
- •Contents
- •List of Tables
- •List of Figures
- •Preface
- •About this document
- •Feedback
- •Introduction
- •1.1 About the ARM PrimeCell MultiPort Memory Controller (PL172)
- •1.2 Supported dynamic memory devices
- •1.3 Supported static memory devices
- •Functional Overview
- •2.1 PrimeCell MPMC functional description
- •2.2 Overview of a PrimeCell MPMC, ASIC, or ASSP system
- •2.3 Low power operation
- •2.4 Lock and semaphores
- •2.5 Arbitration
- •2.6 Memory bank select
- •2.7 Memory map
- •Programmer’s Model
- •3.1 About the programmer’s model
- •3.2 Register descriptions
- •Programmer’s Model for Test
- •4.1 PrimeCell MPMC test harness overview
- •4.2 Scan testing
- •4.3 Test registers
- •Static Memory Controller
- •5.1 Static memory device selection
- •5.2 Write-protection
- •5.3 Extended wait transfers
- •5.4 Memory mapped peripherals
- •5.5 Static memory initialization
- •5.6 Byte lane control
- •5.7 Byte lane control and databus steering for little and big-endian configurations
- •Dynamic Memory Controller
- •6.1 Write-protection
- •6.2 Access sequencing and memory width
- •6.3 Address mapping
- •6.4 Dynamic memory controller command descriptions
- •6.5 Generic SDRAM initialization example
- •6.6 Micron MT48LC4M16A2 SDRAM initialization example
- •6.8 Micron MT28F4M16S2 SyncFlash initialization example
- •6.9 Micron SyncFlash commands
- •Common Memory Transactions
- •7.1 Static and dynamic memory transaction latency
- •Test Interface Controller
- •8.1 About TIC
- •8.2 Sequence of events leading to entry into TIC test mode
- •System Connectivity
- •9.2 Self-refresh entry
- •9.3 Example system
- •Off-chip Connectivity
- •10.2 Pin count reduction by reducing databus width
- •10.3 Pin count reduction by removing functionality
- •10.4 Address pin reduction
- •10.5 Chip select pin reduction
- •10.6 Device support
- •10.7 Multiplexing static and dynamic memory pins
- •10.8 Reducing pin count by multiplexing MPMC pins
- •10.9 About MPMC timing
- •10.10 On-chip timing path
- •10.11 Off-chip timing path
- •10.12 Clock strategy
- •10.13 Clock ratios
- •10.14 Memory clock and fed-back clock strategy
- •Pad Interface Timing
- •A.1 Overview
- •A.2 Signal delay
- •A.3 Method to reduce delay
- •A.4 Methods to reduce skew
- •A.5 Methods to minimize the effects of delay and skew
- •A.6 Example SDRAM memory timing diagram
- •A.7 SDRAM memory timing paths
- •Troubleshooting
- •B.1 Troubleshooting
- •C.1 AHB register signals
- •C.2 AHB memory signals
- •C.3 Miscellaneous and clock signals
- •C.4 Pad interface and control signals
- •C.5 Test Interface Controller (TIC) signals
- •C.6 Scan test signals

List of Figures
ARM PrimeCell MultiPort Memory Controller
(PL172) Technical Reference Manual
|
Key to timing diagram conventions ............................................................................ |
xvi |
Figure 2-1 |
PrimeCell MPMC block diagram ............................................................................... |
2-2 |
Figure 2-2 |
Pad interface block diagram ...................................................................................... |
2-8 |
Figure 2-3 |
TIC block diagram ..................................................................................................... |
2-9 |
Figure 2-4 |
PrimeCell MPMC in an example system ................................................................. |
2-10 |
Figure 3-1 |
Peripheral identification register bit assignment ...................................................... |
3-36 |
Figure 5-1 |
External memory zero wait state read timing diagram .............................................. |
5-8 |
Figure 5-2 |
External memory two wait state read timing diagram ................................................ |
5-9 |
Figure 5-3 |
External memory two output enable delay state read timing diagram ..................... |
5-10 |
Figure 5-4 |
External memory two zero wait state reads timing diagram .................................... |
5-11 |
Figure 5-5 |
External memory zero wait fixed length burst read timing diagram ......................... |
5-12 |
Figure 5-6 |
External memory two wait states fixed length burst read timing diagram ............... |
5-13 |
Figure 5-7 |
External memory page mode read transfer timing diagram .................................... |
5-14 |
Figure 5-8 |
External memory 32-bit burst read from 8-bit memory timing diagram ................... |
5-15 |
Figure 5-9 |
External memory zero wait state write timing diagram ............................................ |
5-16 |
Figure 5-10 |
External memory two wait state write timing diagram ............................................. |
5-17 |
Figure 5-11 |
External memory two write enable delay state write timing diagram ....................... |
5-18 |
Figure 5-12 |
External memory two zero wait writes timing diagram ............................................ |
5-19 |
Figure 5-13 |
