Package Outline Dimensions
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POWERDI®5060-8 (Type B) |
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︶ |
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D |
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b8X |
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D1 |
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e/2 |
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K |
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L |
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︶ |
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b24X |
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D2 |
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E1E |
E2 |
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1.40 |
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K1 |
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1.90 |
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M |
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E3 |
M1 |
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Ø1.0Depth07±..03 |
G |
e |
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L1 |
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θ (4 ) |
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X |
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A |
c |
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A1 |
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DETAIL A |
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θ1 X(4 )
POWERDI®5060-8
TYPE B
Dim |
Min |
Max |
Typ |
A |
0.90 |
1.10 |
1.00 |
A1 |
0.00 |
0.05 |
–– |
b |
0.33 |
0.51 |
0.41 |
b2 |
0.20 |
0.40 |
0.273 |
c |
0.230 |
0.330 |
0.273 |
D |
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5.15 BSC |
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D1 |
4.70 |
5.10 |
4.90 |
D2 |
3.50 |
4.40 |
3.90 |
E |
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6.15 BSC |
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E1 |
5.60 |
6.00 |
5.80 |
E2 |
2.25 |
2.65 |
2.45 |
E3 |
0.595 |
0.995 |
0.795 |
e |
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1.27 BSC |
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G |
0.51 |
0.71 |
0.61 |
K |
0.51 |
–– |
–– |
K1 |
0.51 |
–– |
–– |
L |
0.51 |
0.71 |
0.61 |
L1 |
0.05 |
0.20 |
0.175 |
M |
3.235 |
4.035 |
3.635 |
M1 |
1.00 |
1.40 |
1.21 |
θ1 |
10° |
12° |
11° |
θ2 |
6° |
8° |
7° |
All Dimensions in mm
Suggested Pad Layout
POWERDI®5060-8 (Type B)
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X1 |
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Y1 |
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Dimensions |
Value (in mm) |
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Y3 |
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C |
1.270 |
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Y2 |
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X |
0.610 |
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X1 |
4.420 |
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Y |
0.910 |
Y6 |
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Y1 |
0.910 |
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Y2 |
0.895 |
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Y4 |
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Y5 |
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Y3 |
2.130 |
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Y4 |
0.585 |
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Y5 |
2.550 |
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Y6 |
6.550 |
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︶ |
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Y5x |
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C
X
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
121 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
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PowerDI5060-8 (Type C) |
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D |
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D1 |
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︶ |
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04x |
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x |
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c |
A1 |
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E1E |
