
- •Revision History
- •1.1 Features
- •2 Introduction
- •2.1 Description
- •2.2 Pin Assignments
- •2.2.1 Ball Grid Array (GZZ and ZZZ)
- •2.2.3 Signal Descriptions
- •3 Functional Overview
- •3.1 Memory
- •3.1.3 Instruction Cache
- •3.1.4 Memory Map
- •3.1.5 Boot Configuration
- •3.2 Peripherals
- •3.3 Configurable External Ports and Signals
- •3.3.1 Parallel Port Mux
- •3.3.2 Host Port Mux
- •3.3.3 Serial Port 2 Mux
- •3.3.4 External Bus Selection Register (XBSR)
- •3.4 Configuration Examples
- •3.5 Timers
- •3.5.1 Timer Interrupts
- •3.5.2 Timer Pins
- •3.5.3 Timer Signal Selection Register (TSSR)
- •3.6 Universal Asynchronous Receiver/Transmitter (UART)
- •3.9 Direct Memory Access (DMA) Controller
- •3.9.1 DMA Channel 0 Control Register (DMA_CCR0)
- •3.10 System Clock Generator
- •3.10.1 Input Clock Source
- •3.10.2 Clock Groups
- •3.10.3 EMIF Input Clock Selection
- •3.10.4 Changing the Clock Group Frequencies
- •3.10.5 PLL Control Registers
- •3.10.6 Reset Sequence
- •3.11 Idle Control
- •3.11.1 Clock Domains
- •3.11.2 IDLE Procedures
- •3.11.3 Module Behavior at Entering IDLE State
- •3.11.4 Wake-Up Procedure
- •3.11.5 Auto-Wakeup/Idle Function for McBSP and DMA
- •3.11.6 Clock State of Multiplexed Modules
- •3.11.7 IDLE Control and Status Registers
- •3.12 General-Purpose I/O (GPIO)
- •3.13 External Bus Control Register
- •3.13.1 External Bus Control Register (XBCR)
- •3.14 Internal Ports and System Registers
- •3.14.1 XPORT Interface
- •3.14.2 DPORT Interface
- •3.14.3 IPORT Interface
- •3.14.4 System Configuration Register (CONFIG)
- •3.15 CPU Memory-Mapped Registers
- •3.16 Peripheral Registers
- •3.17 Interrupts
- •3.17.1 IFR and IER Registers
- •3.17.2 Interrupt Timing
- •3.17.3 Interrupt Acknowledge
- •3.18 Notice Concerning TCK
- •4 Support
- •4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability
- •4.1.1 Initialization Requirements for Boundary Scan Test
- •4.1.2 Boundary Scan Description Language (BSDL) Model
- •4.2 Documentation Support
- •5 Specifications
- •5.1 Electrical Specifications
- •5.3 Recommended Operating Conditions
- •5.5 Timing Parameter Symbology
- •5.6 Clock Options
- •5.6.1 Internal System Oscillator With External Crystal
- •5.6.2 Layout Considerations
- •5.6.3 Clock Generation in Bypass Mode (APLL Disabled)
- •5.6.4 Clock Generation in Lock Mode (APLL Synthesis Enabled)
- •5.6.5 EMIF Clock Options
- •5.7 Memory Timings
- •5.7.1 Asynchronous Memory Timings
- •5.7.2 Programmable Synchronous Interface Timings
- •5.7.3 Synchronous DRAM Timings
- •5.8 HOLD/HOLDA Timings
- •5.9 Reset Timings
- •5.10 External Interrupt and Interrupt Acknowledge (IACK) Timings
- •5.11 XF Timings
- •5.12 General-Purpose Input/Output (GPIOx) Timings
- •5.13 Parallel General-Purpose Input/Output (PGPIOx) Timings
- •5.14 TIM0/TIM1/WDTOUT Timings
- •5.14.1 TIM0/TIM1/WDTOUT Timer Pin Timings
- •5.14.3 TIM0/TIM1/WDTOUT Interrupt Timings
- •5.15 Multichannel Buffered Serial Port (McBSP) Timings
- •5.15.1 McBSP Transmit and Receive Timings
- •5.15.3 McBSP as SPI Master or Slave Timings
- •5.16 Host-Port Interface Timings
- •5.16.1 HPI Read and Write Timings
- •5.16.3 HPI.HAS Interrupt Timings
- •5.17 Inter-Integrated Circuit (I2C) Timings
- •5.18 Universal Asynchronous Receiver/Transmitter (UART) Timings
- •6 Mechanical Data
- •6.1 Package Thermal Resistance Characteristics
- •6.2 Packaging Information

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
3.18 Notice Concerning TCK
Under certain conditions, the emulation hardware may corrupt the emulation control state machine or may cause it to lose synchronization with the emulator software. When emulation commands fail as a result of the problem, Code Composer Studio™ Integrated Development Environment (IDE) may be unable to start or it may report errors when interacting with the TMS320C55x™ DSP (for example, when halting the CPU, reaching a breakpoint, etc.).
