AD9233
OUTLINE DIMENSIONS
PIN 1
INDICATOR
AREA
0.80
0.75
0.70
SEATING
PLANE
PKG-005092
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7.10 |
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0.30 |
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7.00 SQ |
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6.90 |
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0.23 |
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0.18 |
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37 |
48 |
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36 |
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1 |
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0.50 |
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BSC |
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EXPOSED |
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PAD |
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DETAIL A (JEDEC 95)
PIN 1 INDICATOR AR EA OP TIONS (SEE DETAIL A)
4.20
4.10 SQ
4.00
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TOP VIEW |
0.45 |
24 |
BOTTOM VIEW |
13 |
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0.20 MIN |
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0.40 |
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0.35
5.50 REF 
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FOR PROPER CONNECTION OF |
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END VIEW |
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0.05 MAX |
THE EXPOSED PAD, REFER TO |
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THE PIN CONFIGURATION AND |
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0.02 NOM |
FUNCTION DESCRIPTIONS |
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COPLANARITY |
SECTION OF THIS DATA SHEET. |
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0.08 |
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0.200 REF |
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-B |
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COMPLIANT TO JEDEC STANDARDS MO-220-WKKD-4 |
10-10-2018 |
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Figure 71. 48-Lead Frame Chip Scale Package [LFCSP] 7 mm × 7 mm Body and 0.75 mm Package Height (CP-48-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model |
Temperature Range |
Package Description |
Package Option1 |
AD9233BCPZ-1252 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233BCPZRL7–1252 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233BCPZ-1052 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233BCPZRL7–1052 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233BCPZ-802 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233BCPZRL7–802 |
–40°C to +85°C |
48-Lead Lead Frame Chip Scale Package [LFSCP] |
CP-48-5 |
AD9233-125EB |
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Evaluation Board |
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AD9233-105EB |
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Evaluation Board |
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AD9233-80EB |
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Evaluation Board |
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1 It is required that the exposed paddle be soldered to the AGND plane to achieve the best electrical and thermal performance . 2 Z = Pb-free part.
Rev. B | Page 42 of 44
AD9233
NOTES
Rev. B | Page 43 of 44
AD9233
NOTES
©2006–2020 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D05492-9/20(B)
Rev. B | Page 44 of 44