Материалы к лабораторным работам / ГОСТы / Packages_Diodes_Inc
.pdf
Package Outline Dimensions
U-DFN6040-12
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A1 |
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A |
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D |
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e |
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D1 |
D2 |
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E2 |
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E |
E1 |
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Z |
b |
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A3 |
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U-DFN6040-12 |
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Seating Plane |
Dim |
Min |
Max |
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Typ |
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A |
0.55 |
0.65 |
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0.60 |
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A1 |
0 |
0.05 |
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0.02 |
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A3 |
- |
- |
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0.15 |
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b |
0.35 |
0.45 |
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0.40 |
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D |
5.95 |
6.05 |
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6.00 |
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D1 |
1.95 |
2.15 |
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2.05 |
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D2 |
2.35 |
2.55 |
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2.45 |
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e |
- |
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1.00 |
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E |
3.95 |
4.05 |
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4.00 |
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L |
E1 |
2.10 |
2.30 |
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2.20 |
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E2 |
1.80 |
2.00 |
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1.90 |
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L |
0.35 |
0.45 |
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0.40 |
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Z |
- |
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0.30 |
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All |
Dimensions in mm |
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Suggested Pad Layout
U-DFN6040-12
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X3 |
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C |
Y1 |
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X1 |
X2 |
Pin1 |
X |
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Y |
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Dimensions |
Value |
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G |
(in mm) |
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C |
0.500 |
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G |
0.650 |
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G1 |
0.350 |
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X |
0.250 |
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X1 |
1.075 |
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Y3 |
X2 |
1.275 |
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Y2 |
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G1 |
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X3 |
2.750 |
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Y |
0.400 |
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Y1 |
1.150 |
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Y2 |
1.000 |
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Y3 |
2.300 |
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
101 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
V-DFN6040-22
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A1 |
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A3 |
A |
Seating Plane |
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D |
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e |
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L |
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D2 |
E |
E2 |
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D2a |
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PIN#1ID. |
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C0.3 |
Z |
b |
V-DFN6040-22
Dim |
Min |
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Max |
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Typ |
A |
0.75 |
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0.85 |
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0.80 |
A1 |
0.00 |
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0.05 |
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0.02 |
A3 |
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0.203 BSC |
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b |
0.20 |
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0.30 |
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0.25 |
D |
5.95 |
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6.05 |
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6.00 |
D2 |
3.82 |
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4.02 |
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3.92 |
D2a |
1.10 |
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1.30 |
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1.20 |
E |
3.95 |
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4.05 |
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4.00 |
E2 |
2.44 |
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2.64 |
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2.54 |
e |
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0.50 BSC |
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L |
0.35 |
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0.45 |
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0.40 |
Z |
- |
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0.375 |
All Dimensions in mm
Suggested Pad Layout
V-DFN6040-22
X3
X1
X2
G1

G
Y1
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Dimensions |
Value |
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(in mm) |
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C |
0.500 |
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G |
0.280 |
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G1 |
0.200 |
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X |
0.350 |
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X1 |
1.330 |
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Y2 |
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X2 |
4.050 |
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X3 |
5.660 |
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Y |
0.650 |
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Y1 |
0.270 |
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Y2 |
4.400 |
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Y


