SMD / Каталог SMD_2
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TM
Part Numbering System
Substituting Silicon Die
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Waffle Pack |
MD 6x6-WP2 |
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Options: Back Ground |
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Sawn |
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Wafer |
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Mirror |
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Bulk |
MD 6x6-B |
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Options |
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Mirror |
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MD = Mirrored Die |
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or Etched |
Application = |
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ED = Etched Die |
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General Purpose |
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Etched |
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Waffle Pack |
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ED6x6-WP2 |
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Options |
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Sawn |
Plating = C |
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DC = Yes |
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Bulk |
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MD 6x6-B |
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Options |
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Suffix Codes:
Pack: Normally in 2" Square Waffle Packs
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©2003 TopLine. All Rights Reserved. Rev. 2/03 |
61 |
TM
Part Numbering System
BGA
Ball Grid Array
BGA |
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225 T |
1.5 |
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DEVICE |
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NBR. BALLS |
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PITCH (MM) |
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BGA = Plastic |
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1.5 |
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CBGA = Ceramic |
1.27 |
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SBGA = Heat Spreader |
1.00 |
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CSP = Chip Scale |
.8 |
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PACKAGING |
.75 |
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.5 |
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T = Trays |
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E7A = 7” Tape & Reel |
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E13A = 13” Tape & Reel |
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X = Single Pack |
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Ball
Option - DC15 - D
DAISY CHAIN
Refers to a drawing number
CODE
CBGA
Blank = Sn10/Pb90 Standard
High Temperature
L = Sn62/Pb34/Ag2
Low Temperature Option
LEAD FREE (NO Pb)
F = Sn96.5/Ag3.5
C = Sn96.3/Ag3.2/Cu0.5
or Sn95.5/Ag4.0/Cu0.5
BGA, SBGA, eBGA, LBGA
Blank = Sn63 Standard
SOLDER BALL
Blank = Unspecified
D = Die
62 |
©2003 TopLine. All Rights Reserved. Rev. 2/03 |
TM
Part Numbering System
Substituting BGA
BGA388T1.27-ISO |
BGA388T1.27-DC72 |
BGA388T1.27-D72D |
Tray
Pack
Ball = Sn63/Pb37 |
Plating = Sn63/Pb37 |
Plating = Sn63/Pb37 |
DC = Isolated |
DC = Yes |
DC = Yes |
DIE = Not Specified DIE= Not Specified Die= Yes
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SOIC Body Width |
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Reel |
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BGA388E13A1.27-ISO |
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BGA388E13A1.27-DC72 |
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BGA388E13A1.27-D72D |
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BGA |
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No |
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CBGA |
Lead |
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eBGA |
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LBGA |
Free |
Application = |
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Application = |
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Application = |
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SBGA |
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Temperature Profile |
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General Purpose |
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Continuity Test |
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TBGA |
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and Continuity Test |
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CSP |
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Yes |
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BGA388T1.27C-ISO |
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BGA388T1.27C-DC72 |
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BGA388T1.27C-DC72-D |
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Tray
Pack
Plating = -F, or C |
Plating = -F, or C |
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Plating = -F or C |
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DC = No |
DC = Yes |
DIE = |
DC = Yes |
DIE |
DIE = Not Specified |
Not Specified |
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= Yes |
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Reel |
BGA388E13A1.27C-ISO |
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BGA388E13A1.27C-DC72 |
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BGA388E13A1.27C-DC72D |
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Cheaper |
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More Expensive |
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Suffix Codes: |
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"DIE" is sometimes abbreviated to "D". |
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"DC" = Daisy Chain (SEE DRAWING) |
"ISO"= Isoloated connections |
"BUS" = All Leads Connected. |
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Lead Free Plating: F = Sn96.5/Ag3.5 |
C = Sn95.6/Ag4.0/Cu0.5 |
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Pack: "T" = TRAYS, E13A = 13" Reels, E7A = 7" Reel (special), |
