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mikrocont / MC68HC705C8A.pdf

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Mechanical Specifications

44-Lead Ceramic-Leaded Chip Carrier (CLCC)

14.6 44-Lead Ceramic-Leaded Chip Carrier (CLCC)

0.18 (0.007) M

N S -P S

-N-

Y BRK

0.18 (0.007) M

N S -P

L S

-L-

DETAIL D-D

0.25 (0.010) M

S -P

-P-

0.20 (0.008) M

M -P M

0.18 (0.007)

S -P

0.18 (0.007)

S -P

0.10 (0.004)

-T-

SEATING

PLANE

DETAIL S

0.25 (0.010) S

L S

N S -P S

0.18 (0.007) M

N S -P

0.18 (0.007) M

N S -P

0.18 (0.007)

N S -P

0.18 (0.007)

S -P

DETAIL S

NOTES:

1.DATUMS -L-, -N-, AND -P- DETERMINED WHERE TOP OF LEAD SHOULDER EXIT BODY.

2.DIMINSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.

3.DIMINSIONS R AND U DO NOT INCLUDE GLASS MENISCUS. ALLOWABLE GLASS RUNOUT IS 0.25 (0.010) PER SIDE.

4.DIMINSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

	MILLIMETERS		INCHES
DIM	MIN	MAX	MIN	MAX
A	17.40	17.65	0.685	0.695
B	17.40	17.65	0.685	0.695
C	4.20	4.57	0.165	0.180
E	2.29	2.79	0.090	0.110
F	0.33	0.48	0.013	0.019
G	1.27 BSC		0.050 BSC
H	0.66	0.81	0.026	0.032
J	0.51	---	0.020	---
K	0.64	---	0.025	---
R	16.51	16.66	0.650	0.656
S	6.94	7.26	0.273	0.286
U	16.51	16.66	0.650	0.656
V	1.07	1.21	0.042	0.048
W	1.07	1.21	0.042	0.048
Y	---	0.50	---	0.020
G1	14.99	16.00	0.590	0.630
K1	1.02	---	0.040	---

Figure 14-4. MC68HC705C8AFS Package Dimensions (Case #777B)

MC68HC705C8A —	Rev. 3	Technical Data

MOTOROLA	Mechanical Specifications	195

Mechanical Specifications

14.7 44-Pin Quad Flat Pack (QFP)

	L
	33			23
	34			22
					S
					D
					S
-A-				-B-	A-B
-A-				-B-	C	B
					C	B
L					B M	A-	V
					(0.008)	(0.002)
		DETAIL A			0.20	0.05
		DETAIL A
	44			12
	1			11
	-D-
	A
	0.20 (0.008) M	C A-B S	D S
	0.05 (0.002) A-B
	S
	0.20 (0.008)M	H A-B S	D S
			M	DETAIL C
				DETAIL C
C E				-H-	DATUM
				-H-	PLANE
-C-	H				0.01 (0.004)
SEATING	H			M
PLANE	G			M

	B
	B
S	-A-, -B-, -D-
D

DETAIL A

A-B		F
H		F
H
M		BASE METAL
(0.008)	J	N
0.20	J	N
0.20		D
		D

0.20(0.008)M C A-B S D S

SECTION B-B

NOTES:

1.1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2.2. CONTROLLING DIMENSION: MILLIMETER.

3.3. DATUM PLANE -H- IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE.

4.4. DATUMS -A-, -B- AND -D- TO BE DETERMINED AT DATUM PLANE -H-.

5.5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE -C-.

6.6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE -H-.

7.7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT.

		M
			T
PLANEDATUM -H-			R
	W	K	Q
			Q

		X
	DETAIL C

	MILLIMETERS			INCHES
DIM	MIN		MAX	MIN	MAX
A	9.90		10.10	0.390	0.398
B	9.90		10.10	0.390	0.398
C	2.10		2.45	0.083	0.096
D	0.30		0.45	0.012	0.018
E	2.00		2.10	0.079	0.083
F	0.30		0.40	0.012	0.016
G	0.80 BSC			0.031 BSC
H	---		0.25	---	0.010
J	0.013		0.23	0.005	0.009
K	0.65		0.95	0.026	0.037
L	8.00 REF			0.315 REF
M	5	°	10	5	10
		°	°	°	°
N	0.13		0.17	0.005	0.007
Q	0	°	7	0	7
		°	°	°	°
R	0.13		0.30	0.005	0.012
S	12.95		13.45	0.510	0.530
T	0.13		---	0.005	---
U	0 °		---	0°	---
V	12.95		13.45	0.510	0.530
W	0.40		---	0.016	---
X	1.6 REF			0.063 REF

Figure 14-5. MC68HC705C8AFB Package Dimensions (Case #824A)

Technical Data		MC68HC705C8A — Rev. 3

196	Mechanical Specifications	MOTOROLA

Mechanical Specifications

42-Pin Shrink Dual In-Line Package (SDIP)

14.8 42-Pin Shrink Dual In-Line Package (SDIP)

		-A-
	42		22
			-B-
	1		21	L
				L
			C	H
			C
-T-
SEATING
PLANE	F	G	N	M
			N
			K

	D 42 PL			J 42 PL
		0.25 (0.010) M T A S		0.25 (0.010) M T B S

NOTES:

1.DIMENSIONS AND TOLERANCING PER ANSI Y14.5M, 1982.

2.CONTROLLING DIMENSION: INCH.

3.DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL.

4.DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).

	INCHES		MILLIMETERS
DIM	MIN	MAX	MIN	MAX
DIM	MIN	MAX	MIN	MAX
A	1.435	1.465	36.45	37.21
B	0.540	0.560	13.72	14.22
C	0.155	0.200	3.94	5.08
D	0.014	0.022	0.36	0.56
F	0.032	0.046	0.81	1.17
G	0.070 BSC		1.778 BSC
H	0.300 BSC		7.62 BSC
J	0.008	0.015	0.20	0.38
K	0.115	0.135	2.92	3.43
L	0.600 BSC		15.24 BSC
M	0°	15°	0°	15°
N	0.020	0.040	0.51	1.02

Figure 14-6. MC68HC705C8AB Package Dimensions (Case #858)

MC68HC705C8A —	Rev. 3	Technical Data

MOTOROLA	Mechanical Specifications	197

Mechanical Specifications

Technical Data		MC68HC705C8A — Rev. 3

198	Mechanical Specifications	MOTOROLA

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