
- •Revision History
- •1.1 Features
- •2 Introduction
- •2.1 Description
- •2.2 Pin Assignments
- •2.2.1 Ball Grid Array (GZZ and ZZZ)
- •2.2.3 Signal Descriptions
- •3 Functional Overview
- •3.1 Memory
- •3.1.3 Instruction Cache
- •3.1.4 Memory Map
- •3.1.5 Boot Configuration
- •3.2 Peripherals
- •3.3 Configurable External Ports and Signals
- •3.3.1 Parallel Port Mux
- •3.3.2 Host Port Mux
- •3.3.3 Serial Port 2 Mux
- •3.3.4 External Bus Selection Register (XBSR)
- •3.4 Configuration Examples
- •3.5 Timers
- •3.5.1 Timer Interrupts
- •3.5.2 Timer Pins
- •3.5.3 Timer Signal Selection Register (TSSR)
- •3.6 Universal Asynchronous Receiver/Transmitter (UART)
- •3.9 Direct Memory Access (DMA) Controller
- •3.9.1 DMA Channel 0 Control Register (DMA_CCR0)
- •3.10 System Clock Generator
- •3.10.1 Input Clock Source
- •3.10.2 Clock Groups
- •3.10.3 EMIF Input Clock Selection
- •3.10.4 Changing the Clock Group Frequencies
- •3.10.5 PLL Control Registers
- •3.10.6 Reset Sequence
- •3.11 Idle Control
- •3.11.1 Clock Domains
- •3.11.2 IDLE Procedures
- •3.11.3 Module Behavior at Entering IDLE State
- •3.11.4 Wake-Up Procedure
- •3.11.5 Auto-Wakeup/Idle Function for McBSP and DMA
- •3.11.6 Clock State of Multiplexed Modules
- •3.11.7 IDLE Control and Status Registers
- •3.12 General-Purpose I/O (GPIO)
- •3.13 External Bus Control Register
- •3.13.1 External Bus Control Register (XBCR)
- •3.14 Internal Ports and System Registers
- •3.14.1 XPORT Interface
- •3.14.2 DPORT Interface
- •3.14.3 IPORT Interface
- •3.14.4 System Configuration Register (CONFIG)
- •3.15 CPU Memory-Mapped Registers
- •3.16 Peripheral Registers
- •3.17 Interrupts
- •3.17.1 IFR and IER Registers
- •3.17.2 Interrupt Timing
- •3.17.3 Interrupt Acknowledge
- •3.18 Notice Concerning TCK
- •4 Support
- •4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability
- •4.1.1 Initialization Requirements for Boundary Scan Test
- •4.1.2 Boundary Scan Description Language (BSDL) Model
- •4.2 Documentation Support
- •5 Specifications
- •5.1 Electrical Specifications
- •5.3 Recommended Operating Conditions
- •5.5 Timing Parameter Symbology
- •5.6 Clock Options
- •5.6.1 Internal System Oscillator With External Crystal
- •5.6.2 Layout Considerations
- •5.6.3 Clock Generation in Bypass Mode (APLL Disabled)
- •5.6.4 Clock Generation in Lock Mode (APLL Synthesis Enabled)
- •5.6.5 EMIF Clock Options
- •5.7 Memory Timings
- •5.7.1 Asynchronous Memory Timings
- •5.7.2 Programmable Synchronous Interface Timings
- •5.7.3 Synchronous DRAM Timings
- •5.8 HOLD/HOLDA Timings
- •5.9 Reset Timings
- •5.10 External Interrupt and Interrupt Acknowledge (IACK) Timings
- •5.11 XF Timings
- •5.12 General-Purpose Input/Output (GPIOx) Timings
- •5.13 Parallel General-Purpose Input/Output (PGPIOx) Timings
- •5.14 TIM0/TIM1/WDTOUT Timings
- •5.14.1 TIM0/TIM1/WDTOUT Timer Pin Timings
- •5.14.3 TIM0/TIM1/WDTOUT Interrupt Timings
- •5.15 Multichannel Buffered Serial Port (McBSP) Timings
- •5.15.1 McBSP Transmit and Receive Timings
- •5.15.3 McBSP as SPI Master or Slave Timings
- •5.16 Host-Port Interface Timings
- •5.16.1 HPI Read and Write Timings
- •5.16.3 HPI.HAS Interrupt Timings
- •5.17 Inter-Integrated Circuit (I2C) Timings
- •5.18 Universal Asynchronous Receiver/Transmitter (UART) Timings
- •6 Mechanical Data
- •6.1 Package Thermal Resistance Characteristics
- •6.2 Packaging Information