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y |
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Seating Plane |
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e |
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1 |
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︶ |
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Ø1.0Depth07±..03 |
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014x |
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DETAIL A |
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︶ |
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b18x |
e/2 |
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b8x |
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1 |
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︶ |
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D3 |
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b22x |
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L |
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k |
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k1 |
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A |
E2 |
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D2 |
L4 |
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M |
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DETAIL A |
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D2 |
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La |
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L1 |
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PowerDI5060-8 (Type C)
Dim |
Min |
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Max |
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Typ |
A |
0.90 |
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1.10 |
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1.00 |
A1 |
0 |
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0.05 |
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0.02 |
b |
0.33 |
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0.51 |
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0.41 |
b1 |
0.300 |
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0.366 |
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0.333 |
b2 |
0.20 |
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0.35 |
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0.25 |
c |
0.23 |
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0.33 |
|
0.277 |
D |
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5.15 BSC |
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D1 |
4.85 |
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4.95 |
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4.90 |
D2 |
1.40 |
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1.60 |
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1.50 |
D3 |
- |
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- |
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3.98 |
E |
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6.15 BSC |
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E1 |
5.75 |
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5.85 |
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5.80 |
E2 |
3.56 |
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3.76 |
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3.66 |
e |
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1.27BSC |
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k |
- |
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- |
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1.27 |
k1 |
0.56 |
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- |
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- |
L |
0.51 |
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0.71 |
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0.61 |
La |
0.51 |
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0.71 |
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0.61 |
L1 |
0.05 |
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0.20 |
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0.175 |
L4 |
- |
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0.125 |
M |
3.50 |
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3.71 |
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3.605 |
x |
- |
