
- •Table of Contents
- •Objectives
- •Embedded Microcomputer Applications
- •Microcomputer and Microcontroller Architectures
- •Digital Hardware Concepts
- •Voltage, Current, and Resistance
- •Diodes
- •Transistors
- •Mechanical Switches
- •Transistor Switch ON
- •Transistor Switch OFF
- •The FET as a Logic Switch
- •NMOS Logic
- •CMOS Logic
- •Mixed MOS
- •Real Transistors Don’t Eat Q!
- •Logic Symbols
- •Tri-State Logic
- •Timing Diagrams
- •Multiplexed Bus
- •Loading and Noise Margin Analysis
- •The Design and Development Process
- •Chapter One Problems
- •Organization: von Neumann vs. Harvard
- •Microprocessor/Microcontroller Basics
- •Microcontroller CPU, Memory, and I/O
- •Design Methodology
- •The 8051 Family Microcontroller
- •Processor Architecture
- •Introduction to the 8051 Architecture
- •8051 Memory Organization
- •8051 CPU Hardware
- •Oscillator and Timing Circuitry
- •The 8051 Microcontroller Instruction Set Summary
- •Direct and Register Addressing
- •Indirect Addressing
- •Immediate Addressing
- •Generic Address Modes and Instruction Formats
- •8051 Address Modes
- •The Software Development Cycle
- •Software Development Tools
- •Hardware Development Tools
- •Chapter Two Problems
- •Timing Diagram Notation Conventions
- •Rise and Fall Times
- •Propagation Delays
- •Setup and Hold Time
- •Tri-State Bus Interfacing
- •Pulse Width and Clock Frequency
- •Fan-Out and Loading Analysis—DC and AC
- •Calculating Wiring Capacitance
- •Fan-Out When CMOS Drives LSTTL
- •Transmission Line Effects
- •Ground Bounce
- •Logic Family IC Characteristics and Interfacing
- •Interfacing TTL Compatible Signals to 5 Volt CMOS
- •Design Example: Noise Margin Analysis Spreadsheet
- •Worst-Case Timing Analysis Example
- •Chapter Three Review Problems
- •Memory Taxonomy
- •Secondary Memory
- •Sequential Access Memory
- •Direct Access Memory
- •Read/Write Memories
- •Read-Only Memory
- •Other Memory Types
- •JEDEC Memory Pin-Outs
- •Device Programmers
- •Memory Organization Considerations
- •Parametric Considerations
- •Asynchronous vs. Synchronous Memory
- •Error Detection and Correction
- •Error Sources
- •Confidence Checks
- •Memory Management
- •Cache Memory
- •Virtual Memory
- •CPU Control Lines for Memory Interfacing
- •Chapter Four Problems
- •Read and Write Operations
- •Address, Data, and Control Buses
- •Address Spaces and Decoding
- •Address Map
- •Chapter Five Problems
- •The Central Processing Unit (CPU)
- •Memory Selection and Interfacing
- •Preliminary Timing Analysis
- •External Data Memory Cycles
- •External Memory Data Memory Read
- •External Data Memory Write
- •Design Problem 1
- •Design Problem 2
- •Design Problem 3
- •Completing the Analysis
- •Chapter Six Problems
- •Introduction to Programmable Logic
- •Technologies: Fuse-Link, EPROM, EEPROM, and RAM Storage
- •PROM as PLD
- •Programmable Logic Arrays
- •PAL-Style PLDs
- •Design Examples
- •PLD Development Tools
- •Simple I/O Decoding and Interfacing Using PLDs
- •IC Design Using PCs
- •Chapter Seven Problems
- •Direct CPU I/O Interfacing
- •Port I/O for the 8051 Family
- •Output Current Limitations
- •Simple Input/Output Devices
- •Matrix Keyboard Input
- •Program-Controlled I/O Bus Interfacing
- •Real-Time Processing
- •Direct Memory Access (DMA)
- •Burst vs. Single Cycle DMA
- •Cycle Stealing
- •Elementary I/O Devices and Applications
- •Timing and Level Conversion Considerations
- •Level Conversion
- •Power Relays
- •Chapter Eight Problems
- •Interrupt Cycles
- •Software Interrupts
- •Hardware Interrupts
- •Interrupt Driven Program Elements
- •Critical Code Segments
- •Semaphores
- •Interrupt Processing Options
- •Level and Edge Triggered Interrupts
- •Vectored Interrupts
- •Non-Vectored Interrupts
- •Serial Interrupt Prioritization
- •Parallel Interrupt Prioritization
- •Construction Methods
- •Power and Ground Planes
- •Ground Problems
- •Electromagnetic Compatibility
- •Electrostatic Discharge Effects
- •Fault Tolerance
- •Hardware Development Tools
- •Instrumentation Issues
- •Software Development Tools
- •Other Specialized Design Considerations
- •Thermal Analysis and Design
- •Battery Powered System Design Considerations
- •Processor Performance Metrics
- •Benchmarks
- •Device Selection Process
- •Analog Signal Conversion
- •Special Proprietary Synchronous Serial Interfaces
- •Unconventional Use of DRAM for Low Cost Data Storage
