NXP Semiconductors |
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74AHC00; 74AHCT00 |
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Quad 2-input NAND gate |
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Table 1. Ordering information …continued |
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Type number |
Package |
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Temperature range |
Name |
Description |
Version |
74AHCT00 |
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74AHCT00D |
−40 °C to +125 °C |
SO14 |
plastic small outline package; 14 leads; |
SOT108-1 |
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body width 3.9 mm |
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74AHCT00PW |
−40 °C to +125 °C |
TSSOP14 |
plastic thin shrink small outline package; 14 leads; |
SOT402-1 |
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body width 4.4 mm |
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74AHCT00BQ |
−40 °C to +125 °C |
DHVQFN14 |
plastic dual in-line compatible thermal enhanced very |
SOT762-1 |
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thin quad flat package; no leads; 14 terminals; |
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body 2.5 × 3 × 0.85 mm |
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4. Functional diagram
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3 |
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1 |
1A |
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2 |
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1Y |
3 |
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2 |
1B |
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4 |
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4 |
2A |
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6 |
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& |
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5 |
2B |
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2Y |
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9 |
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9 |
3A |
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3Y |
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& |
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10 |
3B |
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10 |
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A |
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12 |
4A |
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12 |
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4Y |
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Y |
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13 |
4B |
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13 |
B |
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mna211 |
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mna212 |
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mna246 |
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Fig 1. Logic symbol |
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Fig 2. IEC logic symbol |
Fig 3. Logic diagram (one gate) |
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5.Pinning information
5.1Pinning
1A |
1 |
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14 |
VCC |
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1B |
2 |
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13 |
4B |
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1Y |
3 |
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12 |
4A |
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00 |
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2A |
4 |
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11 |
4Y |
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2B |
5 |
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10 |
3B |
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2Y |
6 |
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9 |
3A |
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GND |
7 |
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8 |
3Y |
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001aac938 |
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Fig 4. Pin configuration SO14 and TSSOP14
terminal 1 |
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1A |
CC |
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V |
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index area |
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1B |
2 |
1 |
14 |
13 |
4B |
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1Y |
3 |
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12 |
4A |
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2A |
4 |
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00 |
11 |
4Y |
2B |
5 |
GND(1) |
10 |
3B |
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2Y |
6 |
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9 |
3A |
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7 |
8 |
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GND |
3Y |
001aac939 |
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Transparent top view
(1)The die substrate is attached to this pad using conductive die attach material. It can not be used as a supply pin or input.
Fig 5. Pin configuration DHVQFN14
74AHC_AHCT00_4 |
© NXP B.V. 2008. All rights reserved. |
Product data sheet |
Rev. 04 — 28 April 2008 |
2 of 14 |