- •Volve, point. RiepeBoa cjiob c npetJ)hKcaMn dis-, in-, ir-, un-, non-, mal-. NEpboe 3ahhthe Pa6oTa b ayflHTopnn
- •1. LlpoBepbTe, 3HaeTe jim Bbi cneflyKjlLiMe c/iOBa.
- •CjIoBa, hMeiOllXHe oohHaKobUti kOpeHb c pyCckhmh cjioBaMh
- •YhmTecb nepeBoamTb.
- •1.1. 03HaKoMbTcCb c thIiaMh jicbOrO oIipCAeAchHn CyiUcctbhTeJIbHOrO h IiepCBeAhTe hx (BbiiiojiHflercji ycnio):
- •3* A much faster change, a much denser population, much less oil
- •[. The number of circuit components; the use of low gas velocities
- •Rapidly developing technology of smaller electronic components
- •The increased complexity of the designs to be implemented will be
- •OrpyKTypa:
- •OchobhOfi tekct
- •3JickTpOhHbIx npM60p0b solid-state components — tBepflOTejib- Hbic koMnOhchTbl, nOJiynpObOilHh- koBbie koMnOHeHTbl capacitor — koHne HcaTop overall reliability — HaAexHocTb chcTe-
- •Electronics and Microelectronics
- •6Oh MauiHHbi 8. Prediction of pe3yjibTaT0b
- •OGoouufre (Ha aiimHhckom «3biKe) micJjopMauHio o pa3pa6orKc hhTcrpajibHbix cxcm . FloMawHee 3aflaHne
- •H3yMmTe cJioBa h cJioBOcoMeTaHMfl h3 nepBoh nacTh ocHobHoro TeKcTa (1—38).
- •NepeBeflHTe nHCbMeHho co cJiOBapeM bTopyio MacTb ocnoBiioro TeKcTa. BHeayflMTopHaH pa6oTa
- •IlepeBeAhTe cJie/iyiomHe onpeaeJUfTejibHbie 6jiokh cymecTbhTeiibHoro:
- •Entirely new handling
- •TfeyHmTe cnoBa m cnoBocoHeraHMn m3 ocHobHoro TeKcTa.
- •Effort n 1. YcMJine, HanpaxeHHc;
- •Pa6oTa, nporpaMMa in an effort — nbrrancb, cTpeMhCb design effort — kohcTpyKTopcKafl pa- 6oTa
- •IlpObOilHTb carry n nepeHoc
- •2. K03Cj)Cj)huHeHt rated a homhHajibHbift, pacneTHbift rating n HoviMHaJibHoe 3HaMchHe; pacMctHan BeJiHmhHa
- •Benefit s BbiroAa, nojib3a benefit V noMorarb; npMHocMTb iiojil.
- •3Y; BbinrpbiBaTb for the benefit of — juih, paAm without the benefit — He Hcnojib3y«
- •2. NojiynaTb attainment n 1. Aoctmxchmc; 2. Npn o6peTeHMe
- •Manifold adv bo mHoro pa3 manifold a pa3Hoo6pa3Hbift
- •3AMhTepecoBaHHbift concerning prp 0th0cmTejibH0 as far as smth is concerned — mto Ka caeTch
- •Overalls 1. NojiHbift, o6mMft; 2. Npe- AejibHbift
- •CthMyJiHpOBaTb excited a b036yacaeHHbift excitement/; 1. B036yxaeHMe; 2. Cth- Myji
- •Technique/I 1, mcto/I, TexHmMecKMft npneM, 2. Cnoco6, ajiropnTm
- •HanpaBJi«Tb; 3. NepenaBaTb Ha paccMoTpeHHc; 4. HMeTb othoLiie- hHe, KacaTbc«; 5. O6o3HawaTb, mMe- h0b3Tb
- •In a sense — b h3BecThom cMbicnc, b HeKotOpOm othoIlieHhh sensitives 1. MyBctbhTeJibHbift; 2. Npe- uh3hohHblft
- •Encompass V oKpyxaTb; oxBaTbi BaTb; oKyTbiBaTb
- •RipoBepbTe, KaK Bbi 3anoMHmiM cnoBa.