Read followed by write (both zero wait) with no turnaround .................................... |
5-20 |
Figure 5-14 |
Write followed by read (both zero wait) with no turnaround .................................... |
5-21 |
Figure 5-15 |
Read followed by a write (all zero wait state) with two turnaround cycles ............... |
5-22 |
ARM DDI 0215A |
Copyright © 2002 ARM Limited. All rights reserved. |
xi |

List of Figures
Figure 5-16 |
Memory banks constructed from 8-bit memory ...................................................... |
5-24 |
Figure 5-17 |
Memory banks constructed from 16-bit memory .................................................... |
5-24 |
Figure 5-18 |
Memory bank constructed from 32-bit memory ...................................................... |
5-25 |
Figure 5-19 |
Typical memory connection diagram ...................................................................... |
5-26 |
Figure 7-1 |
A write transfer to a write protected chip select ........................................................ |
7-3 |
Figure 7-2 |
An SDRAM auto-refresh cycle .................................................................................. |
7-3 |
Figure 7-3 |
An INCR, INCR4, or WRAP4 burst read transfer, buffer hit ..................................... |
7-5 |
Figure 7-4 |
Three sequential reads, burst type SINGLE, read transfer, buffer hit ....................... |
7-6 |
Figure 7-5 |
Three nonsequential reads, burst type SINGLE, read transfer, buffer hit ................. |
7-7 |
Figure 7-6 |
An INCR8 or WRAP8 burst read transfer, buffer hit ................................................. |
7-8 |
Figure 7-7 |
Two simultaneous INCR, INCR4, or WRAP4 burst read transfer, buffer hit ............. |
7-9 |
Figure 7-8 |
Four word INCR, INCR4, or WRAP4 burst write .................................................... |
7-10 |
Figure 7-9 |
Three sequential write transfers ............................................................................. |
7-11 |
Figure 7-10 |
Three nonsequential write transfers ....................................................................... |
7-12 |
Figure 7-11 |
INCR8 or WRAP8 burst write ................................................................................. |
7-13 |
Figure 7-12 |
Two simultaneous INCR, INCR4, or WRAP4 burst write transfer, buffer hit .......... |
7-14 |
Figure 9-1 |
MPMC system interconnection diagram ................................................................... |
9-3 |
Figure 9-2 |
PMU self-refresh ..................................................................................................... |
.. 9-6 |
Figure 9-3 |
PMU self-refresh waveforms .................................................................................... |
9-7 |
Figure 9-4 |
Forcing AHB masters idle in a multi-layer system .................................................... |
9-9 |
Figure 9-5 |
Example system ..................................................................................................... |
9-10 |
Figure 10-1 |
Clock feed back .................................................................................................... |
10-19 |
Figure 10-2 |
x8 SDRAM device ................................................................................................. |
10-22 |
Figure 10-3 |
x16 SDRAM connection ........................................................................................ |
10-23 |
Figure 10-4 |
x32 SDRAM interconnection ................................................................................. |
10-24 |
Figure 10-5 |
Mixed width SDRAM memory devices .................................................................. |
10-25 |
Figure 10-6 |
SRAM and SDRAM memory devices ................................................................... |
10-27 |
Figure 10-7 |
Medium performance systems .............................................................................. |
10-28 |
Figure 10-8 |
Lower performance systems ................................................................................. |
10-29 |
Figure A-1 |
On-chip to off-chip delay for a single signal .............................................................. |
A-3 |
Figure A-2 |
On-chip to off-chip delay with skew for a single signal ............................................. |
A-5 |
Figure A-3 |
On-chip to off-chip delay with skew for multiple signals ........................................... |
A-5 |
Figure A-4 |
SDRAM timing diagram ............................................................................................ |
A-8 |
Figure A-5 |
Memory controller to SDRAM memory timing path .................................................. |
A-9 |
Figure A-6 |
SDRAM memory to memory controller timing path ................................................ |
A-10 |
xii |
Copyright © 2002 ARM Limited. All rights reserved. |
ARM DDI 0215A |