ADSP-TS201S
ENVIRONMENTAL CONDITIONS
The ADSP-TS201S processor is rated for performance under
TCASE environmental conditions specified in the Recommended
Operating Conditions on Page 21.
Thermal Characteristics
The ADSP-TS201S processor is packaged in a 25 mm × 25 mm thermally enhanced ball grid array (BGA_ED). The ADSPTS201S processor is specified for a case temperature (TCASE). To ensure that the TCASE data sheet specification is not exceeded, a heat sink and/or an air flow source may be required.
Table 30 shows the thermal characteristics of the
25 mm × 25 mm BGA_ED package. All parameters are based on a JESD51-9 four-layer 2s2p board. All data are based on 3 W power dissipation.
Table 30. Thermal Characteristics for 25 mm × 25 mm Package
Parameter |
Condition |
Typical |
Unit |
|
Airflow = 0 m/s |
12.92 |
°C/W |
|
Airflow = 1 m/s |
10.2 |
°C/W |
θJA1 |
Airflow = 2 m/s |
9.0 |
°C/W |
|
Airflow = 3 m/s |
8.0 |
°C/W |
θJB3 |
– |
7.7 |
°C/W |
θJC4 |
– |
0.7 |
°C/W |
1 θJA measured per JEDEC standard JESD51-6.
2θJA = 12.9°C/W for 0 m/s is for vertically mounted boards. For horizontally mounted boards, use 17.0°C/W for 0 m/s.
3 θJB measured per JEDEC standard JESD51-9.
4 θJC measured by cold plate test method (no approved JEDEC standard).
Rev. 0 | Page 39 of 44 | November 2004