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1.400 |
y |
- |
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1.900 |
θ |
10° |
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12° |
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11° |
θ1 |
6° |
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8° |
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7° |
All Dimensions in mm
Suggested Pad Layout
PowerDI5060-8 (Type C)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
122 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
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X4 |
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8 |
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Dimensions |
Value |
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(in mm) |
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C |
1.270 |
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X3 |
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Y1 |
G |
0.660 |
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X2 |
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G1 |
0.820 |
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Y2 |
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X |
0.610 |
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X1 |
3.910 |
Y3 |
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G1 |
X2 |
1.650 |
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|
|
|
|
|
|
|
X3 |
1.650 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
X1 |
|
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|
|
|
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|
|
|
|
|
|
|
|
|
|
|
|
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|
X4 |
4.420 |
|
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|
|
|
|
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|
|
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|
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|
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|
Y |
1.270 |
|
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|
|
|
Y4x |
Y1 |
1.020 |
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|
|
︶ |
Y2 |
3.810 |
|
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|
Y3 |
6.610 |
|
|
|
1 |
|
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|
X |
|
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|
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|
|
C |
|
|
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|
|
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|
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|
G |
|
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|
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|
|
|
|
|
|
|
|
|
|
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
123 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
POWERDI®5SP
|
E |
E/2 |
|
|
|
|
|
b 2x |
J 4x |
K 4x |
|
|
|
|
M 4x |
R |
|
|
|
|
D |
N 8x |
3 |
|
|
|
|
E1 |
|
|
|
TOP VIEW |
|
|
|
? |
Cutting Burr Side |
|
A |
|
|
8x cut faces are not tin plated
|
|
|
POWERDI®5SP |
|
|
R1 |
Dim |
Min |
Max |
Typ |
|
A |
− |
0.75 |
− |
|
|
|
c |
b |
4.30 |
4.50 |
4.40 |
|
c |
0.155 |
0.195 |
− |
|
|
D |
5.70 |
5.90 |
5.80 |
|
|
D2 |
4.40 |
− |
− |
|
R2 |
E |
23.6 |
24.0 |
23.8 |
|
E1 |
5.70 |
5.90 |
5.80 |
|
|
|
|
E2 |
2.74 |
− |
− |
|
|
H1 |
0.19 |
0.21 |
0.20 |
|
|
J |
− |
− |
0.20 |
|
|
K |
− |
− |
0.30 |
|
|
L |
− |
− |
9.00 |
|
|
L1 |
− |
− |
2.50 |
|
|
M |
− |
− |
0.30 |
|
|
N |
0 |
0.20 |
− |
|
|
R |
− |
− |
0.40 |
|
|
R1 |
− |
− |
0.15 |
|
|
R2 |
− |
− |
0.25 |
|
|
R3 |
− |
− |
0.40 |
|
|
W |
1.66 |
2.06 |
− |
|
|
θ |
8º |
12º |
− |
|
|
θ1 |
3º |
7º |
− |
|
|
All |
Dimensions in mm |
Suggested Pad Layout
|
|
|
|
X |
|
|
G |
|
|
|
|
|
|
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|
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|
Dimensions |
Value |
|
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|
|
|
(in mm) |
|
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|
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|
|
|
G |
8.101 |
Y |
|
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|
|
|
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|
X |
8.100 |
|
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|
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|
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|
