested Pad Layout
U-WLB1818-4
D4x |
1 |
2 |
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C |
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Value |
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︶ |
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Dimensions |
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A |
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(in mm) |
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C |
C |
0.65 |
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D |
0.30 |
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B |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
204 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
D |
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e |
X1-WLB1818-4 |
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︶ |
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Øb4x |
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B |
B |
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E |
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e |
A |
A |
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PIN#1 |
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1 2 |
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2 1 |
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A3 |
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A2 |
Backsid eCoating |
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Seating Plane |
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A |
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A1
X1-WLB1818-4
Dim Min Max Typ
A 0.3420 0.4080 0.3750
A1 0.1350 0.1650 0.1500
A2 0.1850 0.2150 0.2000
A3 0.0220 0.0280 0.0250
b 0.2700 0.3300 0.3000
D1.7800 1.8000 1.7900
E1.7800 1.8000 1.7900
e |
0.650 BSC |
All Dimensions in mm
Suggested Pad Layout
X1-WLB1818-4
D4x |
1 |
2 |
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C |
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Value |
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︶ |
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Dimensions |
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A |
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(in mm) |
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C |
C |
0.65 |
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D |
0.30 |
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B |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
205 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
X2-WLB2010-2
A1
A
Seating Plane
Cathode |
R |
D |
Notch |
k |
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0 |
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1 |
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E 
L
b2x
X2-WLB2010-2
Dim |
Min |
Max |
Typ |
A |
− |
0.305 |
0.290 |
A1 |
− |
0.02 |
0.011 |
b |
− |
− |
0.48 |
D |
1.950 |
2.050 |
2.000 |
E |
0.950 |
1.050 |
1.000 |
k |
− |
− |
0.972 |
L |
− |
− |
0.932 |
All Dimensions in mm
Suggested Pad Layout
X2-WLB2010-2
X
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Dimensions |
Value (in mm) |
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G |
0.872 |
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X |
0.580 |
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G |
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X1 |
2.032 |
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Y |
1.032 |
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X1 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
206 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
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X2-WLB2718-6 |
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D |
e |
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1 |
2 |
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PINID |
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A |
C |
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e |
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B |
E B |
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C |
A |
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1 |
2 |
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A1 |
A2 |
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A |
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SEATIN G |
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PLANE |
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X2-WLB2718-6
Dim |
Min |
Max |
Typ |
A |
− |
0.40 |
0.35 |
A1 |
− |
− |
0.15 |
A2 |
− |
− |
0.20 |
b |
0.25 |
0.35 |
0.30 |
D |
1.75 |
1.80 |
1.79 |
E |
2.65 |
2.70 |
2.69 |
e |
− |
− |
0.65 |
All Dimensions in mm
Suggested Pad Layout
︶ |
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X2-WLB2718-6 |
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D6x |
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1 |
2 |
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A |
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C |
Dimensions |
Value |
B |
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(in mm) |
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C |
C |
0.65 |
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D |
0.30 |
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C |
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C |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
207 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
X4-WLCUP0505-3
D
E
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L1 |
L |
K |
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L2 |
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b |
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b |
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K |
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X4-WLCUP0505-3 |
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A1 |
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A |
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A |
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− |
0.22 |
0.20 |
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A1 |
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0.006 |
0.001 |
0.008 |
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b |
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0.12 |
0.18 |
0.15 |
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SEATIN GPLANE |
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D |
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0.54 |
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E |
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0.54 |
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K |
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0.20 |
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L |
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0.47 |
0.53 |
0.50 |
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L1 |
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0.12 |
0.18 |
0.15 |
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L2 |
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0.12 |
0.18 |
0.15 |
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All |
Dimensions in mm |
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Suggested Pad Layout
X4-WLCUP0505-3
X1
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Y |
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Value |
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X |
0.17 |
Y1 |
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X1 |
0.54 |
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Y |
0.17 |
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Y |
Y1 |
0.54 |
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||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
208 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
X2-WLCUP2010-2
A1
A
Seating Plane
Cathode |
R |
D |
Notch |
k |
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0 |
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1 |
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0 |
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E 
L
b2x
X2-WLCUP2010-2
Dim |
Min |
Max |
Typ |
A |
− |
0.305 |
0.290 |
A1 |
− |
0.02 |
0.011 |
b |
− |
− |
0.48 |
D |
1.950 |
2.050 |
2.000 |
E |
0.950 |
1.050 |
1.000 |
k |
− |
− |
0.972 |
L |
− |
− |
0.932 |
All Dimensions in mm
Suggested Pad Layout
X2-WLCUP2010-2
X
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Dimensions |
Value (in mm) |
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G |
0.872 |
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Y |
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X |
0.580 |
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X1 |
2.032 |
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Y |
1.032 |
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G |
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X1 |
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||||||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
209 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
X4-WLCUS0603-2
A A1
|
D |
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e |
E |
b (2X) |
|
|
|
L (2x) |
X4-WLCUS0603-2
Dim |
Min |
Max |
Typ |
A |
- |
- |
0.20 |
A1 |
0.006 |
0.01 |
0.008 |
b |
0.19 |
0.29 |
0.24 |
D |
0.595 |
0.645 |
0.62 |
E |
0.295 |
0.345 |
0.32 |
e |
- |
- |
0.355 |
L |
0.14 |
0.24 |
0.19 |
All Dimensions in mm
Suggested Pad Layout
X4-WLCUS0603-2
X1
X 
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Dimensions |
Value (in mm) |
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C |
0.380 |
Y |
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X |
0.230 |
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X1 |
0.610 |
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Y |
0.300 |
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C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
210 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |