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Балаковский институт техники, технологии и управления

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mikrocont / MC68HC705C8A.pdf

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Technical Data — MC68HC705C8A

Section 14. Mechanical Specifications

14.1 Contents

14.2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191

14.3 40-Pin Plastic Dual In-Line Package (PDIP). . . . . . . . . . . . . .192

14.4 40-Pin Ceramic Dual In-Line Package (Cerdip) . . . . . . . . . . .193 14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC) . . . . . . . . . . . .194 14.6 44-Lead Ceramic-Leaded Chip Carrier (CLCC) . . . . . . . . . . .195 14.7 44-Pin Quad Flat Pack (QFP). . . . . . . . . . . . . . . . . . . . . . . . .196 14.8 42-Pin Shrink Dual In-Line Package (SDIP) . . . . . . . . . . . . . .197

14.2 Introduction

Package dimensions available at the time of this publication for the

MC68HC705C8A are provided in this section. The packages are:

•40-pin plastic dual in-line package (PDIP)

•40-pin ceramic dual-in-line package (cerdip)

•44-lead plastic-leaded chip carrier (PLCC)

•44-lead ceramic-leaded chip carrier (CLCC)

•44-pin quad flat pack (QFP)

•42-pin shrink dual in-line package (SDIP)

MC68HC705C8A —	Rev. 3	Technical Data

MOTOROLA	Mechanical Specifications	191

Mechanical Specifications

14.3 40-Pin Plastic Dual In-Line Package (PDIP)

40						21
40						21								MILLIMETERS		INCHES
														MILLIMETERS		INCHES
													DIM	MIN	MAX	MIN	MAX
								B
								B					A	51.69	52.45	2.035	2.065
													B	13.72	14.22	0.540	0.560
1						20							C	3.94	5.08	0.155	0.200
1						20							D	0.36	0.56	0.014	0.022
													D	0.36	0.56	0.014	0.022
													F	1.02	1.52	0.040	0.060
			A								L		G	2.54 BSC		0.100 BSC
													G	2.54 BSC		0.100 BSC
													H	1.65	2.16	0.065	0.085
									C				J	0.20	0.38	0.008	0.015
							N						K	2.92	3.43	0.115	0.135
							N						L	15.24 BSC		0.600 BSC
													M	0°	1°	0°	1°
												J	N	0.51	1.02	0.020	0.040
	H	G		F	D			K		M
								K

SEATING

PLANE

NOTES:

1. POSITION TOLERANCE OF LEADS (D), SHALL BEWITHIN 0.25 (0.010) AT MAXIMUM MATERIAL CONDITIONS, IN RELATION TO SEATING PLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

Figure 14-1. MC68HC705C8AP Package Dimensions (Case #711)

Technical Data		MC68HC705C8A — Rev. 3

192	Mechanical Specifications	MOTOROLA

Mechanical Specifications

40-Pin Ceramic Dual In-Line Package (Cerdip)

14.4 40-Pin Ceramic Dual In-Line Package (Cerdip)

40		21
		B
1		20
	A		L
		N	L
		N
T			C
T			DATUM
SEATING		K	PLANE
SEATING		K	J
PLANE
G			M

D 40 PL

φ 0.25(0.010) M T A M

	INCHES		MILLIMETERS
DIM	MIN	MAX	MIN	MAX
A	2.020	2.096	51.31	53.23
B	0.500	0.610	12.70	15.94
C	0.160	0.240	4.06	6.09
D	0.015	0.022	0.38	0.55
F	0.050	0.065	1.27	1.65
G	0.100 BSC		2.54 BSC
J	0.008	0.012	0.20	0.30
K	0.125	0.160	3.17	4.06
L	0.600 BSC		15.24 BSC
M	0°	15°	0°	15°
N	0.020	0.050	0.51	1.27

Figure 14-2. MC68HC705C8AS Package Dimensions (Case #734A)

MC68HC705C8A —	Rev. 3	Technical Data

MOTOROLA	Mechanical Specifications	193

Mechanical Specifications

14.5 44-Lead Plastic-Leaded Chip Carrier (PLCC)

0.007(0.180) M

L-M

-N-

Y BRK

0.007(0.180)

L-M

N S

-L-

-M-

0.010 (0.25)

L-M

VIEW D-D

0.007(0.180) M

L-M

0.007(0.180) M

L-M

0.007(0.180)

L-M

0.004 (0.10)

-T-

SEATING

PLANE

VIEW S

0.010 (0.25)

L-M

0.007(0.180) M

L-M

VIEW S

NOTES:

1.DATUMS -L-, -M-, AND -N- ARE DETERMINED WHERE TOP OF LEAD SHOLDERS EXITS PLASTIC BODY AT MOLD PARTING LINE.

2.DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE.

3.DIMENSION R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.25) PER SIDE.

4.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

5.CONTROLLING DIMENSION: INCH.

6.THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF THE MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM

OF THE PLASTIC BODY.

7.DIMINSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTUSION(S) SHALL NOT CAUSE THE H DIMINSION TO BE GREATER THAN 0.037 (0.940198). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMINISION TO SMALLER THAN 0.025 (0.635).

			INCHES		MILLIMETERS

DIM	MIN			MAX	MIN		MAX
A	0.685			0.695	17.40		17.65
B	0.685			0.695	17.40		17.65
C	0.165			0.180	4.20		4.57
E	0.090			0.110	2.29		2.79
F	0.013			0.019	0.33		0.48
G		0.050 BSC				1.27 BSC
H	0.026			0.032	0.66		0.81
J	0.020				0.51

K	0.025				0.64

R	0.650			0.656	16.51		16.66
U	0.650			0.656	16.51		16.66
V	0.042			0.048	1.07		1.21
W	0.042			0.048	1.07		1.21
X	0.042			0.056	1.07		1.42
Y				0.020			0.50

Z	2°			10°	2°		10°
G1	0.610			0.630	15.50		16.00
K1	0.040				1.02

Figure 14-3. MC68HC705C8AFN Package Dimensions (Case #777)

Technical Data		MC68HC705C8A — Rev. 3

194	Mechanical Specifications	MOTOROLA

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