- •Introduction
- •Outline
- •PWB Construction
- •PWB/CCA Examples
- •Types of Rigid PWB
- •Types of Flex PWB
- •Footnotes on Flex PWBs
- •PWB Stack-Ups (1 and 2 Layer)
- •Multi-Layer PWBs
- •Exploded View of Multi-Layer PWB
- •Multi-Layer Stack-Up Examples
- •PWB Stack-Up Guidelines
- •PWB Materials
- •PWB Materials
- •PWB Material Examples
- •Dielectric, Common Thickness
- •Copper Options
- •Etch-Back
- •Etch-Back
- •Signal Distribution
- •Single Ended Structure Examples
- •Differential Structure Examples
- •PWB traces as Transmission Lines
- •Characteristic Impedance
- •Trace Impedance
- •Strip-Line & Micro-Strip Impedance
- •Asymmetrical Strip-Line Impedance
- •Impedance Examples
- •Loss
- •Conductor Loss
- •Loss due to Skin Effect & Roughness
- •Time Delay
- •Signal Dispersion
- •Signal Dispersion
- •Signal Dispersion Example
- •Mitigation of Dispersion
- •Coupling
- •Coupling Examples
- •Mitigation of Coupling
- •Differential Pairs
- •Differential Pair Routing Options
- •Differential Impedance Definitions
- •Differential Impedance Examples
- •Field Intensity - 1
- •Field Intensity – 2
- •Field Intensity - 3
- •Field Intensity - 4
- •PWB Pad and Trace Parameters
- •Vias
- •Fine Pitch BGA (FG456) Package
- •Fine Pitch BGA (FG1156) Package
- •Via Parameters
- •Source Terminations
- •Destination Terminations
- •“Intentional” Mismatch Example
- •“Intentional” Mismatch Example
- •Power Distribution Purpose
- •Supply Power Loss Budget
- •DC Loss Model
- •Power Distribution Considerations
- •Plane Capacitance, Inductance, Resistance
- •Capacitor Parameters
- •Capacitor Parameters
- •Capacitor Guidelines
- •Capacitor Mounting Pads
- •Decoupling Examples
- •Trace Width Example
- •References
- •References (continued)
- •Material Suppliers
- •PWB Fabricators
- •Design Tools
PWB Materials
PWB Materials
♦Dozens of dielectric materials to chose from
-Rogers 20 types
-Taconic 10 types
-Polyclad 25 types
-Park Nelco 30 types
♦Several dielectric thickness options
♦Several copper thickness options
♦Two copper plating options
-Rolled
-Electro-Deposited
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Electrical Considerations inn
Selecting Material
♦Dielectric Constant (permittivity)
-The more stable, the better
-Lower values may be more suitable for high layer counts
-Higher values may be more suitable for some RF structures
♦Loss Tangent
-The lower, the better
-Becomes more of an issue at higher frequencies
♦Moisture Absorption
-The lower, the better
-Can effect dielectric constant and loss tangent
♦Voltage Breakdown
-The higher, the better
-Typically not an issue, except in high voltage applications
♦Resistivity
-The higher, the better
-Typically not an issue, except in low leakage applications
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Mechanical Considerations inin
Selecting Materials
♦Peel Strength
-The higher, the better
♦Flammability
-UL Standards
♦Glass Transition Temperature (Tg)
♦Thermal Conductivity
-Typically PWB material is considered an insulator
-Thermal Clad (Bergquist)
-Planes & vias contribute to thermal conductivity
♦Coefficient of Expansion
-XY matching to components, solder joint stress (LCC)
-Z axis expansion, via stress
♦Weight (density)
♦Flexibility
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