Introduction

♦Advances in digital and analog technologies present new challenges PWB design

♦Clock frequencies approach the L Band region

-Dielectric absorption, Skin Depth, Impedances, Dispersion

♦High Power and/or Lower Voltage

-Power distribution, decupling

♦High dynamic-range/low-noise analog circuitry

-Noise immunity, stability

♦High Density Components

-Xilinx FG1156 Fine Pitch BGA (1.0 mm pitch 39 mils)

-Finer pitch BGAs 0.8 mm (31 mils) and 0.5 mm (20 mils)

♦Overlap between Disciplines

-Electrical, Mechanical, Manufacturing, Design/Drafting

Outline

♦PWB Construction

-Types, Stack-Ups

♦PWB Materials

-Core/pre-preg, copper weights

♦Signal Distribution

-Impedance, Coupling, Signal Loss, Delay

♦Power Distribution & Grounding

-Planes, Decoupling, Power Loss

♦References and Vendors

PWB Construction