
- •Table of Contents
- •Objectives
- •Embedded Microcomputer Applications
- •Microcomputer and Microcontroller Architectures
- •Digital Hardware Concepts
- •Voltage, Current, and Resistance
- •Diodes
- •Transistors
- •Mechanical Switches
- •Transistor Switch ON
- •Transistor Switch OFF
- •The FET as a Logic Switch
- •NMOS Logic
- •CMOS Logic
- •Mixed MOS
- •Real Transistors Don’t Eat Q!
- •Logic Symbols
- •Tri-State Logic
- •Timing Diagrams
- •Multiplexed Bus
- •Loading and Noise Margin Analysis
- •The Design and Development Process
- •Chapter One Problems
- •Organization: von Neumann vs. Harvard
- •Microprocessor/Microcontroller Basics
- •Microcontroller CPU, Memory, and I/O
- •Design Methodology
- •The 8051 Family Microcontroller
- •Processor Architecture
- •Introduction to the 8051 Architecture
- •8051 Memory Organization
- •8051 CPU Hardware
- •Oscillator and Timing Circuitry
- •The 8051 Microcontroller Instruction Set Summary
- •Direct and Register Addressing
- •Indirect Addressing
- •Immediate Addressing
- •Generic Address Modes and Instruction Formats
- •8051 Address Modes
- •The Software Development Cycle
- •Software Development Tools
- •Hardware Development Tools
- •Chapter Two Problems
- •Timing Diagram Notation Conventions
- •Rise and Fall Times
- •Propagation Delays
- •Setup and Hold Time
- •Tri-State Bus Interfacing
- •Pulse Width and Clock Frequency
- •Fan-Out and Loading Analysis—DC and AC
- •Calculating Wiring Capacitance
- •Fan-Out When CMOS Drives LSTTL
- •Transmission Line Effects
- •Ground Bounce
- •Logic Family IC Characteristics and Interfacing
- •Interfacing TTL Compatible Signals to 5 Volt CMOS
- •Design Example: Noise Margin Analysis Spreadsheet
- •Worst-Case Timing Analysis Example
- •Chapter Three Review Problems
- •Memory Taxonomy
- •Secondary Memory
- •Sequential Access Memory
- •Direct Access Memory
- •Read/Write Memories
- •Read-Only Memory
- •Other Memory Types
- •JEDEC Memory Pin-Outs
- •Device Programmers
- •Memory Organization Considerations
- •Parametric Considerations
- •Asynchronous vs. Synchronous Memory
- •Error Detection and Correction
- •Error Sources
- •Confidence Checks
- •Memory Management
- •Cache Memory
- •Virtual Memory
- •CPU Control Lines for Memory Interfacing
- •Chapter Four Problems
- •Read and Write Operations
- •Address, Data, and Control Buses
- •Address Spaces and Decoding
- •Address Map
- •Chapter Five Problems
- •The Central Processing Unit (CPU)
- •Memory Selection and Interfacing
- •Preliminary Timing Analysis
- •External Data Memory Cycles
- •External Memory Data Memory Read
- •External Data Memory Write
- •Design Problem 1
- •Design Problem 2
- •Design Problem 3
- •Completing the Analysis
- •Chapter Six Problems
- •Introduction to Programmable Logic
- •Technologies: Fuse-Link, EPROM, EEPROM, and RAM Storage
- •PROM as PLD
- •Programmable Logic Arrays
- •PAL-Style PLDs
- •Design Examples
- •PLD Development Tools
- •Simple I/O Decoding and Interfacing Using PLDs
- •IC Design Using PCs
- •Chapter Seven Problems
- •Direct CPU I/O Interfacing
- •Port I/O for the 8051 Family
- •Output Current Limitations
- •Simple Input/Output Devices
- •Matrix Keyboard Input
- •Program-Controlled I/O Bus Interfacing
- •Real-Time Processing
- •Direct Memory Access (DMA)
- •Burst vs. Single Cycle DMA
- •Cycle Stealing
- •Elementary I/O Devices and Applications
- •Timing and Level Conversion Considerations
- •Level Conversion
- •Power Relays
- •Chapter Eight Problems
- •Interrupt Cycles
- •Software Interrupts
- •Hardware Interrupts
- •Interrupt Driven Program Elements
- •Critical Code Segments
- •Semaphores
- •Interrupt Processing Options
- •Level and Edge Triggered Interrupts
- •Vectored Interrupts
- •Non-Vectored Interrupts
- •Serial Interrupt Prioritization
- •Parallel Interrupt Prioritization
- •Construction Methods
- •Power and Ground Planes
- •Ground Problems
- •Electromagnetic Compatibility
- •Electrostatic Discharge Effects
- •Fault Tolerance
- •Hardware Development Tools
- •Instrumentation Issues
- •Software Development Tools
- •Other Specialized Design Considerations
- •Thermal Analysis and Design
- •Battery Powered System Design Considerations
- •Processor Performance Metrics
- •Benchmarks
- •Device Selection Process
- •Analog Signal Conversion
- •Special Proprietary Synchronous Serial Interfaces
- •Unconventional Use of DRAM for Low Cost Data Storage
- •Digital Signal Processing / Digital Audio Recording
- •Detailed Checklist
- •1. Define Power Supply Requirements
- •2. Verify Voltage Level Compatibility
- •3. Check DC Fan-Out: Output Current Drive vs. Loading
- •4. AC (Capacitive) Output Drive vs. Capacitive Load and De-rating
- •5. Verify Worst Case Timing Conditions
- •6. Determine if Transmission Line Termination is Required
- •7. Clock Distribution
- •8. Power and Ground Distribution
- •9. Asynchronous Inputs
- •10. Guarantee Power-On Reset State
- •11. Programmable Logic Devices
- •12. Deactivate Interrupt and Other Requests on Power-Up
- •13. Electromagnetic Compatibility Issues
- •14. Manufacturing and Test Issues
- •Books
- •Web and FTP Sites
- •Periodicals: Subscription
- •Periodicals: Advertiser Supported Trade Magazines
- •Index
143CHAPTER SIX
A Detailed Design Example
With experience, this iterative design and analysis process becomes much easier, and potential problems are easier to anticipate. However, even with experience it is easy to become lax and leave out the review of the seemingly less important specs. This will often result in a direct application of Ken’s first law of worst-case analysis: “Any specification which is not considered will certainly be violated, causing catastrophic failure at the worst possible time.” That’s usually right before a salary review or in front of an important customer! It is important to review all the specs for the parts to be used in a design. When alternate sources for the devices are to be used, the specifications of these alternates should also be reviewed. Parts from two vendors with the exact same part number may have subtly different specs.