|
|
|
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|
|
|
|
|
Y |
5.100 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
124 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
POWERDI®5SP (Type B)
|
|
|
E |
E/2 |
|
|
|
|
E1/2 |
K 4x |
|
|
|
|
J 4x |
|
|
|
|
|
|
|
N 8x |
M 4x |
R |
|
D |
b 2x |
|
3 |
|
|
|
|
|
|
|
|
|
|
2 |
|
|
|
E1 |
|
R |
|
|
|
|
|
|
|
A |
TOP VIEW |
H1 |
|
|
|
|
ø |
Cutting Burr Side |
|
8x cut faces are not |
ø1 |
V Groove Inner Line |
|
|
|
|
|
|
tin plated |
E2 |
|
|
|
|
|
L 2x |
|
|
|
|
|
|
R
D2
BOTTOM VIEW
|
|
|
|
POWERDI®5SP |
|
|
R1 |
|
Type B |
|
|
Dim |
Min |
Max |
Typ |
|
|
|
|
c |
|
A |
− |
0.75 |
− |
|
|
b |
4.30 |
4.50 |
4.40 |
|
|
|
|
|
c |
0.155 |
0.191 |
− |
|
|
|
D |
5.70 |
5.90 |
5.80 |
|
|
|
D2 |
4.40 |
− |
− |
|
|
|
E |
20.8 |
21.2 |
21.0 |
|
|
|
E1 |
5.70 |
5.90 |
5.80 |
|
|
|
E2 |
2.90 |
− |
− |
|
|
|
H1 |
0.19 |
0.21 |
0.20 |
|
|
|
J |
− |
− |
0.20 |
|
|
|
K |
− |
− |
0.30 |
|
|
|
L |
− |
− |
7.60 |
|
|
|
L1 |
− |
− |
2.50 |
|
|
|
M |
− |
− |
0.30 |
|
|
|
N |
0 |
0.20 |
− |
|
|
|
R |
− |
− |
0.40 |
|
|
|
R1 |
− |
− |
0.15 |
|
|
|
R2 |
− |
− |
0.25 |
|
|
|
R3 |
− |
− |
0.40 |
|
|
|
W |
1.63 |
1.97 |
1.80 |
|
|
|
Ø |
8º |
12º |
− |
|
|
|
Ø1 |
3º |
7º |
− |
|
|
|
All |
Dimensions in mm |
Suggested Pad Layout
|
|
|
|
X |
|
|
G |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Dimensions |
Value |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(in mm) |
|
|
|
|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
G |
8.101 |
Y |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
X |
8.100 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y |
5.100 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
125 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
W-QFN3020-12 |
E |
L |
L1 |
|
PIN#1ID |
|
|
|
L2 |
|
|
e |
b |
D |
|
|
|
|
e1 |
b1 |
|
|
|
AA3 |
b |
A |
|
|
|
-QFN3020-12
Dim |
Min |
Max |
Typ |
A |
0.700 |
0.800 |
- |
A1 |
0 |
0.05 |
- |
A3 |
|
0.203REF |
|
b |
0.200 |
0.300 |
- |
b1 |
0.350 |
0.450 |
- |
D |
1.900 |
2.100 |
2.000 |
E |
2.900 |
3.100 |
3.000 |
e |
- |
- |
0.500 |
e1 |
- |
- |
0.575 |
L |
0.350 |
0.450 |
- |
L1 |
0.450 |
0.550 |
- |
L2 |
0.750 |
0.850 |
- |
All Dimensions in mm
Suggested Pad Layout
W-QFN3020-12
|
|
|
|
|
|
|
|
|
|
|
|
X1 |
|
|
|
|
|
|
|
|
|
X |
|
|
|
|
|
|
|
|
|
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|
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|
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|
|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Dimensions |
Value |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
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|
|
|
|
|
|
|
|
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|
|
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|
|
|
|
|
|
|
|
|
|
|
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|
|
|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
(in mm) |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
|
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|
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|
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|
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|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
C |
0.500 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
G |
0.575 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y |
|
|
C |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
X |
0.650 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
X1 |
0.750 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y2 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y4 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
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|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
X2 |
0.350 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
|
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|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
X3 |
2.400 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
C1 |
Y |
0.300 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y1 |
0.450 |
|
|
Y1 |
|
|
|
|
|
|
|
|
|
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|
|
|
|
|
Y3 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Y2 |
0.900 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