This phenomenon is observed when an erroneous clock edge is generated from the TCK signal inside the C55x™ DSP. This can be caused by several factors, acting independently or cumulatively:
∙TCK transition times (as measured between 2.4 V and 0.8 V) in excess of 3 ns.
∙Operating the C55x DSP in a socket, which can aggravate noise or glitches on the TCK input.
∙Poor signal integrity on the TCK line from reflections or other layout issues.
A TCK edge that can cause this problem might look similar to the one shown in Figure 3-53. A TCK edge that does not cause the problem looks similar to the one shown in Figure 3-54. The key difference between the two figures is that Figure 3-54 has a clean and sharp transition whereas Figure 3-53 has a "knee" in the transition zone. Problematic TCK signals may not have a knee that is as pronounced as the one in Figure 3-53. Due to the TCK signal amplification inside the chip, any perturbation of the signal can create erroneous clock edges.
As a result of the faster edge transition, there is increased ringing in Figure 3-54. As long as the ringing does not cross logic input thresholds (0.8 V for falling edges, and 2.4 V for rising edges), this ringing is acceptable.
When examining a TCK signal for this issue, either in board simulation or on an actual board, it is very important to probe the TCK line as close to the DSP input pin as possible. In simulation, it should not be difficult to probe right at the DSP input. For most physical boards, this means using the via for the TCK pad on the back side of the board. Similarly, ground for the probe should come from one of the nearby ground pad vias to minimize EMI noise picked up by the probe.
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2.5 V |
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0.6 V |
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nanoseconds (ns)
Figure 3-53. Bad TCK Transition
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Functional Overview |
123 |

TMS320VC5502
Fixed-Point Digital Signal Processor
www.ti.com
SPRS166J –APRIL 2001 –REVISED AUGUST 2006
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2.5 V |
Volts (V) |
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0.6 V |
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nanoseconds (ns)
Figure 3-54. Good TCK Transition
As the problem may be caused by one or more of the above factors, one or more of the steps outlined below may be necessary to fix it:
∙Avoid using a socket
∙Ensure the board design achieves rise times and fall times of less than 3 ns with clean monotonic edges for the TCK signal.
∙For designs where TCK is supplied by the emulation pod, implement noise filtering circuitry on the target board. A sample circuit is shown in Figure 3-55.
3.3V
TMS |
XDS TMS |
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2 |
XDS TRST |
XDS TDI |
3 |
4 |
TRST |
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TDI |
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TDO |
XDS TDO |
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XDS TCK RTN |
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XDS TCK |
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XDS EMU0 |
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XDS EMU1 |
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EMU1/OFF |
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EMU0 |
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3.3 V |
3.3 V |
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0.1 |
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0.1 |
R32 |
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mF |
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mF |
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33 W |
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TCK |
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SN74LVC1G32 |
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SN74LVC1G32 |
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Figure 3-55. Sample Noise Filtering Circuitry
124 |
Functional Overview |
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