Chapter Six Problems
1)For this problem, use the fastest EPROM program memory from Table 6-2 (the –15 version), the 8031 CPU specs in Table 6-1, and the latch specs from Table 6-3. Ignoring the TCLCL limit on clock speed, how fast can the processor be clocked? Use the connections shown in Figure 6-3, with /PSEN connected to the EPROM /CE pin.
2)Use the same conditions as the problem above, except connect /PSEN to the EPROM /OE control.
3)For a system that has multiple program memories, an address decoder is required in order to generate separate select signals to enable the program memories. What paths and specs will be affected and how will the timing change?
4)For each of the CPU data memory write timing parameters listed in
Table 6-5, list the corresponding SRAM timing parameters from Table 6-6.
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CHAPTER SEVEN |
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Programmable
Logic Devices
Application specific integrated circuits (ASIC are ICs that have been designed or programmed to meet the needs of a specific design in which the chips will be used. These are differentiated from standard, or general purpose ICs that may be used in many different applications. General-purpose logic ICs are usually designed “from scratch” using only the most basic circuit elements such as transistors and gates. The cost of building a chip this way can be amortized over a large number of devices if it is used in many different applications.
When an application specific chip is designed from scratch, it is referred to as a full custom logic design. It is the lowest cost to manufacture because it takes the least amount of silicon to implement a given function. Unfortunately the design of a large full custom chip is very expensive (hundreds of thousands to millions of dollars) due to the labor-intensive design and prototyping process, and cannot be justified unless a very large quantity will be manufactured. Originally this was the only way to design chips, but now there are several alternatives for designing ASICs.
Standard cell IC design uses a library of common logic functions that have already been designed and tested. This reduces the amount of design effort in that logic IC blocks such as multiplexers are used in place of the equivalent random logic design implemented with gates. The cells can range in complexity from simple gates to complete CPUs. Standard cell based IC design has become the standard and can now be done even on a PC at a much lower cost than other methods. The cost of manufacturing a minimum production quantity of parts is less (thousands of dollars) than it would be for a full custom design process, but still high enough to be inappropriate for prototyping and low volume production (e.g., less than 5000 units).
146EMBEDDED CONTROLLER
Hardware Design
Gate arrays are fabricated with a fixed array of gates and the wiring is defined by the user when the chip is manufactured. The advantage of this approach is that the chips can be fabricated up to the point where the interconnecting wires are placed on the chip, ready for a custom interconnect. Since most of the processing is completed before the connections for any particular design are placed on the chip, these “almost finished” devices can be produced and stockpiled without any interconnects. The final interconnect can be added to define a given design, resulting in a customized version of a nearly standard part. Gate arrays are often used when the production volume is too low to justify a full custom design, but high enough so that a user programmable device is not cost effective.
User programmable logic devices (PLDs) are a family of devices that are all manufactured in the same way, and can be customized using a special programming process much like an EPROM. An EPROM can be used to implement arbitrary logic functions by using the address lines as inputs and data lines as outputs. Thus, a 1Mx8 EPROM could have eight independent logic outputs that can be any boolean function of any of the 20 input address bits. The fully completed truth table is programmed into the EPROM so that each unique input pattern will result in the appropriate data at the outputs. EPROMs are not often the best choice for the kind of logic required in most designs because of their speed and relative complexity, which translates to performance and price. Other types of devices have been designed specifically for use in those applications. There is a wide range of devices available, from fuse-linked two-level combinatorial logic and EPROM registered logic arrays, to arrays of logic blocks programmed with SRAM memory in each block. These devices span a range of complexity from one hundred to more than ten thousand usable gates. These families of devices are referred to as programmable logic arrays (PLA), programmable array logic (PAL, a registered trademark of AMD Inc.), and other trademarked names.
Field programmable gate arrays (FPGAs) are a cross between gate arrays and PLDs. They have an array of logic with user programmable interconnections. FPGAs are generally used where the desired logic function is too large to fit in a sum-of-products device, and the volume is too low to justify the use of a gate array or custom logic. FPGAs are available in sizes large enough to implement an entire CPU.