[. The number of circuit components; the use of low gas velocities

2. the achievement of much less high temperature

3. the advantage of carefully prepared silicon surfaces

4. Rapidly developing technology of smaller electronic components

N +of+N +of+N

1. a description of the properties of circuit elements

2. the theme of a great number of publications

3. a lot of the advantages of these technologies

... N + Adj (npaeoe onpedeAeHue)

1. with relative dielectric constant less than 3.5.; with thermal con­ductivity greater than 150 W/mK; lead counts greater than 100 will be...

2. the instrument available can provide...; each substance present in the liquid can boil off as a gas; wheel brakes common to most

vehicles are ...

... N^l + Ving+ N²/N + Ving + N²

1. A RAM module holding 40 components was described at the Elec­tronic Components Conference.

2. Wnds are the dominant force disturbing many engineering con­structions.

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A substractive technology used for limited production runs em­ploys nitric acid.

The changes broughi about by the dry plasma processing offer a technological leap for the PCB industry.

• Circuits developed in the new project had two layers.

The results achieved showed 30-micron lines.

... N¹... + Vto + V¹

1. The increased complexity of the designs to be implemented will be

2. The information to be stored stems from the journal.

3. A number of different technologies to be used generate this aeria image.

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1. The approach that uses thin-film metallization and dielectric tech­nology is a new one.

2. A science that deals with the phenomena of matter and energy [ physics.

3. The computer compares the information i t receives with other in formation it stores.

4. The designer considers the size the chip has.

5. There is a transition temperature above which the superconduct ing properties of a material are lost.

6. 

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   There are a number of areas in which lithography simulation tool are valuable.

7. The profound long-term impact of electronics on the design of cars we drive is not easy to fully comprehend, g. A 16-chip package fabricated by Du Font has sputtered metal sig­nal layers separated by open-on-polymide.

5. IlepeBeiUfre cjie^yiomHe npejomoxeHHfl.

1. Microelectronics faces many problems.

2. Mark the temperature increase.

3. The lense focuses the beam on a small spot on the object.

4. The paper presents interesting problems.

OchobhOfi tekct

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electronic technology — TexHOJiorHfl

3JickTpOhHbIx npM60p0b solid-state components — tBepflOTejib- Hbic koMnOhchTbl, nOJiynpObOilHh- koBbie koMnOHeHTbl capacitor — koHne HcaTop overall reliability — HaAexHocTb chcTe-

Mbl

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urtcgrated circuit — HHTcrpajibHaa cxcMa ^suhstrate — noiuioacKa charge carrier — HocnTcjib 3apn.ua ^ctal-oxide semiconductor — nojiynpo- ^Bo-5hhk MOn cTpyKTypu

^lfl-effect transistor — TpaH3MCTop c HOJleBLlM 3(J)(J)eKTOM

^ KpHcra^ji; MHTerpanbHaa cxeMa ^all-scale integrated circuit (SSI) -

^HTerpajTbHan cxeMa c Majiott CTene- ^Hb|o HHTerpauMM

medium-scale integrated circuit (MSI) — MHTerpaJTbHaa cxeMa co cpexiHeft CTe- neHbio HHTerpauMM, HC large-scale integrated circuit (LSI) — MHTerpajibHaa cxeMa c 6oJibiuofi CTe- neHbio HHTerpauMM, 6ojibLuasi MHTe- rpajibHaa cxeMa, BPIC very-large-scale integrated circuit (VLSI) — HHTerpajibHaa cxeMa co CBepx- 6oJibiiiofi cTeneHbio MHTerpauMH, CBepx6o^buia« MHTerpajibHaH cxeMa, CEHC

circuit pattern - pMcyHOK cxeMbi, cxe­Ma

operand — onepana

wafer-scale — pa3Mep nojuioacKH, njia- CTMHKM