X C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
102 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
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D-FLAT |
H |
L k |
E |
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E |
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b |
D
A
c
D-FLAT
Dim |
Min |
Max |
A |
0.90 |
1.10 |
b |
1.25 |
1.65 |
c |
0.10 |
0.40 |
D |
2.25 |
2.95 |
E |
3.95 |
4.60 |
k |
2.80 |
- |
HE |
5.00 |
5.60 |
L |
0.50 |
1.30 |
All Dimensions in mm
Suggested Pad Layout
D-FLAT
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X |
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X1 |
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Dimensions |
Value |
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Y |
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C |
4.65 |
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G |
2.80 |
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X |
1.85 |
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X1 |
6.50 |
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Y |
1.70 |
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G |
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C |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
103 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
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DF-S |
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L |
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G |
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DF-S |
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Dim |
Min |
Max |
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A |
7.40 |
7.90 |
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B |
6.20 |
6.50 |
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A B |
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D |
E |
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C |
0.22 |
0.30 |
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D |
0.076 |
0.33 |
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E |
- |
10.40 |
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G |
1.02 |
1.53 |
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H |
8.13 |
8.51 |
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J |
2.40 |
2.60 |
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K |
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L |
1.00 |
1.20 |
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All Dimensions in mm |
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K |
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Suggested Pad Layout |
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DF-S |
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X |
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Dimensions |
DF-S |
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Z |
10.26 |
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Z |
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X |
1.2 |
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Y |
1.52 |
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C |
5.2 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
104 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
U-FLGA1515-9
A1 |
A3 |
A |
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Seating Plane
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D |
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e |
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1 |
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0 |
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E |
R |
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Pin#1ID |
e |
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Z |
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bSQ. |
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U-FLGA1515-9
Dim |
Min |
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Max |
Typ |
A |
0.55 |
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0.65 |
0.60 |
A1 |
0 |
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0.05 |
0.02 |
A3 |
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0.13 BSC |
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b |
0.20 |
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0.30 |
0.25 |
D |
1.45 |
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1.55 |
1.50 |
E |
1.45 |
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1.55 |
1.50 |
e |
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0.50 BSC |
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Z |
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0.125 BSC |
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All Dimensions in mm
Suggested Pad Layout
U-FLGA1515-9
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X1 |
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X |
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G |
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Dimensions |
Value |
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(in mm) |
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C |
0.587 |
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G |
0.150 |
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G1 |
0.150 |
Y2Y1 |
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X |
0.525 |
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G1 |
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X1 |
0.350 |
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X2 |
1.700 |
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Y |
0.525 |
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Y1 |
0.350 |
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C |
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Y2 |
1.700 |
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X2 |
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|||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
105 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
|
|
W-FLGA2520-17 |
|
|
|
A3 |
|
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|
A1 |
|
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Seating Plane |
|
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A |
E |
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e |
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Pin#1ID |
||
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Pin#1ID |
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L |
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D |
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La |
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b |
W-FLGA2520-17
Dim Min Max
A |
0.700 |
0.800 |
A1 |
0 |
0.050 |
A3 |
0.0203REF |
|
b |
0.200 |
0.300 |
D |
2.420 |
2.580 |
E |
1.950 |
2.050 |
e |
0.500TYP |
|
L |
0.320 |
0.480 |
La |
0.424 |
0.576 |
All Dimensions in mm
Suggested Pad Layout
Y19x
X8x
W-FLGA2520-17
X3
X2
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Dimensions |
Value |
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(in mm) |
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C |
0.500 |
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X |
0.350 |
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X1 |
0.600 |
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X2 |
1.850 |
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Y2Y3 |
X3 |
2.320 |
||||||
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X19x |
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︶ |
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Y |
0.600 |
|||
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Y1 |
0.350 |
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Y2 |
1.350 |
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Y8x |
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Y3 |
2.800 |
||||
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︶ |
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|
C
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
106 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
MiniDIP
|
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L |
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G |
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MiniDIP |
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Dim |
Min |
Max |
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A |
5.43 |
5.75 |
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B |
3.6 |
4.0 |
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A B |
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D |
E |
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0.15 |
0.35 |
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D |
0.05 |
0.20 |
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E |
- |
7.0 |
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G |
0.70 |
1.10 |
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H |
4.5 |
4.9 |
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H |
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C |
J |
2.3 |
2.7 |
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K |
2.3 |
2.7 |
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L |
0.50 |
0.80 |
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All Dimensions in mm |
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K |
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Suggested Pad Layout
MiniDIP
X
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Dimensions |
DF-S |
MiniDIP |
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Z |
10.26 |
6.91 |
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Z |
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X |
1.2 |
0.60 |
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Y |
1.52 |
0.76 |
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C |
5.2 |
2.67 |
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C |
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||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
107 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
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MiniMELF |
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A |
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MiniMELF |
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Dim |
Min |
Max |
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A |
3.30 |
3.70 |
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B |
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B |
1.30 |
1.60 |
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C |
0.28 |
0.50 |
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C |
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All |
Dimensions |
in mm |
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Suggested Pad Layout
MiniMELF
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X |
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X1 |
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Dimensions |
Value (in mm) |
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MiniMELF |
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C |
3.50 |
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G |
2.10 |
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X |
1.30 |
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X1 |
4.70 |
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G |
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Y |
1.70 |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
108 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
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MELF |
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A |
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MELF |
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Dim |
Min |
Max |
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A |
4.80 |
5.20 |
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B |
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B |
2.40 |
2.60 |
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C |
0.55 |
Typ |
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C |
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All |
Dimensions in mm |
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Suggested Pad Layout
MELF
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X |
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X1 |
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Dimensions |
Value (in mm) |
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C |
4.80 |
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G |
3.30 |
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X |
1.50 |
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X1 |
6.30 |
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G |
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Y |
2.70 |
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C |
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|||||||||||||||||||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
109 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions


b




A