- •3AnHiiiHTe nepeBo#AaHHbix peieBbix 0ipe3k0b:
- •Btopoe 3ahhtiie
- •RipoBepbTe flOMaujHee 3aaaHue.
- •IlpoBepbTc nHCbMemibifi nepeBoa bTopoH Macrw ocHoBiioro TeKcTa.
- •IIpoBepbTe (BbioopoHHo) ynpawHeiiHfl 1.11; 1.12; 1.13; 1.15; 1.16.
- •TeKct 1.1 b
- •Electronic Devices
- •Microelectronics
- •TeKct 1.2 b
- •IlepeBeAhTe tckct ycTho (c JiHcTa). Pa6oTa BbinoJiHfleTch nofl pyKobo/icTbom npeno;ia- BaTe.M The Future of iCs
- •YhmTecb aHhotMpoBaTb m pecJjepupoBaTb.
- •Integrated Circuits
- •YhmTecb roBopuTb.
- •The performance benefit stems from ...
- •BHeayAmTopHafl pa6oTa
- •Ri0flr0t0BbTecb k kohTpo/ibHoMy nepeBoay ocHobHoro TeKcTa
- •TeKct 1.4 b
- •Integrated Circuit Development
- •TeKct 1.5 b
- •Integrated Circuits: a Brief History
- •TpeTbE 3ahhthe KoHTporib m3yneHHoro MaTepnana
- •Electron beam changes physical characteristics of exposed resistor so that after chemical etching pattern is left on clear substrate.
- •The principles involve preparing detailed plans and careful monitoring.
- •Integrated Electronics
- •KoHTpo/ib yMeHkm nucbMeHhOro nepeBOfla.
- •Getting Nano wired
- •KoHTponb yMeHma aHHcroipoBaTb m pec£epnpoBaTb. TeKct 1.3 c
- •IIpo*Hfrattre tckct h Kpaixo Hxioxofre ero coaepxaHHe ua pyccKom aibiKe. QjamaBbTe ero.
- •TeKct 1.4 c
- •Komponb yMeHWi aHHcmipoBaTb h pecfrepupoBaTb. TeKct 1.3 c
- •I IpoHHrattre tckct h Kpaixo Hxioaorre ero cojepKaHHe Ha pyccKom jowxe. OwJiaBbTe ero.
- •TeKct 1.4 c
- •OGcyujiTe npo&netvibi Hcn0Jib30BaHh*I nojiynpoBoahhkob.
- •06Cyzurre npewviymecTBa mhKpoarceKTpOhhkh.
- •Iiepboe 3ahm I me
- •YhmTecb nepeBoamTb.
- •03HaKoMbTecb c thiisimh npaBoro onpe/ieJieHHfl cymecTbhTejibHoro h nepeBe/mTe hx (BbinOjiHfleTCfl ycTHo).
- •One, ones
- •Ochobhom tekct
- •Semiconducting Materials Engineering Progress
- •IIpoBepbTe, KaK Bbi 3ariOmhMnM cnoBa nepBoti nacTm ochob- hofo TeKcTa.
- •Trace V (trace n — one#)
- •FloMaLuHee 3aAaHMe
- •Onpe/iejiHTe 3h3mchhh cjiob one, ones, that, those h it, onupaflcb Ha cpe/icTBa hx BbisiBJieHhh, h nepeBeAhTe npezuioxeHHn: one, ones
- •That, those
- •IlepeBezurre nHCbMchHo co cjioBapeM bTopyio wacTb ocHobHoro Tettcra (BpeMfl nepeBo;ia — 60 mmhjtt).
- •H3yHmTe cnoBa n cnoBOconeTaHMfl ocHobHoro TeKcTa.
- •6BiTb xapaKTepnoft nepToft
- •Enhance V noBbiiuaTb; yBcJiMhm- BaTb; ycMJiMBaTb
- •Determine V 1, onpe.NejiflTb, ycTa- HaBJiMBaTb; 2. PcrnaTb; 3.3acTaBJiHTb;
- •OrpaHmmmBaTb
- •BblHhcJieHHbltt
- •2, Pa3.NMwaTb appreciably adv 3aMeTHo, 3Ha»jHTejib- ho
- •Device-related — cBfl3aHHbitt c ycT- pOflCtbom
- •NpMhhMaTb ynacTHe, coTpyAhh- naTb
- •Turn V 1. O6pamaTbc«, npwGeraTb;
- •BpamaTbCJi; 3. Cocpe/ioTohmBaTb, HanpaBjwTb; 4. NpHbohhTb b KaKoe-ji. CoctojihHe
- •OwepeiiHocTb in turn — no o4epe;m
- •Immensely advoneub, 4pe3BbiliaMHo
- •Pe3ioMHpoBaTb
- •Wafer n 1. NojiynpoBOiiHh koBan njiacTmHa; 2. NjiacThhKa; njiaTa; no;I /ioacKa; 3. KpncTajui, mc
- •Overlayer n noKpbiTHe, bcpxhhh
- •YuejibHbiR specifically adv 1. Oco6eHHo; 2. Tom- ho; 3. B HaCthoctm
- •IIpoBepbTe, KaK Bbi 3anoMhMnM c/ioBa.
- •Silicon and Germanium
- •3. YnMTecb aHhoTnpoBaTb m pecfrepupoBaTb. TeKct 2.1 c
- •Semiconductors as Materials
- •BHeayflMTopHan pa6oTa
- •AKuenTopHaa npHMecb, jTempyioiJuaH npHMecb, npHMecb, Ha- hochMaa na n0BepxH0cTb n0Jiynp0b0hhhKa
- •TpeTbE 3ahhthe KoHTponb m3yHeHHoro MaTepiiana
- •At the turn of the 18th century nobody knew of semiconductors.
- •The average wire length can be estimated by a very useful statistical formula.
- •IlepeBeAhTe tckct ycTHo c jiHcTa. 03arJiaBbTe tckct. 3naweHne bUjiciieHHbix cjiob bu
- •Materials Requirements
- •KompoJib yMeHMfl nepeBoamTb nMCbMeHho co cnoBapeM. TeKct 2.3 c
- •Major Steps in the Growth of Computer Technology
- •KoHTponb yMeHmh aHhoTnpoBaTb m pecfcepMpoBaTb. TeKct 2.4 c
- •Made in Space
- •In order to launch full-scale industrial production of mono- crystalline semiconductors, bioactive preparations and other sub'
- •TeKct 2.5 c
- •Photoresists
- •TeKct 2.6 c
- •Ceramic-to-Metal Seals
- •KoHTponb yMeHmh roBopMTb.
- •NEpboe 3ahhthe
- •CjioBa HcxoAHoro ypoBhh h h3 npeAUiecTByioumx pa3/ieJiOb
- •Passive
- •Ochobhom tekct
- •Problems in Microelectronic Circuit Technology
- •Let us see what a film technique is like.
- •In this way many identical thin-film devices can be made on a single sheet of material, which then are cut apart to yield individual devices.
- •Increasing interest in submicron layer now poses new problems. New developments in materials are believed to be due70 to new manufacturing forms and vice versa.
- •Integrated circuit technology is evolving so rapidly that even a period as short as six months can produce a significant change.
- •3. IIpoBepbTe, KaK Bbi 3anoMhMrm cnoBa.
- •FloMaiuHee 3aaaHne
- •BHeayflMTopHan pa6oTa
- •Step n 1. Uiar; 2. Mepa; 3. CTyneHb,
- •Delineate V ycTaHaBjwBaTb pa3Mep, oMepiaHmJi
- •Multiplicity n 1. MHoroMhcJicHHocTb; 2. Pa3Hoo6pa3Mc; 3. C/ioxHocTb multiplier n 1. MHoxmejib; 2. Iio6a-
- •Btopoe 3ahhthe Pa6oTa b ayAhTopnn
- •Tungsten
- •YhmTecb aHhotMpoBaTb m pecfrepMpoBaTb tckct. TeKct 3.3 b
- •513BIKe. IIpOBepbTe npaBhjIbHocTb IlOhhMaHHfl TeKcTa.
- •Dry Process Technology
- •BHeayflHTopHan pa6oTa
- •TeKct 3.4 b
- •High Pressure Oxidation of Silicon
- •NpoBepbTe, KaK Bbi yMeeTe aHhoTnpoBaTb mjim pecJjepupoBaTb
- •TeKct 3.6 b
- •Molecular Electronics
- •LlpoBepbTe, KaK Bbi cyMeeTe nepeBecTm flai-moe ctmxotbopohiio. TeKct 3.7 b
- •Chip Fabrication
- •TpeTbE 3ahhthe
- •TeKct 3.8 b
- •Submicron Technology
- •TeKct 3.9 c
- •Optical Lithography
- •TeKct 3.10 c
- •Iiepboe 3aHflThe
- •RipoBepbTe, 3HaeTe jim Bbi cjieAytoujiie cjioBa.
- •OpHHaCtMe I — 06ct0flTe;ibCtb0 1
- •IlpHMaCtHe II — 06cT0hTeJIbCtb0 1
- •In obtaining the possibility of change the designer can face ...
- •HapeMmh tHna economically — 06cT0JrrejibCtb0
- •Ochobhom tekct
- •Viewed72 in the contemporary scene and historical perspective the computer stimulates man.
- •RipoBepbTe, KaK Bbi 3anoMhm/iM cnoBa nepBort nacTm ochob- Horo TeKcTa.
- •FloMauiHee 3aAamie
- •BHeayflMTopHan pa6oTa
- •YhmTecb nepeBoamTb.
- •H3yHmTe cnOBa m cnoBOconeTaHmw ochobhoto TeKcTa.
- •Count V 1. ChhTaTb, noncHmTbiBaTb, 2. NojiaraTbca Ha
- •Monitor V l kohTpojinpoBaTb, Ha- 6jiKxnaTb; 2. YnpaBJiflTb
- •Incorporation n o6'be£hHeHMe, Kop nopauHh
- •NpMhmMaTb ynacTMe share characteristics — hMeTb o6mne xapaKTepncTmkm
- •Unified o ennHoo6pa3HbiR
- •AnnpoKcmMaiiMh
- •XchMblil
- •Interface vehicle — 3KpaHoruiaH
- •IlepeBeitfn'e nHCbMchho co cjioeapeM bTopyro nacTl ocHobHoro TeKcTa (II). Bpe- mh nepeBQaa — 60 mhHyr.
- •YsMTecb KpaTKo m3naraTb TeKct.
- •RipoBepbTe nHCbMcunuH nepeBo.A bTopofi wacTh ocHobHoro TeKcTa (II).
- •IIpoBepbTe, KaK Bbi 3anoMhh;m cjioBa (Bbi6opowHo).
- •YhmTecb nepeBOflMTb.
- •Old and New Concepts
- •TeKct 4.2 b
- •Personal Computer
- •YhmTecb aHHompoBaTb m pecJjepupoBaTb. TeKct 4.3 b
- •Computer Trends
- •4. YhmTeCb rObOpMTb.
- •BHeayflMTopHan pa6oTa
- •RipoBepbTe, 3HaeTe jim Bbi c/iOBa.
- •IIpoBepbTe, KaK Bbi yMeeTe onepupoBaTb rpaMMaTmHecKmmm m neKcmHecKmmm flB/ieHMflMm ripn nepeBoAe. TeKct 4.4 b
- •TeKct 4.5 b
- •Electronic Impact
- •Parallelism
- •TpeTbE 3ahhthe KoHTpojib m3yseHHoro MaTepuana
- •KoHTponb cjiob b cJlObocoHeTaHMflX.
- •The above considerations also lead to another important conclusion.
- •Considerable experiments with hydrogen have found its use as fuel.
- •KoHTponb yMeHMfl nepeBOflMTb. Tckct 4.1 c
- •TeKct 4.2 c
- •Buffering
- •TeKct 4.3 c
- •Automakers Going Digital
- •KoHTponb yMeHmr 3hhotmpoBaTb m pecfjepMpoBaTb.
- •TeKct 4.5 c
- •Electronic Games
- •TeKct 4.6 c
- •Addictive Games?
