D a t a S h e e t
6.Ordering Information
6.1S29AL032D Standard Products
Spansion standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the elements below.
S29AL032D |
70 |
T |
A |
I |
00 |
0 |
PACKING TYPE
0 = Tray
2= 7” Tape and Reel
3= 13” Tape and Reel
MODEL NUMBER
00 = x8, VCC = 2.7 V to 3.6 V, Uniform sector device
03= x8/x16, VCC = 2.7 V to 3.6 V, Top boot sector device, top two address sectors protected when WP#/ACC = VIL
04= x8/x16, VCC = 2.7 V to 3.6 V, Bottom boot sector device, bottom two address sectors protected when WP#/ACC = VIL
TEMPERATURE RANGE
I |
= Industrial (–40°C to +85°C) |
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N |
= |
Extended (-40°C to +125°C) |
PACKAGE MATERIAL SET |
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A |
= |
Standard |
F |
= |
Pb-Free |
PACKAGE TYPE |
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T |
= Thin Small Outline Package (TSOP) Standard Pinout |
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B |
= Fine-pitch Ball-Grid Array Package |
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SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29AL032D
3.0 Volt-only, 32 Megabit Standard Flash Memory, manufactured using 200 nm process technology
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S29AL032D Valid Combinations |
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Package Type, Material, |
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Speed |
and Temperature |
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Model |
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Device Number |
Option |
Range |
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Number |
Packing Type |
Package Description |
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TAI, TFI |
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00 |
0, 3 (Note 1) |
TS040 (Note 2) |
TSOP |
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70 |
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03, 04 |
TS048 (Note 2) |
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BAI, BFI |
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00, 03, 04 |
0, 2, 3 (Note 1) |
VBN048 (Note 3) |
Fine-Pitch |
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BGA |
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S29AL032D |
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TAI, TFI, TAN, TFN |
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00 |
0, 3 (Note 1) |
TS040 (Note 2) |
TSOP |
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90 |
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03, 04 |
TS048 (Note 2) |
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BAI, BFI, BAN, BFN |
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00, 03, 04 |
0, 2, 3 (Note 1) |
VBN048 (Note 3) |
Fine-Pitch |
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BGA |
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Notes
1.Type 0 is standard. Specify other options as required.
2.TSOP package marking omits packing type designator from ordering part number.
3.BGA package marking omits leading S29 and packing type designator from ordering part number.
January 19, 2007 S29AL032D_00_A9 |
S29AL032D |
11 |