"X" = mini Pack Bags |
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For CBGA Only: Add letter "L" for low temperature ball. |
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©2003 TopLine. All Rights Reserved. Rev. 2/03 |
63 |
TM
Part Numbering System
CBGA
Ceramic Ball Grid Array
1.7mm max height
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Ball |
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CBGA |
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625 T |
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1.27 Option |
- |
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DC61 |
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DEVICE |
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NBR. BALLS |
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PITCH (MM) |
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DAISY CHAIN |
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CBGA = Ceramic |
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1.27 |
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Refers to a |
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drawing number |
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CODE |
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PACKAGING
Blank = Sn10/Pb90 Standard
High Temperature
T = Trays L = Sn62/Pb36/Ag2 Low Temperature
X = Single Pack
64 |
©2003 TopLine. All Rights Reserved. Rev. 2/03 |
TM
Part Numbering System
Substituting CBGA
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CBGA256T1.27-ISO |
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CBGA256T1.27-DC61 |
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CBGA256T1.27-BUS |
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Tray |
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Ball = Sn10/Pb90 |
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Ball = Sn10/Pb90 |
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Ball = Sn10/Pb90 |
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DC = Isolated |
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DC = Yes |
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DC = Bus |
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Pack |
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DIE= Not Specified |
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Die=Not Specified |
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DIE = Not Specified |
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High |
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Temp |
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Application = |
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Series |
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Application = |
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Application = |
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Temperature Profile |
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CBGA |
Rating |
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General Purpose |
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Continuity Test |
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and Continuity Test |
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Low
CBGA256T1.27L-ISO |
CBGA256T1.27L-DC61 |
CBGA256T1.27L-DC61 |
Tray
Pack
Ball = Sn62/Pb36/Ag2.0 |
Ball = Sn62/Pb36/Ag2.0 |
Ball = Sn62/Pb36/Ag2.0 |
DC = No |
DC = Yes |
DC = Bus |
DIE = Not Specified |
Die = Not Specified |
Die = Not Specified |
Suffix Codes:
"DC" = Daisy Chain (SEE DRAWING) "ISO"= Isoloated connections "BUS" = All Leads Connected.
Lead Free Plating: Blank = Sn10/Pb90 (standard High Temp) |
L = Sn62/Pb36/Ag2.0 (Low Temp) |
Pack: "T" = TRAYS "X" = mini Pack Bags |
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©2003 TopLine. All Rights Reserved. Rev. 2/03 |
65 |
TM
Part Numbering System
LGA
Land Grid Array
CLGA |
625 |
T |
1.27 |
- DC61 |
A |
3 |
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Substrate |
I/O |
Packaging |
Pitch |
Circuit |
Options |
Substrate |
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Ceramic |
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T = Trays |
mm |
DC = Daisy Chain Pads |
Blank = Standard for Socket |
Blank = 1.0mm thick (Standard) |
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BUS = All Pads Shorted |
E = Raised Pad 5mil |
2 |
= 1.5mm thick |
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ISO = All Pads Isolated |
B = Ball Attach by Customer |
3 |
= 3mm thick |
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X = Customer Spec |
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66 |
©2003 TopLine. All Rights Reserved. Rev. 2/03 |
TM
Part Numbering System
Substituting LGA
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PC Board |
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LGA625T1.27-ISO-E |
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LGA625T1.27-DC61-E |
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LGA625T1.27-DC61X |
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Terminations = Sn63/Pb37 |
Plating = Sn63/Pb37 |
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Plating = Sn63/Pb37 |
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DC = Isolated |
DC = Yes |
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DC = Yes |
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Mount |
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DIE = Not Specified |
DIE= Not Specified |
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Customer spec |
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mount |
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CLGA625T1.27-ISO |
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CLGA625T1.27-DC61 |
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CLGA625T1.27-DC61X |
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Socket |
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LGA |
Application |
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CLGA |
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Application = |
Application = |
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Application = |
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Countinuity Test |
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General Purpose |