- •KoHTponb yMeHMfi roBopnTb. TeKct 4.7 c
- •Electronic Games — a Summary of the Risks
- •TeKct 4.8 c
- •Effects on Health
- •NEpboe 3ahhthe Pa6oTa b ayflMTopmi
- •LlpoBepbTe, 3HaeTe nn Bbi cneAyK)mne cnoBa.
- •Improve V enable V alter V distribute V capacity n
- •YhmTecb nepeBOflMTb.
- •(BbipaxaeT 6oJibiuyio creneHb Heo6xo.Hhmocth — Kojuauda,
- •(BbipawaeT ooyc.IoB-ieHHyjo hjih BbHiyHtaeitHyio neodxoduMocntb)
- •Do you have to assume a model of a particular type?
- •It is necessary to develop a new model.
- •It was necessary to come back to the history.
- •It is necessary to examine the factors.
- •It is true that... Hccomhchho. It is certain... Hccomhchho ... It is beyond doubt that... Hccomhchho .. YBepeHiiocTb:
- •YTomieHHe:
- •BepoHtHocTb (h02m03kh0, eeponmHoy.
- •It is believed that... It is supposed that ...
- •Ochobhom tekct
- •Capacitor n (KomieHcaTop), capacity n
- •Operate V, manipulate V 5. Receive V, achieve V
- •1. YhmTecb nepeBoamTb.
- •M3yHmTe cnoBa n cnoBocoHeTahma ochobhoj-o TeKcTa.
- •Data n pi /iaHHbie, sing, datum process data — ziaHHbie o6pa6oTkh
- •Exact a tomHbift
- •ABapnfl; 3. 0tKa3, nojioMKa break through — npopbiBaTb(cfl)
- •ChhXpOhh3aUHfl locking device — ycTpoftcTBo 6jiokh- pOBaHHfl lockword — napojib 6jiokhpobkh lock V 1. 6jioKHpoBaTb, 3annpaTb; 2. (j)mkcMpOBaTb; 3. ChhXpOhh3h poBaTb
- •NpcflCTaBJiflTb (otmct); 5. MhTaTb JieKuhk)
- •Challenge n 1. 3anpoc, Tpe6oBaHHe; 2. Npo6jieMa, coMHeHHe challenge V 1. 6pocaTb bw30b; 2. Co-
- •Pervade V 1. OxBaThTb; 2. NpoHhKaTb pervasion n 1. OxBaT; 2. NpoHhkhoBc-
- •NpoHmKajomnW; 3. BceoGTjeMjno- uiHfi
- •IIpoBepbTe, KaK Bbi 3anoMhm/iM c/iOBa.
- •TeKct 5.2 b
- •Some Definitions They Use
- •TeKct 5.3 b
- •Is There an End to the Computer Race?
- •YsMTecb roBopuTb.
- •TeKct 5.4 b
- •A Microprocessor
- •IIoflroToBbTe BbicTynjieHHe (pacc4hTannoe Ha a»e mhHjTbi) no TeMe “The Microprocessor Has Altered the Architecture of Modern Computer Systems’1.
- •YsMTecb nepeBOflMTb.
- •Software
- •YsmTeCb rObOpMTb.
- •TpeTbE 3ahhthe KoHTponb m3yneHHoro MaTepnana
- •KoHTponb cjiob b cjiobocoHeTaHHflX.
- •5.18. IlepeBeAhTe, o6pama« bhhMaHMe Ha k0hTeKcTyaJibH0e sHaneHHe cjiob set, time, times:
- •Industrial research in materials faces a different set of problems.
- •KoHTponb yMeHMfl nepeBOflMTb.
- •IlepeBchKre tckct ycnio c jiHcra. 3HaHemiH BbwejieHHbtx cjiob Bbi nofiMere h3 KowreKcra Modular Controllers for Future Engines
- •Computer Networks
- •What Is the Internet?
- •KoHTponb yMeHMfl roBopnTb.
- •Services and Resources of the Internet
- •Iiepboe 3ahhthe
- •CjlOBa, hMeiOmHe oahHaKoBblfi Kopenb c pyCckhmu cji0b3mh
- •YhmTecb nepeBOflMTb.
- •Ochobhom tekct
- •New Developments in Electronic Memories
- •LlpoBepbTe, KaK Bbi 3anoMhm/iM cnoBa.
- •AoMawHee 3aAaHMe
- •IloBTopifTe kohcTpykuhh, b kotopux Heo6xo/iH!vto Hcn0Jib30BaTb rpaMMaThMec- Kyio hhBepChio, h BbinOjihhTe ynpavKhchHfl.
- •HanniiiHTe KpaTKyio aHiioTauHio k TeKcrry.
- •BHeayAmTopHan pa6oTa
- •YhmTecb nepeBoamTb.
- •M3ynnTe cnoBa m cnoBOconeTaHMn ocHobHoro TeKcTa.
- •3KcnJiyaTauHohHbift; 3. One- paThbHbifi; 4. TeKymnft operate V 1. Pa6oTaTb, AewcTboBaTb,
- •2 Cmhcji; 3. 3HaiieHHe, BaxHocTb significant a 3HaHhMbifi, cymecTbch
- •HeMHoro
- •Cjior MaiiiHhHoro cAoBa Kbyte n khAo6afiT, k6attT (1024 6aflT)
- •3AnycK; 5. HanpaBjieHne, Ten- achiimh
- •2. NpeAcTaBjiaioiuMtt representative n 1. STajioH, o6pa3cu; 2. NpencTaBhTejib
- •2. BbiCTynaTb addressing n anpecauHh, cnoco6 an- pecaiiHh
- •Assign V 1. Ha3HawaTb; onpenejiHTb: 2. 3aBepmaTb
- •Coo6meHMe
- •Fit V 1. NOuxOilHTb, cootBeTctbo- BaTb; non6HpaTb; 2 ycraHaBJiH BaTb, co6npaTb; 3. MohtHpoBaTb
- •Core memory — naM«Tb Ha MarHht- HblX cCpAeMhhKaX
- •String (strung) V 1 HaTnrHBaTb; 2. Cbh3bIBaTb
- •03HaKoMbTecb c TepMmHonorMeM.
- •Btopoe 3ah5ithe
- •SyncFiash Memory Benefits
- •IlepeBeflHTe tckct ycmo c JiMcra. Pafwra BbinoJiHfleTCfl noa pyKoboactbom iipeno/ia- BaTeJiH.
- •Information Processing
- •YsMTecb aHhotMpoBaTb m pec£epnpoBaTb.
- •Large-scale Integration: Memories
- •YhmTeCb tobOpMTb.
- •BHeayfltiTopHan pa6oTa
- •RioflroToBbTecb k kohTponbHoMy nepeBoAy ocHobHoro TeKcTa.
- •YnHTecb nepeBOflMTb.
- •YsMTecb aHhotMpoBaTb h pec£epnpoBaTb.
- •What is the read-mostly memory?
- •Which variations of read-mostly memories are referred to? The Read-only Memory
- •YhmTeCb rObOpMTb.
- •TpeTbE 3ahhthe
- •IlepeBeziHTe tckct ycnio c Jiwcra.
- •Cache Memory
- •IIpoMhTattTe TeKct. CKaaoue, hto bm ymaJiH o ccd, a ferrite core memory, the bubble memory. Further Memory Developments
- •7. KoHTponb yMeHMfl rObOpMTb.
- •TeKct 6.4 c Random Access Memory
- •TeKct 6.5 c Molecules Get Wired
- •TeKct 6.6 c Quantum Computers
- •Jack Kilby Receives Nobel Prize
- •The Chip Has Changed the World
- •IlepcBeiiHTe tckct hHcbMeiiuo co cjioBapeM. Bpervia nepcBona — 15 mhiijt. Optical Lithography Used to Make Smallest Working Device — with 80 nm Features
- •IlpoHhTaftTe TeKct h Kpanco Hxioaorre ero co/iepKaHHe Ha aHciHhckom sBbuce (5 mhHyr). The Flash Memory Device
- •IlpoHhTaftTe TeKct h KpaTko h3JiowHTe ero co/iepxaHHe Ha aHHiHftcKom sttbike (10 mhHyr). Electron Beam Lithography
- •IlHCbMeHho nepeBe/uiTe tckct co cjiOBapeM (10 mhhjt). Lithography: Basics
- •IlHCbMeHho nepeBeAhTe tckct co cjiOBapeM (15 mhhjt). The Light Fantastic
- •IlHCbMeHHo nepeBeAhTe tckct co cjioBapcM (20 mhhjt). Computer Chips
- •The Key Innovation
- •Text 11
- •The Electronics Revolution
- •The Tempo of the Electronics Revolution
- •Automakers Going Digital
- •3HctOpHo-TpaH3mctOpHa« jiornKa,
- •Byx Mai™ AnaToJibeBHa,
- •3AnueBa JlioAmmJia riaa/iObHa mhkp03jiektp0hhka: hactOflLlJee h byZiyilJee
- •1. As far as I know... 5. Intensive efforts have been devoted to...
