
- •Distinctive Characteristics
- •General Description
- •S29AL032D Features
- •Table of Contents
- •List of Tables
- •List of Figures
- •1. Product Selector Guide
- •2. Block Diagram
- •3. Connection Diagrams
- •3.1 FBGA Package for Model 00 Only
- •3.2 FBGA Package for Models 03, 04 Only
- •3.3 Special Handling Instructions
- •4. Pin Configuration
- •5. Logic Symbols
- •6. Ordering Information
- •6.1 S29AL032D Standard Products
- •6.2 Valid Combinations
- •7. Device Bus Operations
- •7.1 Word/Byte Configuration (Models 03, 04 Only)
- •7.2 Requirements for Reading Array Data
- •7.3 Writing Commands/Command Sequences
- •7.4 Program and Erase Operation Status
- •7.5 Accelerated Program Operation
- •7.6 Standby Mode
- •7.7 Automatic Sleep Mode
- •7.8 RESET#: Hardware Reset Pin
- •7.9 Output Disable Mode
- •7.10 Sector Addresss Tables
- •7.11 Autoselect Mode
- •7.12 Sector Protection/Unprotection
- •7.14 Temporary Sector Unprotect
- •8. Secured Silicon Sector Flash Memory Region
- •9. Hardware Data Protection
- •9.2 Write Pulse “Glitch” Protection
- •9.3 Logical Inhibit
- •10. Common Flash Memory Interface (CFI)
- •11. Command Definitions
- •11.1 Reading Array Data
- •11.2 Reset Command
- •11.3 Autoselect Command Sequence
- •11.5 Word/Byte Program Command Sequence
- •11.6 Unlock Bypass Command Sequence
- •11.7 Chip Erase Command Sequence
- •11.8 Sector Erase Command Sequence
- •11.9 Erase Suspend/Erase Resume Commands
- •11.10 Command Definitions Table
- •12. Write Operation Status
- •12.1 DQ7: Data# Polling
- •12.2 RY/BY#: Ready/Busy#
- •12.3 DQ6: Toggle Bit I
- •12.4 DQ2: Toggle Bit II
- •12.5 Reading Toggle Bits DQ6/DQ2
- •12.6 DQ5: Exceeded Timing Limits
- •12.7 DQ3: Sector Erase Timer
- •13. Absolute Maximum Ratings
- •14. Operating Ranges
- •15. DC Characteristics
- •15.1 Zero Power Flash
- •16. Test Conditions
- •16.1 Key to Switching Waveforms
- •17. AC Characteristics
- •17.1 Read Operations
- •17.2 Hardware Reset (RESET#)
- •17.3 Word/Byte Configuration (BYTE#) (Models 03, 04 Only)
- •17.4 Erase/Program Operations
- •17.5 Temporary Sector Unprotect
- •17.6 Alternate CE# Controlled Erase/Program Operations
- •18. Erase and Programming Performance
- •19. TSOP and BGA Pin Capacitance
- •20. Physical Dimensions
- •21. Revision History

D a t a S h e e t
3.Connection Diagrams
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Figure 3.1 |
40-pin Standard TSOP |
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A16 |
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A17 |
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1 |
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40 |
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A15 |
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2 |
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39 |
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VSS |
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A14 |
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3 |
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38 |
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A20 |
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A13 |
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4 |
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37 |
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A19 |
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A12 |
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5 |
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36 |
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A10 |
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A11 |
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6 |
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35 |
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DQ7 |
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A9 |
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7 |
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34 |
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DQ6 |
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A8 |
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8 |
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33 |
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DQ5 |
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WE# |
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9 |
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32 |
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DQ4 |
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RESET# |
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10 |
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31 |
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VCC |
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ACC |
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11 |
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30 |
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VCC |
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RY/BY# |
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12 |
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29 |
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A21 |
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A18 |
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13 |
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28 |
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DQ3 |
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A7 |
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14 |
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27 |
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DQ2 |
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A6 |
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15 |
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26 |
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DQ1 |
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A5 |
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16 |
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25 |
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DQ0 |
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A4 |
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17 |
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24 |
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OE# |
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A3 |
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18 |
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23 |
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VSS |
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A2 |
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19 |
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22 |
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CE# |
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A1 |
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20 |
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21 |
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A0 |
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Figure 3.2 |
48-pin Standard TSOP |
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A15 |
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1 |
48 |
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A16 |
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A14 |
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2 |
47 |
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BYTE# |
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A13 |
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3 |
46 |
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VSS |
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A12 |
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4 |
45 |
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DQ15/A-1 |
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A11 |
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5 |
44 |
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DQ7 |
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A10 |
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6 |
43 |
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DQ14 |
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A9 |
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7 |
42 |
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DQ6 |
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A8 |
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8 |
41 |
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DQ13 |
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A19 |
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9 |
40 |
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DQ5 |
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A20 |
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10 |
39 |
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DQ12 |
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WE# |
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11 |
38 |
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DQ4 |
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RESET# |
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12 |
37 |
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VCC |
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NC |
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13 |
36 |
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DQ11 |
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WP#/ACC |
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14 |
35 |
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DQ3 |
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RY/BY# |
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15 |
34 |
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DQ10 |
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A18 |
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16 |
33 |
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DQ2 |
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A17 |
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17 |
32 |
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DQ9 |
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A7 |
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31 |
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DQ1 |
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A6 |
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30 |
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DQ8 |
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A5 |
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20 |
29 |
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DQ0 |
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A4 |
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21 |
28 |
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OE# |
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A3 |
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22 |
27 |
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VSS |
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A2 |
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23 |
26 |
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CE# |
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A1 |
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24 |
25 |
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A0 |
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January 19, 2007 S29AL032D_00_A9 |
S29AL032D |
7 |

