- •Английский язык
- •Предисловие
- •Part 1. Vocabulary practice
- •2. Read and translate the following text. Text 1 Electronics
- •3. Check your knowledge of the following terms.
- •4. Fill in the blanks with the words given below.
- •Part 2. Speaking practice
- •5. Answer the following questions to the text «Electronics».
- •6. Agree or disagree with the following statements. Use such word combinations as:
- •7. Make up a dialogue on the following situation:
- •Part 3. Translation practice
- •8. Выполните следующие предтекстовые задания:
- •Text 2 Fabrication Technology
- •Abstract
- •Unit 2. Vacuum Tubes part 1. Vocabulary practice
- •2. Read and translate the following text. Text 1
- •Vacuum Tubes
- •3. Give English equivalents to the following Russian terms.
- •4. Fill in the blanks with the words given in the text.
- •5. Translate into English.
- •Part 2. Speaking practice
- •6. Answer the following questions to the text “Vacuum Tubes”.
- •Part 3. Translation practice
- •Text 2 cmos Technology
- •Unit 3. Emission part 1. Vocabulary practice
- •1. Memorize the following words and word combinations.
- •2. Read and translate text 1. Text 1 Emission
- •3. Find English equivalents for the following terms.
- •4. Choose Russian equivalents for the following words from the list given below.
- •Part 2. Speaking practice
- •5. Name the main points of the text 1 basing on the following questions.
- •6. Suggest the answers to the following descriptions using the words given below.
- •7. Make up a dialogue on the following situation:
- •Part 3. Translation practice
- •8. Выполните следующие предтекстовые задания:
- •Text 2 cmos Technology
- •Unit 4. Tube Noise part 1. Vocabulary practice
- •2. Read and translate the text 1. Text 1 Tube Noise
- •3. Choose the proper word from the brackets.
- •4. Make up sentences out of the following words.
- •Part 2. Speaking practice
- •5. Point out which of these sentences does not contain the information from the text.
- •6. Give the main points of the text answering the following questions.
- •7. Write an annotation of the text. Use the following phrases.
- •8. Make up a dialogue on the following situation:
- •Part 3. Translation practice
- •9. Выполните следующие предтекстовые задания:
- •Text 2 Basic Microfabrication Steps
- •Unit 5. Compounds and Elements part 1. Vocabulary practice
- •2. Read and translate the text. Text 1 Compounds and Elements
- •3. Read the following international words and guess their meanings.
- •4. Give English equivalents for the following words and word combinations.
- •6. Translate into English.
- •Part 2. Speaking practice
- •7. Give definitions of the following words: “a compound”, “an element”, “a molecule”, “an atom”. Memorize them.
- •8. Answer the following questions to the text.
- •9. Read the following interesting facts about oxygen and discuss them in your group. Did You Know?
- •10. Reveal the structure of any element’s or compound’s molecule depicting it on the blackboard. Part 3. Translation practice
- •11. Выполните следующие предтекстовые задания:
- •Text 2 Thin-film Deposition
- •Научный редактор г.В. Царева Редактор издательства л.И. Афонина
Text 2 Fabrication Technology
O. Brand, School of Electrical and Computer Engineering,
Georgia Institute of Technology, Atlanta, GA, USA
Abstract
This chapter provides an overview on fabrication technologies for CMOS-based microelectromechanical systems (MEMS). The first part briefly introduces the basic microfabrication steps, highlights a CMOS process sequence and how CMOS materials can be used for microsystems design. While a number of microsystems can be fabricated within the regular CMOS process sequence, the focus of the chapter is on combining CMOS technology with micromachining process modules. CMOS-compatible bulk and surface micromachining techniques are introduced in the second part of the chapter together with an overview of the design challenges faced when combining mechanical microstructures and electronics on the same substrate. The micromachining modules can either precede (pre-CMOS), follow (post-CMOS) or be performed in between (intra-CMOS) the regular CMOS process steps. The last part of the chapter provides an extensive overview on the different CMOS-based MEMS approaches found in the literature.
Keywords: micromachining; CMOS-based MEMS; MEMS fabrication; microsystem fabrication.
Unit 2. Vacuum Tubes part 1. Vocabulary practice
1. Memorize the following words and word combinations.
to conduct |
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conduction = conductivity |
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conductor |
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semiconductor |
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to emit |
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emitter |
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emission |
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cathode |
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anode |
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triode |
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plate |
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plate current |
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grid |
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flow |
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voltage |
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alternating voltage |
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to repel |
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to permit |
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rectifier |
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detector |
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collector electrode |
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emitting electrode |
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control electrode |
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current-collecting electrode |
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to result in |
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to influence |
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to decrease |
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