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Bologna / 06_TCAD_laboratory_MOSFET_GBB_20150223H1655
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Drain current vs. Voltage chart (2): turn-on characteristics
Considering NMOS devices.
Turn-on characteristics= vs. , at fixed > (saturation condition)
saturation, ~ 2
G. Betti Beneventi 11
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The MOSFET: threshold voltage
• The turn-on phenomenon is a gradual function of the gate voltage. In semiconductor physics, the threshold voltage is usually defined as the gate voltage for which at the semiconductor-oxide interface the concentration of the inversion charge is higher that the concentration of the substrate doping, i.e. > − for NMOSFET, and > + for PMOSFET.
• It can be shown that, for NMOSFET = Φ + 2Φ +
where
Φ is the workfunction difference between the polysilicon gate and the silicon substrate
Φ = |
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where − = |
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•Therefore, increases if increases. From a qualitative point of view it is explained since ifis higher we have more holes at the surface and we need to increase the applied voltage to attract a sufficient number of electrons in such a way that electrons concentration will be higher than holes one.
•Then, increases if decreases. A lower means a lower electrostatic control on the channel (i.e. lower electric field), therefore, in order to get inversion we need to apply a higher .
•is pretty much independent on channel length.
G. Betti Beneventi 12
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The MOSFET: basic operation regimes (3)
• Subthreshold conduction
A closer inspection of the − curve (i.e. plot of the current in log-scale) reveals that the current does not drop abruptly to zero when < . It becomes apparent that the
MOSFET is already partially conducting for voltages below the threshold voltage. This effect is called subthreshold or weakinversion conduction. In fact, the onset of strong inversion means that a big number of carriers is available for conduction, but does not imply that no current at all can flow for< . In other words, the transition between offand onconditions is not abrupt, but gradual. It can be shown that the − curve features an exponential behavior for
< ,with a slope upper limited to 60 mV/dec at room temperature . Under these conditions, the diffusion process dominates over drift.
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where is an ideality factor ≥ 1
G. Betti Beneventi 13
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The structure
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the device is symmetric around the |
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vertical axis defined at x=0 |
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Only half of the device geometry can be defined, then the device structure is mirrored around the vertical axis
x=0 B
G. Betti Beneventi 14
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Geometrical definitions / MOSFET
Xg= Lg/2
zoom
Xsp
Ypol
x
Hpol
fillet_ radius
Xsub=0.5 μm |
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Ysub=1μm |
Xj |
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Lreox
y
oxide: extending y from 0 to –Tox=Ygox (very small, 2.5 nm)
y
G. Betti Beneventi 15
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SWB: project tools & parameters (1)
OPEN SWB FROM THE LINUX COMMAND LINE swb &
STARTING (AND SAVING) A NEW SWB PROJECT
Project New New Project
Project Save as Project MOSFET
ADD TOOLS
left click on No tools right click Add Name, scroll for Sde select Batch Ok left click on Sde right click Add Name scroll for Sdevice Ok
ADD ANOTHER Sdevice TOOL
left click on Sdevice right click Add Name scroll for Sdevice Ok
Double click on first Sdevice tool Input Files change name (double click on the Master field) in the Commands field to turn_on_des.cmd
Double click on second Sdevice tool Input Files change name in the Commands field to output_des.cmd
ADD PARAMETERS (WITH THEIR DEFAULT VALUES): SDE /GEOMETRY AND DOPING
Parameter Add Parameter Lg default value 0.13 Ok Right click on Lg Add Parameter Tox default value 10
Right click on Tox Add Parameter SubDop default value 1e18
G. Betti Beneventi 16
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SWB: project tools & parameters (2)
ADD PARAMETERS (WITH THEIR DEFAULT VALUES): Sdevice /MODELS AND VOLTAGES
Turn-on characteristics
We first increase VDS, that is we fix a VDS, than we sweep VGS from 0 to goal: right click on the cell directly below the first Sdevice instance
Add Parameter vds_fixed default value 1.5 Ok
Right click on vds_fixed Add Parameter vgs_goal default value 1.5
Output characteristics
We first increase VGS, that is we fix a VGS, than we sweep VDS from 0 to goal: right click on the cell directly below the second Sdevice instance
Add Parameter vgs_fixed default value 1.5 Ok
Right click on vgs_fixed Add Parameter vds_goal default value 1.5
G. Betti Beneventi 17
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SWB: project tools & parameters (3)
EXPERIMENT RAMIFICATION
Left click just below the box Lg of first line Nodes Extend Selection To Experiments Experiments Add Values Parameter Lg Min. Value: 0.13 Step: 0.1 Number of values: 3 Apply Ok
Then change the values to more suitable ones: F6 on n11 and write 0.250 and F6 on n20 and write 0.500
Left click just below the box Tox of first line Nodes Extend Selection To Experiments Experiments Add Values Parameter Tox Min. Value: 2.5e-3 Step: 1e-3 Number of values: 3 Apply Ok
Then change the values to more suitable ones: F6 on n29 and write 10e-3 and F6 on n37 and write 20e-3
Left click just below the box SubDop of first line Nodes Extend Selection To Experiments Experiments Add Values Parameter SubDop Min. Value: 1e18 Step: 1e18 Number of values: 3 Apply Ok
Then change the values to more suitable ones: F6 on n45 and write 1e15 and F6 on n52 and write 1e13
DONE SWB PART
G. Betti Beneventi 18
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SDE command file (1)
Select SDE image tool Right Click Edit input Commands then write in the text file the following commands:
;* CLEAR STRUCTURE
(sde:clear)
;New-replaces-old option (default) (sdegeo:set-default-boolean "ABA") ;*** DEFINITIONS ******
;** LATERAL (X-AXIS)
;gate length
(define Lg @Lg@)
;spacer length (define Lsp 0.1) (define Lreox 0.01) (define Ltot 1)
;VERTICAL (Y-AXIS)
;substrate thickness (define Hsub 1.0)
;gate oxide thickness
(define Tox @Tox@) |
G. Betti Beneventi 19 |
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SDE command file (2)
;polysilicon-gate thickness (define Hpol 0.2)
;spacer rounding
(define fillet-radius 0.08) ; rounding radius
;pn-junction mesh resolution (define Gpn 0.005)
;substrate doping level (define SubDop @SubDop@)
;junction depth
(define Xj 0.1 )
(define Xsub (/ Ltot 2.0))
; define
(define Xg (/ Lg 2.0))
; define spacer x-coordinate
(define Xsp (+ Xg Lsp))
(define Ysub Hsub)
G. Betti Beneventi 20