D a t a S h e e t
3.1FBGA Package for Model 00 Only
Figure 3.3 Model 00 48-ball FBGA (Top View, Balls Facing Down)
A6 |
B6 |
C6 |
D6 |
E6 |
F6 |
G6 |
H6 |
A14 |
A13 |
A15 |
A16 |
A17 |
NC |
A20 |
VSS |
A5 |
B5 |
C5 |
D5 |
E5 |
F5 |
G5 |
H5 |
A9 |
A8 |
A11 |
A12 |
A19 |
A10 |
DQ6 |
DQ7 |
A4 |
B4 |
C4 |
D4 |
E4 |
F4 |
G4 |
H4 |
WE# |
RESET# |
NC |
NC |
DQ5 |
NC |
VCC |
DQ4 |
A3 |
B3 |
C3 |
D3 |
E3 |
F3 |
G3 |
H3 |
RY/BY# |
ACC |
NC |
NC |
DQ2 |
DQ3 |
VCC |
A21 |
A2 |
B2 |
C2 |
D2 |
E2 |
F2 |
G2 |
H2 |
A7 |
A18 |
A6 |
A5 |
DQ0 |
NC |
NC |
DQ1 |
A1 |
B1 |
C1 |
D1 |
E1 |
F1 |
G1 |
H1 |
A3 |
A4 |
A2 |
A1 |
A0 |
CE# |
OE# |
VSS |
8 |
S29AL032D |
S29AL032D_00_A9 January 19, 2007 |

D a t a S h e e t
3.2FBGA Package for Models 03, 04 Only
Figure 3.4 Models 03, 04 48-ball FBGA (Top View, Balls Facing Down)
A6 |
B6 |
C6 |
D6 |
E6 |
F6 |
G6 |
H6 |
A13 |
A12 |
A14 |
A15 |
A16 |
BYTE# |
DQ15/A-1 |
VSS |
A5 |
B5 |
C5 |
D5 |
E5 |
F5 |
G5 |
H5 |
A9 |
A8 |
A10 |
A11 |
DQ7 |
DQ14 |
DQ13 |
DQ6 |
A4 |
B4 |
C4 |
D4 |
E4 |
F4 |
G4 |
H4 |
WE# |
RESET# |
NC |
A19 |
DQ5 |
DQ12 |
VCC |
DQ4 |
A3 |
B3 |
C3 |
D3 |
E3 |
F3 |
G3 |
H3 |
RY/BY# WP#/ACC |
A18 |
A20 |
DQ2 |
DQ10 |
DQ11 |
DQ3 |
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A2 |
B2 |
C2 |
D2 |
E2 |
F2 |
G2 |
H2 |
A7 |
A17 |
A6 |
A5 |
DQ0 |
DQ8 |
DQ9 |
DQ1 |
A1 |
B1 |
C1 |
D1 |
E1 |
F1 |
G1 |
H1 |
A3 |
A4 |
A2 |
A1 |
A0 |
CE# |
OE# |
VSS |
3.3Special Handling Instructions
Special handling is required for Flash Memory products in FBGA packages.
Flash memory devices in FBGA packages may be damaged if exposed to ultrasonic cleaning methods. The package and/or data integrity may be compromised if the package body is exposed to temperatures above 150°C for prolonged periods of time.
January 19, 2007 S29AL032D_00_A9 |
S29AL032D |
9 |