- •To my knowledge ... 6. The efforts continue in the direction of...
- •For all I know... 7. It appears that the (process) will...
- •10 03HaKoMbTeCb c TepMhHaMh nepBoh HaCth ochobhOrO TeKcTa.
Electronics and Microelectronics
The intensive effort1 of electronics to increase the reliability and performance3 of its products while reducing their size and cost ha$ led to the results that hardly anyone would have dared (3d. ocMejimK ch) to predict4.
The evolution of electronic technology is sometimes called a rev olution. True, there has been a real revolution: a quantitative5 change in technology has given rise to qualitative change in human capabilj. ties6. There appeared smaller and smaller electronic components per forming increasingly complex electronic functions at ever higher speeds
It all began with the development of the transistor.
Prior to7 the invention of the transistor in 1947, its function in an electronic circuit could be performed only by a vacuum tube.
The first transistors had no striking advantage in size over the small est tubes and they were more costly. The one great advantage the tran sistor had over the best vacuum tubes was exceedingly8 low power con sumption. Besides they promised greater reliability and longer life However, it took years to demonstrate other transistor advantages.
With the invention of the transistor all essential circuit functions could be carried out9 inside solid10 bodies. The goal3 of creating electronic cir cuits with entirely solid-state components had finally been realized12.
However, early transistors were actually enormous on the scale1 at which electronic events14 take place. They could respond15 at a rate! of a few million times a second; this was fast enough to serve in radio and hearing-aid (cjiyxoBofi annapaT) circuits but far below17 the speed needed for high-speed computers or for microwave communication systems. Besides, the early transistors were slow.
The effort was to reduce the size of transistors so that they could operate at higher speeds. That gave rise to the whole technology d microelectronics.
A microelectronic technology has shrunk18 transistors and otltf* circuit elements to dimensions19 almost invisible to unaided eye (> HeBoopyaceHHbiii rjia3).
The point20 of this extraordinary miniaturization is not so mud1 to make circuits small perse (.nam. caMH no ce6e) as to make circuit capable of performing electronic functions at extremely high spee$
It is known that the speed of response depends primarily on the size of jansistor: the smaller the transistor, the faster it is.
1 The performance benefit21 resulting from microelectronics stems22
directly from the reduction of distances between circuit components. If a circuit is to operate a few billion times a second the conductors that tie the circuit together must be measured in fractions of an inch. The microelectronics technology makes close coupling23 attainable24.
During the past decade the performance of electronic systems increased manifold25 by the use of ever larger numbers of components and they continue to evolve. Modern scientific and business computers, electronic switching26 systems contain more than a million components.
The problem of handling27 many discrete electronic devices began to concern28 the scientists as early as 1950. The overall29 reliability of the electronic system is related to the number of individual components.
A more serious shortcoming30 was that it was once the universal practice to manufacture31 each of the components separately and then assemble32 the complete device by wiring33 the components together with metallic conductors. It was no good (3d. 3to He noMorJio): the more components and interactions, the less reliable the system.
What ultimately34 provided the solution was the semiconductor integrated circuit, the concept35 of which had begun to take shape a few years after the invention of the transistor. Roughly (npH6jm3H- TejibHo) between 1960 and 1963, a new circuit technology became a reality. It was microelectronics development that solved the problem.
