- •Introduction
- •Outline
- •PWB Construction
- •PWB/CCA Examples
- •Types of Rigid PWB
- •Types of Flex PWB
- •Footnotes on Flex PWBs
- •PWB Stack-Ups (1 and 2 Layer)
- •Multi-Layer PWBs
- •Exploded View of Multi-Layer PWB
- •Multi-Layer Stack-Up Examples
- •PWB Stack-Up Guidelines
- •PWB Materials
- •PWB Materials
- •PWB Material Examples
- •Dielectric, Common Thickness
- •Copper Options
- •Etch-Back
- •Etch-Back
- •Signal Distribution
- •Single Ended Structure Examples
- •Differential Structure Examples
- •PWB traces as Transmission Lines
- •Characteristic Impedance
- •Trace Impedance
- •Strip-Line & Micro-Strip Impedance
- •Asymmetrical Strip-Line Impedance
- •Impedance Examples
- •Loss
- •Conductor Loss
- •Loss due to Skin Effect & Roughness
- •Time Delay
- •Signal Dispersion
- •Signal Dispersion
- •Signal Dispersion Example
- •Mitigation of Dispersion
- •Coupling
- •Coupling Examples
- •Mitigation of Coupling
- •Differential Pairs
- •Differential Pair Routing Options
- •Differential Impedance Definitions
- •Differential Impedance Examples
- •Field Intensity - 1
- •Field Intensity – 2
- •Field Intensity - 3
- •Field Intensity - 4
- •PWB Pad and Trace Parameters
- •Vias
- •Fine Pitch BGA (FG456) Package
- •Fine Pitch BGA (FG1156) Package
- •Via Parameters
- •Source Terminations
- •Destination Terminations
- •“Intentional” Mismatch Example
- •“Intentional” Mismatch Example
- •Power Distribution Purpose
- •Supply Power Loss Budget
- •DC Loss Model
- •Power Distribution Considerations
- •Plane Capacitance, Inductance, Resistance
- •Capacitor Parameters
- •Capacitor Parameters
- •Capacitor Guidelines
- •Capacitor Mounting Pads
- •Decoupling Examples
- •Trace Width Example
- •References
- •References (continued)
- •Material Suppliers
- •PWB Fabricators
- •Design Tools
Conductor Loss 
DC Resistance
R |
DC |
= ρ |
l |
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RDC |
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= 0.6 |
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RDC |
= 0.679 µΩ − in |
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12 in |
= 2.3 |
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Skin Depth
δ=
δ=
δ=
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•Current density drops to 37% (1/e) |
πfµ0 |
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•Ignore if t<2δ |
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0.0172 µΩm |
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= 660 nm = 0.03 mils |
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4πx10 |
−7 |
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π (10 GHz ) |
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0 .0172 µΩm |
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4πx10 |
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π (10 MHz ) |
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Revision 4 |
Copyright Telephonics 2002-2005 |
35 |
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Loss due to Skin Effect & Roughness
Resistance, 5 mil Line |
Loss Variation, Roughness |
(on 1 oz and 0.5 oz copper) |
(1 oz, 11 mil width) |
Revision 4 |
Copyright Telephonics 2002-2005 |
36 |
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Time Delay
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Where: |
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td:time delay per unit length |
Lo:Inductance |
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= εr−effective =85 ε |
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L C |
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ps/inch |
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εr-effective: Effective Relative |
per unit length |
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d |
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Co:Capacitance |
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Dielectric constant |
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per unit length |
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C: Speed of Light |
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Freespace |
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t |
W |
Freespace |
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εo (εr=1) |
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εo (εr=1) |
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εr |
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εr |
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εr |
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Micro-Strip |
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Buried Micro-Strip |
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εr-effective(strip-line) = εr |
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ε |
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εr |
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1 |
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td =85 εr |
ps per inch |
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w |
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td |
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εr |
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td =180 |
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(FR4, εr = 4.5, |
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w =18mils, h =10mils) |
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Revision 4 |
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Copyright Telephonics 2002-2005 |
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37 |
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Signal Dispersion
♦Frequency Dependant Dielectric Constant
-Propagation velocity is frequency dependant
-PWB acts as a dispersive Medium
♦Becomes Issue
-Long Trace Runs
-High Speed Clocks
-Critical Analog
Revision 4 |
Copyright Telephonics 2002-2005 |
38 |
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