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|
Y3 |
1.050 |
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Y4 |
3.400 |
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X2 |
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X3 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
126 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
U-QFN4040-16 (Type C)
|
A3 |
|
U-QFN4040-16 |
|
|
|
|
|
|
|
|
Type C |
|
|
|
|
|
Dim |
Min |
Max |
Typ |
|
|
|
|
A |
0.57 |
0.63 |
0.60 |
|
|
|
|
|
|
|
|
A1 |
0 |
0.05 |
0.02 |
|
|
|
|
A3 |
- |
- |
0.15 |
|
|
|
|
|
K |
|
b |
0.25 |
0.35 |
0.30 |
|
|
D |
3.95 |
4.05 |
4.00 |
|
|
|
|
D2 |
1.04 |
1.24 |
1.14 |
|
|
|
|
|
|
|
|
E |
3.95 |
4.05 |
4.00 |
|
K2 |
|
E2 |
1.01 |
1.21 |
1.11 |
|
|
e |
- |
- |
0.65 |
|
|
|
|
|
|
|
|
K |
- |
- |
0.30 |
|
|
|
|
|
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|
K1 |
- |
- |
0.32 |
|
|
|
|
K2 |
- |
- |
0.38 |
|
|
|
|
|
L |
|
L |
0.35 |
0.45 |
0.40 |
|
|
All Dimensions in mm |
|
|
|
|
|
|
Suggested Pad Layout |
|
|
|
|
|
U-QFN4040-16 (Type C) |
|
|
|
X (8x) |
C |
|
|
|
|
|
|
|
Y1 (8x) |
Y (4x) |
Dimensions |
Value |
|
(in mm) |
|
|
C |
|
|
|
0.650 |
|
|
|
X |
0.400 |
|
|
|
X1 |
2.075 |
|
|
Y5 |
X2 |
0.550 |
|
|
X3 |
2.075 |
|
|
|
|
|
|
X4 |
4.400 |
|
Y2 |
|
Y |
0.650 |
|
Y3 |
Y1 |
0.400 |
|
X1 |
|
|
|
Y2 |
1.225 |
|
X2 (8x) |
|
Y3 |
2.075 |
|
Y4 (4x) |
Y4 |
0.550 |
|
|
|
1 |
|
Y5 |
4.400 |
|
X3 |
|
|
|
|
|
|
|
|
X4 |
|
|
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
127 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions |
|
|
|
|
|
A1 |
U-QFN4040-20 |
|
|
|
|
A3 |
|
|
|
|
|
|
|
|
A |
|
Seating Plane |
U-QFN4040-20 |
|
|
|
|
|
D |
Dim |
Min |
Max |
Typ |
(Pin #1 ID) |
A |
0.55 |
0.65 |
0.60 |
|
|
A1 |
0 |
0.05 |
0.02 |
|
|
A3 |
- |
- |
0.15 |
|
|
b |
0.20 |
0.30 |
0.25 |
|
e |
D |
3.95 |
4.05 |
4.00 |
|
E2 |
D2 |
2.40 |
2.60 |
2.50 |
E |
|
E |
3.95 |
4.05 |
4.00 |
|
D2 |
E2 |
2.40 |
2.60 |
2.50 |
|
|
e |
|
0.50 BSC |
|
|
L |
0.35 |
0.45 |
0.40 |
|
L |
Z |
- |
- |
0.875 |
|
All Dimensions in mm |
|
|
Z (8x) |
b |
|
|
|
|
Suggested Pad Layout
U-QFN4040-20
|
X3 |
|
X1 |
|
Y1 |
Y3 |
Y2 |
|
|
X2 |
|
Y |
X |
1 |
C |
|
Dimensions |
Value |
|
(in mm) |
|
|
|
C |
0.500 |
|
X |
0.350 |
|
X1 |
0.600 |
|
X2 |
2.500 |
|
X3 |
4.300 |
|
Y |
0.600 |
|
Y1 |
0.350 |
|
Y2 |
2.500 |
|
Y3 |
4.300 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
128 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
V-QFN4525-20 |
|
|
A1 |
A3 |
A |
|
|
|
|
|
|
|
|
Seating Plane |
|
|
Pin#1ID |
D |
|
|
|
|
|
|
e |
|
|
|
︶ |
|
|
Z14x |
|
E |
|
|
|
|
|
E2 |
|
|
|
D2 |
|
|
|
︶ |
|
︶ |
L20x |
|
︶ |
|
|
Z4x |
b20x |
|
V-QFN4525-20
Dim |
Min |
Max |
Typ |
A |
0.75 |
0.85 |
0.80 |
A1 |
0.00 |
0.05 |
0.02 |
A3 |
- |
- |
0.15 |
b |
0.18 |
0.30 |
0.23 |
D |
4.45 |
4.55 |
4.50 |
D2 |
2.85 |
3.15 |
3.00 |
E |
2.45 |
2.55 |
2.50 |
E2 |
0.85 |
1.15 |
1.00 |
e |
|
0.50BSC |
|
L |
0.30 |
0.50 |
0.40 |
Z |
- |
- |
0.385 |
Z1 |
- |
- |
0.885 |
All Dimensions in mm
Suggested Pad Layout |
|
|
|
|
V-QFN4525-20 |
|
|
|
X4 |
|
|
|
X3 |
Dimensions |
Value (in mm) |
|
|
C |
0.500 |
|
|
X |
0.330 |
|
|
X1 |
0.600 |
|
X1 |
X2 |
3.200 |
|
X2 |
X3 |
3.830 |
|
X4 |
4.800 |
Y3 |
|
Y1 |
Y |
0.600 |
|
Y1 |
1.200 |
|
|
|
|
Y2 |
0.830 |
Y2 |
Y |
Y3 |
2.800 |
|
|
|
X |
C |
|
|
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
129 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
D |
|
ZD |
|
|
E1/2 |
|
E/2 |
|
|
E1 |
|
E |
PIN1 |
|
|
|
e |
b |
|
|
A2 |
|
|
|
|
A |
A1 |
|
|
QSOP-16
SEDETAIL 'A
h
h


c
θ14x 2θ
|
|
|
R1 |
|
|
|
R |
|
|
θ |
GAUGE PLANE |
|
|
|
|
L |
|
SEATIN GPLANE |
θ1 |
|
|
4x |
|
|
L2 |
︶ |
|
|
|
L1 |
|
|
QSOP-16
Dim |
Min |
|
Max |
Typ |
A |
1.55 |
|
1.73 |
- |
A1 |
0.10 |
|
0.25 |
- |
A2 |
1.40 |
|
1.50 |
- |
b |
0.20 |
|
0.30 |
- |
c |
0.18 |
|
0.25 |
- |
D |
4.80 |
|
5.00 |
- |
E |
5.79 |
|
6.20 |
- |
E1 |
3.81 |
|
3.99 |
- |
e |
0.635 BSC |
|
h |
0.254 |
|
0.508 |
- |
L |
0.41 |
|
1.27 |
- |
L1 |
|
|
1.03 REF |
|
L2 |
|
0.254 BSC |
|
R |
0.0762 |
|
- |
- |
R1 |
0.0762 |
|
- |
- |
ZD |
|
|
0.23 REF |
|
θ |
0° |
|
8° |
- |
θ1 |
5° |
|
15° |
- |
θ2 |
0° |
|
- |
- |
All Dimensions in mm
QSOP-16
|
Dimensions |
Value |
|
(in mm) |
|
|
|
C |
0.635 |
|
X |
0.350 |
|
X1 |
4.795 |
|
Y |
1.450 |
|
Y1 |
6.400 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
130 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |