
- •Key Features
- •Key Benefits
- •Table Of Contents
- •Revision History
- •General Description
- •Dual Compute Blocks
- •Data Alignment Buffer (DAB)
- •Program Sequencer
- •Interrupt Controller
- •Flexible Instruction Set
- •DSP Memory
- •Host Interface
- •Multiprocessor Interface
- •SDRAM Controller
- •EPROM Interface
- •DMA Controller
- •Link Ports (LVDS)
- •Timer and General-Purpose I/O
- •Reset and Booting
- •Clock Domains
- •Power Domains
- •Filtering Reference Voltage and Clocks
- •Development Tools
- •Evaluation Kit
- •Additional Information
- •Pin Function Descriptions
- •Strap Pin Function Descriptions
- •ADSP-TS201S—Specifications
- •Recommended Operating Conditions
- •Electrical Characteristics
- •Absolute Maximum Ratings
- •ESD Sensitivity
- •Timing Specifications
- •General AC Timing
- •Link Port—Data Out Timing
- •Link Port—Data In Timing
- •Output Drive Currents
- •Test Conditions
- •Output Disable Time
- •Output Enable Time
- •Capacitive Loading
- •Environmental Conditions
- •Thermal Characteristics
- •576-Ball BGA_ED Pin Configurations
- •Outline Dimensions
- •Ordering Guide

ADSP-TS201S
ENVIRONMENTAL CONDITIONS
The ADSP-TS201S processor is rated for performance under
TCASE environmental conditions specified in the Recommended
Operating Conditions on Page 21.
Thermal Characteristics
The ADSP-TS201S processor is packaged in a 25 mm × 25 mm thermally enhanced ball grid array (BGA_ED). The ADSPTS201S processor is specified for a case temperature (TCASE). To ensure that the TCASE data sheet specification is not exceeded, a heat sink and/or an air flow source may be required.
Table 30 shows the thermal characteristics of the
25 mm × 25 mm BGA_ED package. All parameters are based on a JESD51-9 four-layer 2s2p board. All data are based on 3 W power dissipation.
Table 30. Thermal Characteristics for 25 mm × 25 mm Package
Parameter |
Condition |
Typical |
Unit |
|
Airflow = 0 m/s |
12.92 |
°C/W |
|
Airflow = 1 m/s |
10.2 |
°C/W |
θJA1 |
Airflow = 2 m/s |
9.0 |
°C/W |
|
Airflow = 3 m/s |
8.0 |
°C/W |
θJB3 |
– |
7.7 |
°C/W |
θJC4 |
– |
0.7 |
°C/W |
1 θJA measured per JEDEC standard JESD51-6.
2θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally mounted boards, use 17.0°C/W for 0 m/s.
3 θJB measured per JEDEC standard JESD51-9.
4 θJC measured by cold plate test method (no approved JEDEC standard).
Rev. 0 | Page 39 of 44 | November 2004