Материалы к лабораторным работам / ГОСТы / Packages_Diodes_Inc
.pdf
Package Outline Dimensions
DO-201AD
DO-201AD
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A |
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25.40 |
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- |
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B |
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7.20 |
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9.50 |
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C |
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1.20 |
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1.30 |
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D |
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4.80 |
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5.30 |
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All |
Dimensions in |
mm |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
221 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
R-6
R-6
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A |
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25.40 |
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- |
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B |
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8.60 |
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9.10 |
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C |
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1.20 |
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1.30 |
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D |
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8.60 |
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9.10 |
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All |
Dimensions in |
mm |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
222 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
T-1
T-1
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Dim |
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Max |
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A |
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25.40 |
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- |
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B |
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2.60 |
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3.20 |
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C |
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0.53 |
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0.64 |
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D |
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2.20 |
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2.60 |
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All |
Dimensions in |
mm |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
223 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
Package Outline Dimensions
DF-M
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C |
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DF-M |
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Dim |
Min |
Max |
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B |
A |
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E |
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A |
7.40 |
7.90 |
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B |
6.20 |
6.50 |
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C |
0.22 |
0.30 |
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D |
1.27 |
2.03 |
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E |
7.60 |
8.90 |
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H |
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G |
3.81 |
4.69 |
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D |
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H |
8.13 |
8.51 |
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J |
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J |
2.40 |
3.40 |
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K |
5.00 |
5.20 |
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L |
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G |
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L |
0.46 |
0.58 |
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All Dimensions in mm |
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K |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
224 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
E-Line
D |
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D |
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EJECTION MARK |
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E |
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E-Line |
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Dim |
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Typ |
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A |
2.16 |
2.41 |
− |
F |
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L1 |
b |
0.41 |
0.495 |
− |
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b1 |
0.41 |
0.495 |
− |
L* |
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L |
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D |
4.37 |
4.77 |
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E |
3.61 |
4.01 |
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b |
SEATING PLANE |
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e |
− |
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1.27 |
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e2 |
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2.54 |
e |
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F |
− |
2.50 |
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e2 |
e2 |
L |
13.00 |
13.97 |
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e |
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L1 |
2.50 |
3.50 |
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BULK |
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AMMO |
All Dimensions in mm |
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b1
R 1.14 (.045)
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
225 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
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© Diodes Incorporated |
Package Outline Dimensions
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GBJ |
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GBJ |
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Min |
Max |
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L |
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A |
29.70 |
30.30 |
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B |
19.70 |
20.30 |
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M |
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A |
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K |
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C |
17.00 |
18.00 |
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D |
3.80 |
4.20 |
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E |
7.30 |
7.70 |
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B |
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G |
9.80 |
10.20 |
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_ |
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S |
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N |
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H |
2.00 |
2.40 |
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J |
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I |
0.90 |
1.10 |
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P |
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J |
2.30 |
2.70 |
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D |
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H |
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K |
3.0 X |
45° |
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C |
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R |
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L |
4.40 |
4.80 |
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I |
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M |
3.40 |
3.80 |
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N |
3.10 |
3.40 |
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P |
2.50 |
2.90 |
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R |
0.60 |
0.80 |
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S |
10.80 |
11.20 |
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G E |
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E |
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All Dimensions in mm |
|||||||||||||
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|||
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
226 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
GBPC
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H |
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GBPC |
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B |
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Dim |
Min |
Max |
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E |
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A |
28.30 |
28.80 |
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B |
7.40 |
8.00 |
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F |
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C |
16.10 |
17.10 |
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E |
18.80 |
21.30 |
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A |
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G |
13.80 |
14.80 |
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C |
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H |
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H |
Hole for |
#10 screw |
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5.08 |
5.59 |
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(AC) |
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J |
17.60 |
18.60 |
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(+) |
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F |
6.30 |
6.50 |
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J |
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A |
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C |
|
All Dimensions in mm |
||||||||
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( - ) |
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(AC) |
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G 

ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
227 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions |
|
|
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|
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|
GBPC-W |
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H |
|
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GBPC-W |
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B |
|
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Dim |
Min |
Max |
|
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A |
28.30 |
28.80 |
|
M |
|
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|||
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B |
7.40 |
8.00 |
|
L |
|
H |
Hole for #10 screw |
|
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J |
5.08 |
5.59 |
|
A |
|
17.60 |
18.60 |
|
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H |
K |
10.90 |
11.90 |
|
|
J |
L |
0.97 |
1.07 |
|
(AC) |
|
|
M |
31.80 |
- |
|
( + ) |
|
All Dimensions in mm |
||
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J |
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K |
A |
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( - ) |
(AC) |
|
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|
|
|
|
|
|
ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
228 of 263 |
Package Outline Dimensions |
|
www.diodes.com |
Suggested Pad Layout |
|
|
© Diodes Incorporated |
Package Outline Dimensions
|
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GBU |
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A |
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GBU |
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Dim |
Min |
Max |
||||
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K |
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B |
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M |
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A |
21.8 |
22.3 |
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B |
3.5 |
4.1 |
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C |
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C |
7.4 |
7.9 |
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D |
1.65 |
2.16 |
L |
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2.25 |
2.75 |
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D |
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1.95 |
2.35 |
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G |
1.02 |
1.27 |
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E |
H |
4.83 |
5.33 |
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F |
J |
17.5 |
18.0 |
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K |
3.2 X 45° |
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N |
L |
18.3 |
18.8 |
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G |
M |
3.30 |
3.56 |
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N |
0.46 |
0.56 |
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P |
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1.90R |
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P |
0.76 |
1.0 |
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All Dimensions in mm |
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ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Rev. 76 |
229 of 263 |
Package Outline Dimensions |
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www.diodes.com |
Suggested Pad Layout |
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© Diodes Incorporated |
