Ordering Information
Speed (MHz) |
Power Supply |
Ordering Code |
Package(1) |
Operation Range |
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ATtiny2313V-8PI |
20P3 |
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ATtiny2313V-8SI |
20S |
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8(3) |
1.8 - 5.5V |
ATtiny2313V-8MI |
32M1-A |
Industrial |
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ATtiny2313V-8PJ(2) |
20P3 |
(-40°C to 85°C) |
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ATtiny2313V-8SJ(2) |
20S |
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ATtiny2313V-8MJ(2) |
32M1-A |
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ATtiny2313-16PI |
20P3 |
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ATtiny2313-16SI |
20S |
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16(3) |
2.7 - 5.5V |
ATtiny2313-16MI |
32M1-A |
Industrial |
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ATtiny2313-16PJ(2) |
20P3 |
(-40°C to 85°C) |
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ATtiny2313-16SJ(2) |
20S |
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ATtiny2313-16MJ(2) |
32M1-A |
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Note: 1. |
This device can also be supplied in wafer form. Please contact your local Atmel sales office for detailed ordering information |
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and minimum quantities. |
2. |
Pb-free packaging alternative. |
3. |
See Figure 81 on page 179 and Figure 82 on page 179. |
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Package Type |
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20P3 |
20-lead, 0.300" Wide, Plastic Dual Inline Package (PDIP) |
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20S |
20-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) |
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32M1-A |
32-pad, 5 x 5 x 1.0 mm body, lead pitch 0.50 mm, Micro Lead Frame Package (MLF) |
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10 ATtiny2313/V
2543BS–AVR–09/03
ATtiny2313/V
Packaging Information
20P3
D
PIN 1
E1
A
SEATING PLANE
A1
L
B
B1
e
E
C 
eC
eB
Notes: 1. This package conforms to JEDEC reference MS-001, Variation AD.
2.Dimensions D and E1 do not include mold Flash or Protrusion. Mold Flash or Protrusion shall not exceed 0.25 mm (0.010").
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL |
MIN |
NOM |
MAX |
NOTE |
A |
– |
– |
5.334 |
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A1 |
0.381 |
– |
– |
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D |
25.984 |
– |
25.493 |
Note 2 |
E |
7.620 |
– |
8.255 |
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E1 |
6.096 |
– |
7.112 |
Note 2 |
B |
0.356 |
– |
0.559 |
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B1 |
1.270 |
– |
1.551 |
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L |
2.921 |
– |
3.810 |
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C |
0.203 |
– |
0.356 |
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eB |
– |
– |
10.922 |
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eC |
0.000 |
– |
1.524 |
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e |
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2.540 TYP |
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09/28/01
TITLE
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2325 Orchard Parkway |
20P3, 20-lead (0.300"/7.62 mm Wide) Plastic Dual |
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San Jose, CA 95131 |
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R |
Inline Package (PDIP) |
DRAWING NO. REV.
20P3 B
11
2543BS–AVR–09/03
20S
C
1
E H
L
N
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Top View |
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A1 |
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End View |
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COMMON DIMENSIONS |
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(Unit of Measure = inches) |
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e |
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b |
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SYMBOL |
MIN |
NOM |
MAX |
NOTE |
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A |
0.0926 |
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0.1043 |
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A |
A1 |
0.0040 |
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0.0118 |
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b |
0.0130 |
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0.0200 |
4 |
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D |
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C |
0.0091 |
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0.0125 |
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D |
0.4961 |
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0.5118 |
1 |
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Side View |
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E |
0.2914 |
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0.2992 |
2 |
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H |
0.3940 |
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0.4190 |
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L |
0.0160 |
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0.050 |
3 |
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e |
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0.050 BSC |
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Notes: 1. This drawing is for general information only; refer to JEDEC Drawing MS-013, Variation AC for additional information.
2.Dimension "D" does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15 mm (0.006") per side.
3.Dimension "E" does not include inter-lead Flash or protrusion. Inter-lead Flash and protrusions shall not exceed 0.25 mm (0.010") per side.
4."L" is the length of the terminal for soldering to a substrate.
5.The lead width "b", as measured 0.36 mm (0.014") or greater above the seating plane, shall not exceed a maximum value of 0.61 mm
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(0.024") per side. |
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1/9/02 |
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TITLE |
DRAWING NO. |
|
REV. |
|
|
|
2325 Orchard Parkway |
20S2, 20-lead, 0.300" Wide Body, Plastic Gull |
20S2 |
|
A |
|
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|
R San Jose, CA 95131 |
Wing Small Outline Package (SOIC) |
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12 ATtiny2313/V
2543BS–AVR–09/03
ATtiny2313/V
32M1-A
|
D |
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D1 |
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1 |
0 |
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2 |
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Pin 1 ID |
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3 |
E1 E |
SIDE VIEW |
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TOP VIEW |
A2 |
A3 |
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A1 |
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A |
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0.08 C |
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P |
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D2 |
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COMMON DIMENSIONS |
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(Unit of Measure = mm) |
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Pin 1 ID |
SYMBOL |
MIN |
NOM |
MAX |
NOTE |
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1 |
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P |
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A |
0.80 |
0.90 |
1.00 |
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2 |
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3 |
A1 |
– |
0.02 |
0.05 |
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E2 |
A2 |
– |
0.65 |
1.00 |
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A3 |
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0.20 REF |
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b |
0.18 |
0.23 |
0.30 |
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D |
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5.00 BSC |
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D1 |
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4.75 BSC |
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b |
e |
L |
D2 |
2.95 |
3.10 |
3.25 |
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BOTTOM VIEW |
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E |
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5.00 BSC |
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E1 |
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4.75BSC |
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E2 |
2.95 |
3.10 |
3.25 |
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e |
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0.50 BSC |
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L |
0.30 |
0.40 |
0.50 |
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Notes: 1. JEDEC Standard MO-220, Fig. 2 (Anvil Singulation), VHHD-2. |
P |
– |
– |
0.60 |
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0 |
– |
– |
12o |
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|||
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||||
TITLE
|
2325 Orchard Parkway |
32M1-A, 32-pad, 5 x 5 x 1.0 mm Body, Lead Pitch 0.50 mm |
|
San Jose, CA 95131 |
|
R |
Micro Lead Frame Package (MLF) |
01/15/03
DRAWING NO. REV.
32M1-A C
13
2543BS–AVR–09/03