In yet another embodiment, the substrate holder 102 and

movable arm 106 may both move. In one example of this embodiment, the substrate holder 102 and the movable arm

106 may both move in a substantially linear fashion relative to

one anothet Specifically, the substrate holder 102 and the moveable arm 106 may move in such a manner that the substrate 104 is subject to substantially a linear movement relative to the nozzles 108, 110.

The nozzles 108, 110 may also move in such a manner as to direct the flow of gas and/or liquid onto the substrate surface

104. In this embodiment, the substrate 104 and the moveable

arm 106 may move with respect to each other or may remain stationary. The nozzles 108, 110 may direct the flow of the gas and/or liquid supplied to the substrate 104 from substantially the center to the edge of rotation. The nozzles 108, 110 may be angled to control the direction of the flow of the gas and/or liquid.

While the movement of the nozzles 108, 110 with respect

to the substrate 104 may be accomplished in all manners described above and their equivalents, the remainder of this specification will describe the moveable arm 106 moving the nozzles 108, 110 relative to the position of the substrate 104. However, it will be understood that such movement is not limited in this respect.

FIG. 2a is a top view of a substrate and FIG. 2b is a side

view of a substrate in which liquid is removed. In order to limit splashing of the liquid, an angle 202 between the veloc­ ity vector of the liquid 204 when leaving the nozzle 110 and the velocity vector of the rotating surface 206 at a point 208 where the liquid flow impinges may be reduced. Additionally, the nozzle 110 may be slightly angled outwards. For example, the angle 210 may be substantially between 0 and 5 degrees. Referring again to FIG. 1, in one embodiment of the inven­ tion, a substance consisting of a non-gaseous form may be supplied to the substrate 104. For example, a liquid may be supplied to the substrate 104. In one embodiment, a single liquid may be supplied to the substrate 104. However, more

than one liquid may be supplied.

The single liquid may be supplied to the substrate 104 via nozzle 110 located on movable arm 106. The single liquid may include dissolved gasses and/or dissolved solids. The single liquid may be a non-wetting liquid with respect to the substrate 104. The term non-wetting liquid as used in this specification means a liquid that is substantially removed from the surface of the substrate without leaving a liquid trace

when an external force, such as centrifugal force or gravity, is applied to the substrate. A contact angle between the non- wetting liquid and the substrate may be greater than 5 degrees, and preferably greater than 10 degrees.

Preferably the single liquid is a rinsing liquid. However, the

single liquid may also be a cleaning liquid or an etching liquid. The cleaning liquid may be comprised of a mixture of NH4OH, H202 and H20; a mixture of HC1, H202 and H20; diluted HC1; or a mixture containing 03. The rinsing liquid may be comprised of H20, or a mixture of H20 and an acid. The mixture of H20 and the acid may have a pH value between 2 and 6.

The single liquid supplied to the substrate 104 may be an aqueous solution that contains a dissolved gaseous substance. The gaseous substance may be capable of removing at least a portion of the oxygen present in the aqueous solution. This may be beneficial because oxygen may negatively affect the quality of the substrate 104. For example, if the substrate 104 is a silicon substrate, oxygen in the single liquid may chemi­ cally react with the silicon surface causing oxidation of the substrate. Oxidation may cause dissolved silicates to form, which may precipitate onto the substrate surface. As a result of the precipitation, the substrate 104 may become contami­ noted causing defects in the final product.

Alternatively, the single liquid may be supplied to the substrate 104 in an ambient having a low oxygen concentra­ tion. Such an ambient may contain less oxygen than found in atmospheric air. For example, the tool 100 may be located in a chamber 300 as depicted in FIG. 3. The chamber 300 may contain an ambient that has a low oxygen concentration. As one example, the chamber 300 may contain a nitrogen atmo­ sphere. However, other low oxygen atmospheres may also be provided in the chamber 300. By providing a low oxygen atmosphere, oxidation of the substrate surface may be reduced and/or eliminated.

An additional force may be exerted on the single liquid. For example, megasonic energy may be used to agitate the single liquid. As shown in FIG. 4, a megasonic generator 400 may be integrated into the liquid-supply system and directly transmit the megasonic energy to the single liquid. The energy may then be transferred to the surface of the substrate 104 via the single liquid.

The megasonic generator 400 may be connected to a megasonic liquid nozzle 410 and/or a megasonic liquid arm

406. The megasonic generator 400 may include a transducer

and a transmittet The transmitter may be cylindrical in shape and extend along, for the tool 100, the moveable arm 106, or, for the tool 400, the megasonic liquid arm 406.