- •1. General description
- •2. Features and benefits
- •3. Applications
- •4. Quick reference data
- •5. Pinning information
- •6. Ordering information
- •7. Marking
- •8. Limiting values
- •9. Thermal characteristics
- •10. Characteristics
- •11. Test information
- •12. Package outline
- •13. Soldering
- •14. Revision history
- •15. Legal information
Nexperia |
BSH111BK |
|
55 V, N-channel Trench MOSFET |
11. Test information
P |
duty cycle δ = |
t1 |
t2 |
t2 |
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t1 |
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t |
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006aaa812 |
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Fig. 17. Duty cycle definition
BSH111BK |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
26 November 2014 |
10 / 16 |
Nexperia |
BSH111BK |
|
55 V, N-channel Trench MOSFET |
12. Package outline
Plastic surface-mounted package; 3 leads |
SOT23 |
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D |
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B |
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E |
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A |
X |
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HE |
v A |
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3 |
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Q |
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A |
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A1 |
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1 |
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2 |
c |
e1 |
bp |
w B |
Lp |
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e |
detail X |
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0 |
1 |
2 mm |
scale
Dimensions (mm are the original dimensions)
Unit |
A |
A1 |
bp |
c |
D |
E |
e |
e1 HE |
Lp |
Q |
v |
w |
max |
1.1 |
0.1 |
0.48 |
0.15 |
3.0 |
1.4 |
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2.5 |
0.45 |
0.55 |
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mm nom |
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1.9 |
0.95 |
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0.2 |
0.1 |
min |
0.9 |
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0.38 |
0.09 |
2.8 |
1.2 |
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2.1 |
0.15 |
0.45 |
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sot023_po
Outline |
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References |
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European |
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Issue date |
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version |
IEC |
JEDEC |
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JEITA |
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projection |
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SOT23 |
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TO-236AB |
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14-06-19 |
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14-09-22 |
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Fig. 18. Package outline TO-236AB (SOT23)
BSH111BK |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
26 November 2014 |
11 / 16 |
Nexperia |
BSH111BK |
|
55 V, N-channel Trench MOSFET |
13. Soldering
3.3
2.9
1.9
3 1.7
0.7 |
(3×) |
0.5
(3×)
0.6
(3×)
1
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solder lands |
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solder resist |
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2 |
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solder paste |
0.6 |
occupied area |
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(3×) |
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Dimensions in mm |
sot023_fr
Fig. 19. Reflow soldering footprint for TO-236AB (SOT23)
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2.2 |
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1.2 |
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(2×) |
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1.4 |
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(2×) |
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solder lands |
4.6 2.6 |
solder resist |
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occupied area |
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Dimensions in mm |
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1.4 |
preferred transport direction during soldering
2.8
4.5 |
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sot023_fw |
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Fig. 20. Wave soldering footprint for TO-236AB (SOT23)
BSH111BK |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
26 November 2014 |
12 / 16 |
Nexperia |
|
|
|
BSH111BK |
|
|
|
55 V, N-channel Trench MOSFET |
|
14. Revision history |
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Table 8. Revision history |
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Data sheet ID |
Release date |
Data sheet status |
Change notice |
Supersedes |
BSH111BK v.1 |
20141126 |
Product data sheet |
- |
- |
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BSH111BK |
All information provided in this document is subject to legal disclaimers. |
© Nexperia B.V. 2017. All rights reserved |
Product data sheet |
26 November 2014 |
13 / 16 |