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
5.7.3Synchronous DRAM Timings
Table 5-13 and Table 5-14 assume testing over recommended operating conditions (see Figure 5-13 through Figure 5-20).
Table 5-13. Synchronous DRAM Cycle Timing Requirements
|
|
VC5502-200 |
|
NO. |
|
VC5502-300 |
UNIT |
|
|
MIN MAX |
|
SD6 tsu(EDV-EKO1H) |
Setup time, read EMIF.Dx valid before ECLKOUT1 high |
2 |
ns |
SD7 th(EKO1H-EDV) |
Hold time, read EMIF.Dx valid after ECLKOUT1 high |
2 |
ns |
Table 5-14. Synchronous DRAM Cycle Switching Characteristics
NO.
SD1 td(EKO1H-CEV)
SD2 td(EKO1H-BEV)
SD3 td(EKO1H-BEIV)
SD4 td(EKO1H-EAV)
SD5 td(EKO1H-EAIV)
SD8 td(EKO1H-CASV)
SD9 td(EKO1H-EDV)
SD10 td(EKO1H-EDIV)
SD11 td(EKO1H-WEV)
SD12 td(EKO1H-RASV)
SD13 td(EKO1H-CKEV)
|
VC5502-200 |
|
|
PARAMETER |
VC5502-300 |
UNIT |
|
|
MIN |
MAX |
|
Delay time, ECLKOUT1 high to EMIF.CEx valid/invalid |
0.8 |
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.BEx valid |
|
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.BEx invalid |
0.8 |
|
ns |
Delay time, ECLKOUT1 high to EMIF.Ax valid |
|
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.Ax invalid |
0.8 |
|
ns |
Delay time, ECLKOUT1 high to EMIF.SDCAS valid |
0.8 |
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.Dx valid |
|
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.Dx invalid |
0.8 |
|
ns |
Delay time, ECLKOUT1 high to EMIF.SDWE valid |
0.8 |
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.SDRAS valid |
0.8 |
7 |
ns |
Delay time, ECLKOUT1 high to EMIF.SDCKE valid |
0.8 |
7 |
ns |
Submit Documentation Feedback |
Specifications |
143 |

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006 |
|
|
|
|
|
|
|
|
READ |
|
|
|
|
|
|
ECLKOUT1 |
|
|
|
|
|
|
|
|
SD1 |
SD1 |
|
|
|
|
|
|
|
|
|
|
|
|
|
EMIF.CEx |
|
|
|
|
|
|
|
|
|
SD2 |
|
|
|
SD3 |
|
EMIF.BE[3:0] |
|
BE1 |
BE2 |
BE3 |
BE4 |
|
|
|
SD4 |
SD5 |
|
|
|
|
|
|
|
|
|
|
|
|
|
EMIF.A[21:13] |
Bank |
|
|
|
|
|
|
|
SD4 |
SD5 |
|
|
|
|
|
|
|
|
|
|
|
|
|
EMIF.A[11:2] |
Column |
|
|
|
|
|
|
|
SD4 |
SD5 |
|
|
|
|
|
|
|
|
|
|
|
|
|
EMIF.A12 |
|
|
|
|
|
|
|
|
|
|
SD6 |
|
SD7 |
|
|
|
|
|
|
|
|
|
|
EMIF.D[31:0] |
|
|
|
D1 |
D2 |
D3 |
D4 |
EMIF.AOE/SOE/SDRAS |
|
|
|
|
|
|
|
(see Note A) |
SD8 |
|
|
|
|
|
|
|
|
|
|
|
|
|
SD8
EMIF.ARE/SADS/SDCAS/SRE (see Note A)
EMIF.AWE/SWE/SDWE
(see Note A)
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-13. SDRAM Read Command (CAS Latency 3)
|
WRITE |
|
|
|
ECLKOUT1 |
|
|
|
|
|
SD1 |
SD1 |
|
|
|
|
|
|
|
EMIF.CEx |
|
|
|
|
|
SD2 |
SD2 |
|
SD3 |
EMIF.BE[3:0] |
BE1 |
BE2 |
BE3 |
BE4 |
|
SD4 |
SD5 |
|
|
|
|
|
|
|
EMIF.A[21:13] |
Bank |
|
|
|
|
SD4 |
SD5 |
|
|
|
|
|
|
|
EMIF.A[11:2] |
Column |
|
|
|
|
SD4 |
SD5 |
|
|
|
|
|
|
|
EMIF.A12 |
|
|
|
|
|
SD9 |
SD9 |
|
SD10 |
|
|
|
||
EMIF.D[31:0] |
D1 |
D2 |
D3 |
D4 |
EMIF.AOE/SOE/SDRAS |
|
|
|
|
(see Note A) |
SD8 |
SD8 |
|
|
EMIF.ARE/SADS/SDCAS/SRE |
|
|
|
|
|
|
|
|
|
(see Note A) |
|
|
|
|
SD11
SD11
EMIF.AWE/SWE/SDWE
(see Note A)
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-14. SDRAM Write Command
144 |
Specifications |
Submit Documentation Feedback |