Continuity Test |
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Customer Specific Application |
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Ball Attach by Customer |
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Organic |
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LGA625T1.27-ISO-B |
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LGA625T1.27-DC61-B |
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LGA625T1.27-DC61X |
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Plating = -Sn63 or Gold |
Plating = Sn63 or Gold |
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Plating = -Sn63 or Gold |
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Ball |
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DC = No |
DC = Yes |
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DC = Yes |
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Attach |
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DIE = Not Specified |
Die = Not Specified |
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Customer Spec |
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CLGA625T1.27-ISO-B |
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CLGA625T1.27-DC61-B |
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CLGA625T1.27-DC61X |
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Ceramic |
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Cheaper |
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More Expensive |
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Suffix Codes: |
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Organic = FR5 Subsrate, Ceramic= Alumina |
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"DC" = Daisy Chain (SEE DRAWING) |
"ISO"= Isoloated connections "BUS" = All Leads Connected. |
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Lead Free Plating: F = Sn96.5/Ag3.5 |
G = Gold |
Other plating available |
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Pack: "T" = TRAYS |
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. |
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©2003 TopLine. All Rights Reserved. Rev. 2/03 |
67 |
SLP
DEVICE
SLP
MLF
QFN
TM
Part Numbering System
SLP, MLF, QFN, MCC
16 |
M .5 |
NUMBER LEADS
PACKAGING
M = Tubes
T = Trays
E7A = 7” Tape & Reel
X = Small Pack
PITCH (MILS)
.5 = 0.5mm
.65 = 0.65mm
.8 = 0.8mm
Lead
Plating - Option
LEAD PLATING
Blank = Sn85/Pb15
TIN = Sn100
F = Ni-Pd
OPTION
Blank = unspecified DE = Daisy Chain Even ISO = Isolated
68 |
©2003 TopLine. All Rights Reserved. Rev. 2/03 |
TM
Part Numbering System
Substituting SLP, MLF, QFN
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Tube |
SLP16M.5-ISO |
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SLP16M.5-DIE |
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SLP16M.5-DE-D |
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Plating = Sn85/Pb15 |
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Plating = Sn85/Pb15 |
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Plating = Sn85/Pb15 |
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DC = No |
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DC = Yes |
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DC = Yes |
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Pack |
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Die = Yes |
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Die = Not Specified |
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Die = Not Specified |
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No |
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Tray |
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SLP16T.5-ISO |
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SLP16T.5-DIE |
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SLP16T.5-DE-D |
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Lead |
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SLP, MLF |
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Free |
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Application = |
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Application = |
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Application = |
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Temperature Profile |
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General Purpose |
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Continuity Test |
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and Continuity Test |
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Yes
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SLP16M.5-TIN-ISO |
SLP16M.5-TIN-DIE |
SLP16M.5-TIN-DE-D |
Tube
Pack
Plating = TIN (Sn100) |
Plating = TIN (Sn100) |
Plating = TIN (Sn100) |
DC = No |
DC = Yes |
DC = Yes |
Die = Not Specified |
Die = Not Specified |
Die = Yes |
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Tray |
SLP16T.5-TIN-ISO |
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SLP16T.5-TIN-DIE |
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SLP16T.5-TIN-DE-D |
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Cheaper |
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More Expensive |
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Suffix Codes:
"DE" = Daisy Chain "Even" (1-2, 3-4, 5-6, 7-8, etc) "ISO" = Isolated connections "BUS" = All Leads Connected. Lead Free Plating: "TIN" = "T"
Pack: "T" = Tray, "M" = Tube, "E7A" = 7" Reel, "E" = Carrier Tape without Reel, "X" = mini Pack Bags, "D" = Silicon Dummy Die Pitch in mils: .5 = 0.5mm, .65 = 0.65mm, .8 = 0.8mm
©2003 TopLine. All Rights Reserved. Rev. 2/03 |
69 |
TM
Part Numbering System
DIP & CERDIP
DIP |
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16 |
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M |
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3 - Option |
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DEVICE |
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NUMBER LEADS |
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DIP = Plastic (.1” pitch)
SDIP = Skinney Dip (0.07” pitch CERDIP = Ceramic
PACKAGING
M = Tubes
X = Single Pack
PITCH (MILS)
3 = 300mil
6 = 600mil
9 = 900mil
OPTION
Blank = unspecified DE = Daisy Chain Even ISO = isolated
70 |
©2003 TopLine. All Rights Reserved. Rev. 2/03 |