- •FEATURES
- •APPLICATIONS
- •FUNCTIONAL BLOCK DIAGRAM
- •GENERAL DESCRIPTION
- •PRODUCT HIGHLIGHTS
- •TABLE OF CONTENTS
- •SPECIFICATIONS
- •DC SPECIFICATIONS
- •DIGITAL SPECIFICATIONS
- •SWITCHING SPECIFICATIONS
- •AC SPECIFICATIONS
- •ABSOLUTE MAXIMUM RATINGS
- •EXPLANATION OF TEST LEVELS
- •ESD CAUTION
- •PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
- •DEFINITIONS OF SPECIFICATIONS
- •EQUIVALENT CIRCUITS
- •TYPICAL PERFORMANCE CHARACTERISTICS
- •APPLYING THE AD9235
- •THEORY OF OPERATION
- •ANALOG INPUT
- •Differential Input Configurations
- •Single-Ended Input Configuration
- •CLOCK INPUT CONSIDERATIONS
- •POWER DISSIPATION AND STANDBY MODE
- •DIGITAL OUTPUTS
- •Timing
- •VOLTAGE REFERENCE
- •Internal Reference Connection
- •External Reference Operation
- •OPERATIONAL MODE SELECTION
- •TSSOP EVALUATION BOARD
- •LFCSP EVALUATION BOARD
- •OUTLINE DIMENSIONS
- •ORDERING GUIDE
AD9235
OUTLINE DIMENSIONS
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9.80 |
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9.70 |
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9.60 |
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2 8 |
1 5 |
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4.50 |
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4.40 |
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4.30 |
6.40 BSC |
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1 |
1 4 |
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PIN 1 |
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0.65 |
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BSC |
1.20 MAX |
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0.15 |
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0.05 |
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0.30 |
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0.20 |
8° |
0.75 |
SEATING |
0° |
0.60 |
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COPLANARITY 0.19 |
0.09 |
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0.45 |
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0.10 |
PLANE |
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COMPLIANT TO JEDEC STANDARDS MO-153AE
Figure 63. 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28)
Dimensions shown in millimeters
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5.00 |
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0.60 MAX |
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BSC SQ |
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0.60 MAX |
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PIN 1 |
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25 |
32 |
INDICATOR |
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1 |
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PIN 1 |
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24 |
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0.50 |
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INDICATOR |
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TOP |
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4.75 |
BSC |
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EXPOSED |
3.25 |
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VIEW |
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BSC SQ |
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PAD |
3.10 SQ |
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(BOTTOM VIEW) |
2.95 |
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0.50 |
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0.40 |
17 |
9 |
8 |
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0.30 |
16 |
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0.25 MIN |
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12° MAX |
0.80 MAX |
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3.50 REF |
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0.65 TYP |
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1.00 |
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0.05 MAX |
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0.02 NOM |
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0.85 |
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0.30 |
0.20 REF |
COPLANARITY |
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0.80 |
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0.23 |
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SEATING |
0.08 |
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PLANE |
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0.18 |
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COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
Figure 64. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body (CP-32-2)
Dimensions shown in millimeters
Rev. C | Page 36 of 40
AD9235
ORDERING GUIDE
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Model |
Temperature Range |
Package Description |
Package Option |
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AD9235BRU-20 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRURL7-20 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZ-201 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZRL7-201 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRU-40 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRURL7-40 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZ-401 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZRL7-401 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRU-65 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRURL7-65 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZ-651 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BRUZRL7-651 |
–40°C to +85°C |
28-Lead Thin Shrink Small Outline Package (TSSOP) |
RU-28 |
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AD9235BCP-202 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPRL7-202 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZ-201, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZRL7-201, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCP-402 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPRL7-402 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZ-401, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZRL7-401, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCP-652 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPRL7-652 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZ-651, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235BCPZRL7-651, 2 |
–40°C to +85°C |
32-Lead Lead Frame Chip Scale Package (LFCSP) |
CP-32-2 |
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AD9235-20PCB |
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TSSOP Evaluation Board |
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AD9235-40PCB |
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TSSOP Evaluation Board |
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AD9235-65PCB |
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TSSOP Evaluation Board |
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AD9235BCP-20EB |
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LFCSP Evaluation Board |
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AD9235BCP-40EB |
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LFCSP Evaluation Board |
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AD9235BCP-65EB |
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LFCSP Evaluation Board |
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1 Z = Pb-free part.
2It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of the package is achieved with exposed paddle soldered to the customer board.
Rev. C | Page 37 of 40
AD9235
NOTES
Rev. C | Page 38 of 40
AD9235
NOTES
Rev. C | Page 39 of 40
AD9235
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
C02461–0–10/04(C)
Rev. C | Page 40 of 40