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
|
ACTV |
|
ECLKOUT1 |
|
|
|
SD1 |
SD1 |
|
|
|
EMIF.CEx |
|
|
EMIF.BE[3:0] |
|
|
|
SD4 |
SD5 |
|
|
|
EMIF.A[21:13] |
Bank Activate |
|
|
SD4 |
SD5 |
|
|
|
EMIF.A[11:2] |
Row Address |
|
|
SD4 |
SD5 |
|
|
|
EMIF.A12 |
Row Address |
|
EMIF.D[31:0] |
|
|
EMIF.AOE/SOE/SDRAS |
SD12 |
SD12 |
(see Note A) |
|
|
|
|
|
EMIF.ARE/SADS/SDCAS/SRE |
|
|
(see Note A) |
|
|
EMIF.AWE/SWE/SDWE
(see Note A)
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-15. SDRAM ACTV Command
DCAB
ECLKOUT1
SD1
SD1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13, 11:2]
SD4 |
SD5 |
|
EMIF.A12
EMIF.D[31:0]
SD12
SD12
EMIF.AOE/SOE/SDRAS (see Note A)
EMIF.ARE/SADS/SDCAS/SRE |
|
(see Note A) |
SD11 |
|
SD11
EMIF.AWE/SWE/SDWE (see Note A)
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-16. SDRAM DCAB Command
Submit Documentation Feedback |
Specifications |
145 |

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
|
DEAC |
|
ECLKOUT1 |
|
|
|
SD1 |
SD1 |
|
|
|
EMIF.CEx |
|
|
EMIF.BE[3:0] |
|
|
|
SD4 |
SD5 |
|
|
|
EMIF.A[21:13] |
Bank |
|
EMIF.A[11:2] |
|
|
|
SD4 |
SD5 |
|
|
|
EMIF.A12 |
|
|
EMIF.D[31:0] |
|
|
EMIF.AOE/SOE/SDRAS |
SD12 |
SD12 |
|
||
|
|
|
(see Note A) |
|
|
EMIF.ARE/SADS/SDCAS/SRE |
|
|
(see Note A) |
SD11 |
|
|
SD11 |
|
EMIF.AWE/SWE/SDWE |
|
|
|
|
|
(see Note A) |
|
|
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-17. SDRAM DEAC Command
|
|
REFR |
|
ECLKOUT1 |
|
|
|
|
SD1 |
SD1 |
|
|
|
||
EMIF.CEx |
|
|
|
EMIF.BE[3:0] |
|
|
|
EMIF.A[21:13, 11:2] |
|
|
|
EMIF.A12 |
|
|
|
EMIF.D[31:0] |
|
|
|
|
SD12 |
SD12 |
|
EMIF.AOE/SOE/SDRAS |
|
||
|
|
||
(see Note A) |
SD8 |
|
|
EMIF.ARE/SADS/SDCAS/SRE |
SD8 |
||
|
|||
|
|
||
(see Note A) |
|
|
EMIF.AWE/SWE/SDWE
(see Note A)
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-18. SDRAM REFR Command
146 |
Specifications |
Submit Documentation Feedback |

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
|
MRS |
|
|
ECLKOUT1 |
|
|
|
|
SD1 |
SD1 |
|
|
|
||
EMIF.CEx |
|
|
|
EMIF.BE[3:0] |
|
|
|
|
SD4 |
SD5 |
|
|
|
||
EMIF.A[21:2] |
MRS value |
|
|
EMIF.D[31:0] |
|
|
|
|
SD12 |
SD12 |
|
EMIF.AOE/SOE/SDRAS |
|
||
|
|
||
(see Note A) |
SD8 |
|
|
EMIF.ARE/SADS/SDCAS/SRE |
SD8 |
||
|
|||
|
|
||
(see Note A) |
|
|
|
|
SD11 |
SD11 |
|
EMIF.AWE/SWE/SDWE |
|
||
|
|
||
(see Note A) |
|
|
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-19. SDRAM MRS Command
≥ TRAS cycles
|
|
Self Refresh |
|
|
|
|
End Self-Refresh |
||||
|
|
|
|
|
|
||||||
|
|
|
|
|
|
|
|
|
|
|
|
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13, 11:2]
EMIF.A12
EMIF.D[31:0]
EMIF.AOE/SOE/SDRAS
(see Note A)
EMIF.ARE/SADS/SDCAS/SRE
(see Note A)
EMIF.AWE/SWE/SDWE |
|
(see Note A) |
SD13 |
SD13
EMIF.SDCKE
A.EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5-20. SDRAM Self-Refresh Timings
Submit Documentation Feedback |
Specifications |
147 |