MCP2551
3.0PACKAGING INFORMATION
3.1Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Example:
MCP2551 I/P e^^2563
1019
Example:
MCP2551E SN e^^10193
256
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
e3 Pb-free JEDEC designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator (e3) can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.
♥ 2010 Microchip Technology Inc. |
DS21667F-page 15 |
MCP2551
3 & ' !& " & 4 # * !( ! ! & 4 % & & # &
&& 255*** ' '5 4
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DS21667F-page 16 |
♥ 2010 Microchip Technology Inc. |
MCP2551
! "" #$%& ! '
3 & ' !& " & 4 # * !( ! ! & 4 % & & # &
&& 255*** ' '5 4
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♥ 2010 Microchip Technology Inc. |
DS21667F-page 17 |
MCP2551
! "" #$%& ! '
3 & ' !& " & 4 # * !( ! ! & 4 % & & # &
&& 255*** ' '5 4
DS21667F-page 18 |
♥ 2010 Microchip Technology Inc. |
MCP2551
APPENDIX A: REVISION HISTORY
Revision F (July 2010)
The following is the list of modifications:
1.Updates to the packaging diagrams.
Revision E (January 2007)
The following is the list of modifications:
1.Updates to the packaging diagrams.
Revision D (October 2003)
The following is the list of modifications:
1.Undocumented changes.
Revision C (November 2002)
The following is the list of modifications:
1.Undocumented changes.
Revision B (June 2002)
The following is the list of modifications:
1.Undocumented changes.
Revision A (June 2001)
• Original Release of this Document.
♥ 2010 Microchip Technology Inc. |
DS21667F-page 19 |
MCP2551
NOTES:
DS21667F-page 20 |
♥ 2010 Microchip Technology Inc. |
MCP2551
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
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PART NO. |
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-X |
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/XX |
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XXX |
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Device |
Temperature |
Package |
Pattern |
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Device: |
MCP2551: |
High-Speed CAN Transceiver |
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MCP2551T: High-Speed CAN Transceiver |
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(Tape and Reel) |
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Temperature |
I |
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-40°C to +85°C |
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Range: |
E |
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-40°C to +125°C |
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Package: |
P |
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Plastic DIP (300 mil Body) 8-lead |
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SN |
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Plastic SOIC (150 mil Body) 8-lead |
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Examples:
a)MCP2551-I/P: Industrial temperature,
PDIP package.
b)MCP2551-E/P: Extended temperature,
PDIP package.
c)MCP2551-I/SN: Industrial temperature,
SOIC package.
d)MCP2551T-I/SN: Tape and Reel,
Industrial Temperature,
SOIC package.
e)MCP2551T-E/SN: Tape and Reel,
Extended Temperature,
SOIC package.
f)MCP2551-E/SN: Extended Temperature,
SOIC package.
♥ 2010 Microchip Technology Inc. |
DS21667F-page 21 |
MCP2551
NOTES:
DS21667F-page 22 |
♥ 2010 Microchip Technology Inc. |