The advent36 of microelectronic circuits has not, for the most part, changed the nature of the basic functional units: microelectronic devices were still made up of transistors, resistors, capacitors, and similar components. The major difference is that all these elements and their uiterconnections are now fabricated37 on a single substrate38 in a sin- series of operations.
tions have been given over to circuit elements that perform best: tran- . sistors. Several kinds of microelectronic transistors have been devej . oped, and for each of them families of associated circuit elements a ■ d circuit patterns 43 have evolved.
The bipolar transistor was invented in 1948 by John Bardeen Walter H. Brattain and William Shockley ofthe Bell Telephone Labo. ratories. In bipolar transistors charge carriers ofboth polarities are in. volved 44 in their operation. They are also known as junction 45 transis - tors. The npn and pnp transistors make up the class of devices calle,- junction transistors.
A second kind of transistor was actually conceived 46 almost 2* years before the bipolar devices, but its fabrication in quantity did n ■ become practical until the early 1960’s. This is field-effect transisto . The one that is common in microelectronics is the metal-oxide-sem. conductor ficld-effect transistor. The term refers 47 to the three materials employed in its construction and is abbreviated MOSFET (me - al-oride-semiconductor field-effect transistor).
The two basic types of transistor, bipolar and MOSFET, divide microelectronic circuits into two large families. Today the greatest den sity ofcircuit elements per. chip 48 can be achieved with the newer MOSFET technology.
An individual integrated circuit ( 1C) on a chip now can embraced. B^KmaTb) more electronic elements than most complex pieces o electronic equipment that could be built in 1950.
In the first 15 years since the inception (3d. noa^eHHe) of inte- - grated circuits, the number oftransistors that could be placed on a singl ' chip has doubled every year. The 1980 state of art49 is about 70K densit) per chip. Nowadays we can put millions of transistors on a single cl-tlp
The fust generations ofthe commercially produced microelectronic devices are now refened to assmall-scale integrated circuits (SSI). The' included a few gates 5°. The circuitry defining 5* a logic array52 had tc be provided by external conductors.
Devices with more than about 1 0 gates on a chip but fewer thail about 200 are medium-scale integrated circuits (MSI). The uppe(j boundary 53 of medium-scale integrated circuits technology is marked by chips that contain a complete arithmetic and logic unit (ALU). Th1' unit accepts as inputs two operands and can perform any one of a doZ en -or so operations on them. The operations include addition, subtraction, comparison, logical “and” and ‘‘or” and shifting 55 one bit to lhe left or right.
A large-scale integrated circuit (LSI) contains tens of thousands of elements, yet each element is so small that the complete circuit is typically less than a quarter of an inch on a side.
Integrated circuits are evolving from large-scale to very-large-scale (VLS 1) and wafer-scale integration (WS1).
The change in scale can be measured by counting the number of transistors that can b e fitted56 onto a chip.
Continued evolution of the microcomputer will demand further inaeases in packing 57 density.
There appeared a new mode 58 of integrated circuits, microwave integrated circuits. In broadest sense 59, a microwave integrated circuit is any combination of circuit functions which are packed together without a user accessible 60 interface.
The evolution of microwave integrated circuits must begin with the development of plana^1 transmission lines 62.
As we moved into the 1970’s, stripline and microstrip assemblies became commonplace and accepted as the everyday method ofbuild- ing microwave integrated circuits. N ew forms oftransmi^ion lines were °n the horizon, however. In 1974 new integrated-circuit components in a transmission line called fineline appeared. Other more exotic techniques, such as dielectric waveguide 63 integrated circuits emerge 64. Major eff°rts cunently are directcd at such areas as image guide, co-pla- narwaveguide, fineline and dielectric waveguide, all with emphasis on techniques which can be applied to monolithic integrated circuits. These monolithic circuits encompass 65 all ofthe traditional microwave functions of analog circuits as well as new digital applications.
Mkroelectronic technique will continue to displace other modes. the limit of optical resolution 66 is now being reached, new lithographic and fabrication techniques will be required. Circuit patterns have _to be formed with radiation having wavelength shorter than
ilse oflight, and fabrication techniques capable ofgreater definition wu1 be needed.
tro • Electronics has extended 67 man’s intellectual power. Microelec- nics extends that power still further.
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