- •Digital Signal Processing / Digital Audio Recording
- •Detailed Checklist
- •1. Define Power Supply Requirements
- •2. Verify Voltage Level Compatibility
- •3. Check DC Fan-Out: Output Current Drive vs. Loading
- •4. AC (Capacitive) Output Drive vs. Capacitive Load and De-rating
- •5. Verify Worst Case Timing Conditions
- •6. Determine if Transmission Line Termination is Required
- •7. Clock Distribution
- •8. Power and Ground Distribution
- •9. Asynchronous Inputs
- •10. Guarantee Power-On Reset State
- •11. Programmable Logic Devices
- •12. Deactivate Interrupt and Other Requests on Power-Up
- •13. Electromagnetic Compatibility Issues
- •14. Manufacturing and Test Issues
- •Books
- •Web and FTP Sites
- •Periodicals: Subscription
- •Periodicals: Advertiser Supported Trade Magazines
- •Index
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CHAPTER TEN |
197 |
Other Useful Stuff
This chapter surveys practical design issues that must be considered in an embedded design. Some of these topics are covered in more detail by the references in Appendix B.
Construction Methods
Embedded controllers can be constructed using any one of several techniques, but the most common method is a printed circuit board (PCB). The PCB is constructed of insulating material, such as epoxy impregnated glass cloth, laminated with a thin sheet of copper. Multiple layers of copper and insulating material can be laminated into a multi-layer PCB. By drilling and plating holes in the material, it is possible to interconnect the layers and provide mounting locations for through-hole components.
In designing the layout, or interconnecting pattern of the PCB, there are many conflicting requirements that must be addressed to make a reliable, costeffective and producible device. For low speed circuits, the parasitic effects can be ignored and are often assumed to be ideal connections. Unfortunately, real circuits are not ideal, and the wires and insulating material have an effect on the circuit, especially for signals with fast signal rise/fall times. The traces, or wires, on the PCB have stray resistance, capacitance, and inductance. At high speeds, these stray effects delay and distort the signals. Special care must be taken when designing a PC board to avoid problems with transmission line effects, noise, and unwanted electromagnetic emissions.
198EMBEDDED CONTROLLER
Hardware Design
Power and Ground Planes
When possible, it is a good idea to use two layers of a four or more layer PCB dedicated to the Vcc and ground signals. These are referred to as power and ground planes. One advantage is that there is a beneficial high frequency parasitic power supply decoupling capacitance, which reduces the power supply noise to the ICs. Power planes also reduce the undesirable emission of electromagnetic radiation that can cause interference, and reduce the circuit’s susceptibility to externally induced noise. The power planes tend to act as a shield to reduce the susceptibility to external noise and radiation of noise from the system.
Ground Problems
While the concept of an ideal circuit ground may seem relatively simple, a great many system problems can be directly traced to ground problems in actual applications. At the least, this can cause undesirable noise or erroneous operation; at the worst, it can result in safety problems, including possibly even death by electrocution. Lest you dismiss the importance of this too quickly, the author has narrowly missed electrocution while testing a device in which the grounding was improperly implemented!
These problems are most often caused by one of the following problems:
•Excessive inductance or resistance in the ground circuit, resulting in “ground loops.”
•Lack of, or insufficient isolation between, the different grounds in a system: earth, safety, digital and analog grounds.
•Non-ideal grounding paths, resulting in the currents flowing in one circuit inducing a voltage in another circuit.
The solutions to these problems vary, depending upon the type of problem, and the frequency range in which they occur. Usually they can be simplified to reducing the currents flowing in common impedances of circuits which need to remain isolated using a single point ground, and the prudent application of shields and insulation to prevent unwanted parasitic signal coupling.