- •1 Combination Circuits
- •1.1 Circuitry ttl-elements with Shottky diodes
- •Levels of Integration
- •Typical Set of ttl iCs
- •Transistor-transistor logic (ttl)
- •1.2 Element with the open collector Open-collector outputs
- •Tristate outputs
- •1.3 Emitter-coupled logic (ecl)
- •Emitter-coupled multivibrator
- •Emitter-coupled Schmitt trigger
- •1.4 Decoder
- •Priority decoder
- •Binary Decoders
- •Decoder Networks
- •1.5 Coder units Encoder Networks
- •Binary Encoders
- •Priority Encoders
- •1.6 Multiplexers (Selectors)
- •1.7 Multiplexer Trees
- •Demultiplexer Networks
- •Encoder Networks
- •1.8 Demultiplexers (Distributors)
- •1.9 Applicanion of multiplexer
- •1.10 Code converters
- •1.11 Shifters
- •Shifter Networks
- •Barrel Shifter
- •1.12 Comparators
- •Window comparator
- •Digital comparators
- •2 Sequentional Circuits
- •2.1 Circuritry of flips
- •Sequential logic systems
- •Integrated flip-flops
- •Transparent flip-flops
- •Clocked rs flip-flop
- •Clocked d flip-flop
- •Flip-flops with intermediate storage
- •2.2 Flips types Single-edge-triggered flip-flops
- •2.3 Statik registers
- •2.4 Shift register Combinatorial shift register (barrel shifter)
- •Shift Registers
- •2.5 Counters
- •Asynchronous straight binary counter
- •Counters
- •Ripple Counters
- •Asynchronous bcd counter
- •2.6 Synchronous reversal counters
- •Synchronous straight binary counters
- •Synchronous bcd counter
- •Synchronous one-shot
- •Synchronous edge detector
- •Synchronous clock switch
- •2.7 Schmitt flip-flops Schmitt trigger
- •Inverting Schmitt trigger
- •Precision Schmitt trigger
- •3 Memory Devices
- •3.1 Circuitri of memori element Semiconductor memories
- •3.2 Mask-type lic of the rom
- •RaMs as shift registers
- •First-In-First-Out Memories (fifOs)
- •Fifo implementation using standard raMs
- •Error detection and correction
- •Parity bit
- •Hamming code
- •3.3 Rom with singl programming Read-only memories (roMs)
- •Mask-programmed roMs (mroMs)
- •Programmable roMs (proMs)
- •3.4 Memori element with electrical erase Electrically erasable proMs (eeproMs)
- •3.5 Static ram
- •Timing considerations
- •3.6 Dynamic raMs
- •Dynamic ram controllers
- •3.7 Devices programmed
- •Programmable logic array (pal)
Typical Set of ttl iCs
A TTL IC family includes a variety of combinational and sequential modules. Simple ones are packaged as SSI circuits, more complex ones as MSI/LSI circuits. The modules can be connected according to the fan-out and load characteristics. In some instances, a TTL module can be connected to a module from a different IC family that has TTL-compatible input/output.
A selection of typical SSI/MSI TTL integrated circuits concludes this section. For detailed descriptions of these ICs the reader should refer to IC data books. An integrated circuit module is described by a data sheet, which usually contains information about (1) the module function and its logic symbol, (2) its electrical characteristics, such as voltage and current levels, and the circuit diagram, (3) the module dynamic characteristics such as propagation delays and maximum frequency, (4) the operating conditions such as maximum temperature, (5) the type of package and pin assignments, and, perhaps, (6) hints about the use of the IC module.
The following listing provides examples of typical SSI/MSI/LSI TTL integrated circuits. Most of them are examples of the widely used low-power Schottky TTL IC family. The reader is urged to consult manufacturers' IC data books since this listing is neither complete nor detailed enough to be used for design purposes.
Table 1.2 - Combinational Integrated Circuits.
-
Description
Part Number
Typical Delay (ns)
Power (mW) (per chip)
Pin
Count
Inverters/Gates
Hex INVERTER
74LS04
9.5
12
14
Quad 2-input NAND
74LSOO
9.5
8
14
Triple 3-input NAND
74LS10
9.5
6
14
Dual 4-input NAND
74LS20
9.5
4
14
8-input NAND
74LS30
17
2.4
14
Quad 2-input NOR
74LS02
10
11
14
Quad 2-input AND
74LS08
12
17
14
4-wide AND-OR-NOT
74LS54
12.5
4.5
14
Quad XOR
74LS386
10
30
14
Quad 2-input NAND buffers
74LS38
19
17.2
14
Transistor-transistor logic (ttl)
TTL gates basically operate in exactly the same way as DTL gates. The only difference is in the design of the diode gate and amplifier. With the standard TTL gate in Fig. 1.1, the diode gate is replaced by transistor T1, incorporating several emitters. If all the input levels are in the H state, the current from R1 flows via the forward-biased base-collector diode of the input transistor to the base of T2, turning it on. If one input is at low potential, the relevant base-emitter diode becomes conducting and takes over the base current of T2. This turns T2 off and the output potential goes high.
Fig. 1.1 - Standard TTL nand gate, type 7400.
Power dissipation: 10 mW;
Gate propagation delay, tpd = 10ns
Fig. 1.2 - Transistor with Schottky anti-saturation diode and corresponding circuit symbol.
In TTL circuits, the amplifier consists of drive transistor T2 and a push-pull output stage (totem-pole circuit).
When T2 is conducting, T3 is also on and T4 is off. the output is at L and transistor T3 can accept high currents originating e.g. from the connected gate inputs. (In the L state, a current flows from the inputs!)
When T2 is off, T3 is also off. In this case T4 is turned on and delivers an H signal to the output. The transistor operated as an emitter follower can then supply high output currents and thus rapidly charge up load capacitances. Standard TTL circuits as shown in Fig. 1.1 are no longer used due to the gate propagation delay caused by the saturation of the transistors.
One method of preventing saturation consists of connecting a Schottky diode in parallel with the collector-base junction (Fig. 1.2). When the transistor is conducting, it provides voltage feedback to prevent the collector-emitter voltage falling below about 0.3 V. A TTL gate employing "Schottky transistors" of this type is shown in Fig. 1.3 which is actually a simplified representation of a low-power Schottky TTL gate. Comparison with the standard TTL gate in Fig. 1.1 shows that the values of the circuit resistors are a factor of 5 higher. The power consumption is lower by a factor of 5, being only 2 mW. Nevertheless, the gate propagation delay is no greater, being only 10 ns. The input diode gate, as in DTL circuits, consists of separate diodes. The diode D required in the output stage for level shifting (Fig. 1.1) is here replaced by Darlington pair T3.
Fig. 1.3 - Low-power Schottky TTL gate, type 74LSOO.
Power dissipation: 2 mW;
Gate propagation delay, tpd = 10ns
The transfer characteristic of the low-power Schottky TTL inverter (not operation) is shown in Fig.1.4 We can see that the switching level is around 1.1 V at the input. The specified tolerance limits are well exceeded: at the maximum permissible L level at the input of 0.8 V, an H level of at least 2.4 V must be present at the output. For the minimum H level at the input of 2.0 V, the L level at the output must be no more than 0.4 V.
Fig. 1.4 - Transfer characteristic of a low-power Schottky TTL inverter.
Hatched areas: Tolerance limits.
