- •Introduction
- •Outline
- •PWB Construction
- •PWB/CCA Examples
- •Types of Rigid PWB
- •Types of Flex PWB
- •Footnotes on Flex PWBs
- •PWB Stack-Ups (1 and 2 Layer)
- •Multi-Layer PWBs
- •Exploded View of Multi-Layer PWB
- •Multi-Layer Stack-Up Examples
- •PWB Stack-Up Guidelines
- •PWB Materials
- •PWB Materials
- •PWB Material Examples
- •Dielectric, Common Thickness
- •Copper Options
- •Etch-Back
- •Etch-Back
- •Signal Distribution
- •Single Ended Structure Examples
- •Differential Structure Examples
- •PWB traces as Transmission Lines
- •Characteristic Impedance
- •Trace Impedance
- •Strip-Line & Micro-Strip Impedance
- •Asymmetrical Strip-Line Impedance
- •Impedance Examples
- •Loss
- •Conductor Loss
- •Loss due to Skin Effect & Roughness
- •Time Delay
- •Signal Dispersion
- •Signal Dispersion
- •Signal Dispersion Example
- •Mitigation of Dispersion
- •Coupling
- •Coupling Examples
- •Mitigation of Coupling
- •Differential Pairs
- •Differential Pair Routing Options
- •Differential Impedance Definitions
- •Differential Impedance Examples
- •Field Intensity - 1
- •Field Intensity – 2
- •Field Intensity - 3
- •Field Intensity - 4
- •PWB Pad and Trace Parameters
- •Vias
- •Fine Pitch BGA (FG456) Package
- •Fine Pitch BGA (FG1156) Package
- •Via Parameters
- •Source Terminations
- •Destination Terminations
- •“Intentional” Mismatch Example
- •“Intentional” Mismatch Example
- •Power Distribution Purpose
- •Supply Power Loss Budget
- •DC Loss Model
- •Power Distribution Considerations
- •Plane Capacitance, Inductance, Resistance
- •Capacitor Parameters
- •Capacitor Parameters
- •Capacitor Guidelines
- •Capacitor Mounting Pads
- •Decoupling Examples
- •Trace Width Example
- •References
- •References (continued)
- •Material Suppliers
- •PWB Fabricators
- •Design Tools
Types of Rigid PWB
♦Rigid, One Layer, Type 1
♦Rigid, Two Layer, Type 2
♦Rigid, Multi Layer, w/o blind/buried vias, Type 3
♦Rigid, Multi Layer, w/ blind/buried vias, Type 4
♦Rigid, Metal Core, w/o blind/buried vias, Type 5
♦Rigid, Metal Core, w/ blind/buried vias, Type 6
(Per IPC-2222 standard)
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Types of Flex PWB
♦Flex, One Layer, Type 1
♦Flex, Two Layer, Type 2
♦Flex, Multi Layer, Type 3
♦Flex, Multi Layer, Rigid/Flex, Type 4
(Per IPC-2223 Standard)
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Footnotes on Flex PWBs
♦Used as alternative to a discrete wiring harness
♦Many similarities to rigid PWBs
♦Typically higher development cost than harness
♦Typically cheaper than harness in production
♦Improved repeatability
♦Improved EMI performance and impedance control when ground layers are used
♦Typically much less real estate needed
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PWB Stack-Ups (1 and 2 Layer)er)
Signals, Grounds, Supplies
Dielectric
One Sided
Signals, Ground, Supplies
Dielectric
Ground (Signals, Supplies)
Two Sided
•Inexpensive
•Applicablecircuits to straightforward
•Difficult to control EMI without external shield
•Difficult to control impedance
•Inexpensivesided) (slightly more than 1
•Applicable to more complex circuits
•EMI mitigation with ground plane
•Impedance control simplified with ground plane
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