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AD9235

OUTLINE DIMENSIONS

 

9.80

 

 

 

 

9.70

 

 

 

 

9.60

 

 

 

2 8

1 5

 

 

 

 

 

4.50

 

 

 

 

4.40

 

 

 

 

4.30

6.40 BSC

 

 

 

 

 

1

1 4

 

 

 

PIN 1

 

 

 

 

0.65

 

 

 

 

BSC

1.20 MAX

 

 

 

0.15

 

 

 

 

 

 

 

0.05

 

 

 

 

0.30

 

0.20

8°

0.75

SEATING

0.60

COPLANARITY 0.19

0.09

 

0.45

0.10

PLANE

 

 

COMPLIANT TO JEDEC STANDARDS MO-153AE

Figure 63. 28-Lead Thin Shrink Small Outline Package [TSSOP] (RU-28)

Dimensions shown in millimeters

 

 

5.00

 

 

 

 

0.60 MAX

 

 

 

BSC SQ

 

0.60 MAX

 

 

PIN 1

 

 

 

 

 

 

25

32

INDICATOR

 

 

 

 

 

 

1

PIN 1

 

 

 

 

 

24

 

 

 

 

 

0.50

 

 

 

INDICATOR

 

 

 

 

 

 

 

 

 

TOP

 

4.75

BSC

 

EXPOSED

3.25

 

 

VIEW

 

BSC SQ

 

 

PAD

3.10 SQ

 

 

 

 

 

 

 

(BOTTOM VIEW)

2.95

 

 

 

 

 

0.50

 

 

 

 

 

 

 

 

0.40

17

9

8

 

 

 

 

 

0.30

16

 

 

 

 

 

 

 

 

0.25 MIN

 

 

 

 

 

 

 

 

 

12° MAX

0.80 MAX

 

 

 

 

3.50 REF

 

0.65 TYP

 

 

 

 

 

 

 

 

 

 

 

 

1.00

 

 

 

0.05 MAX

 

 

 

 

 

 

 

0.02 NOM

 

 

 

 

0.85

 

 

0.30

0.20 REF

COPLANARITY

 

 

0.80

 

 

0.23

 

 

SEATING

0.08

 

 

 

 

PLANE

 

0.18

 

 

 

 

 

COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2

Figure 64. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm × 5 mm Body (CP-32-2)

Dimensions shown in millimeters

Rev. C | Page 36 of 40

AD9235

ORDERING GUIDE

 

Model

Temperature Range

Package Description

Package Option

 

AD9235BRU-20

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRURL7-20

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZ-201

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZRL7-201

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRU-40

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRURL7-40

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZ-401

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZRL7-401

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRU-65

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRURL7-65

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZ-651

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BRUZRL7-651

–40°C to +85°C

28-Lead Thin Shrink Small Outline Package (TSSOP)

RU-28

 

AD9235BCP-202

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPRL7-202

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZ-201, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZRL7-201, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCP-402

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPRL7-402

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZ-401, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZRL7-401, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCP-652

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPRL7-652

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZ-651, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235BCPZRL7-651, 2

–40°C to +85°C

32-Lead Lead Frame Chip Scale Package (LFCSP)

CP-32-2

 

AD9235-20PCB

 

 

TSSOP Evaluation Board

 

 

AD9235-40PCB

 

 

TSSOP Evaluation Board

 

 

AD9235-65PCB

 

 

TSSOP Evaluation Board

 

 

AD9235BCP-20EB

 

 

LFCSP Evaluation Board

 

 

AD9235BCP-40EB

 

 

LFCSP Evaluation Board

 

 

AD9235BCP-65EB

 

 

LFCSP Evaluation Board

 

 

 

 

 

 

 

 

 

 

 

 

 

1 Z = Pb-free part.

2It is recommended that the exposed paddle be soldered to the ground plane. There is an increased reliability of the solder joints and maximum thermal capability of the package is achieved with exposed paddle soldered to the customer board.

Rev. C | Page 37 of 40

AD9235

NOTES

Rev. C | Page 38 of 40

AD9235

NOTES

Rev. C | Page 39 of 40

AD9235

NOTES

© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.

C02461–0–10/04(C)

Rev. C | Page 40 of 40

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